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Principle of plasma-cleaning machine to remove glue

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Published on:

02 Sep,2020

Principle of plasma-cleaning machine to remove glue:

Operation method of plasma adhesive removal:

Insert to film quartz boat and parallel airflow direction, into the vacuum chamber between the two electrodes, vacuum to 1.3 Pa, ventilation with suitable amount of oxygen, maintain reaction chamber pressure in 1.3-13 Pa, and high frequency power, produce lavender glow discharge between the electrodes, by adjusting the power, flow and other process parameters, can get different stripping rate, when the film to the net, glow disappeared.

Influencing factors of plasma degumming:

Frequency selection: The higher the frequency, the easier it is for oxygen to ionize to form plasma. If the frequency is so high that the electron amplitude is shorter than its average free path, the probability of collision with the gas molecule will be reduced and the ionization rate will be reduced. The commonly used frequencies are 13.56MHz and 2.45GHZ.

Power influence: For a certain amount of gas, the power is large, the density of active particles in the plasma is also high, and the removal speed is fast. However, when the power increased to a certain value, the reactive ions consumed by the reaction reached saturation, and no matter how high the power, the removal rate did not increase significantly. Due to the large power and high substrate temperature, the power should be adjusted according to the process needs.

Selection of vacuum degree: if the vacuum degree is improved properly, the average free path of electron motion can be enlarged, so the energy obtained from electric field is large, which is favorable for ionization. In addition, when the oxygen flow is constant, the higher the vacuum degree is, the greater the relative proportion of oxygen will be, and the higher the concentration of active particles will be. However, if the vacuum degree is too high, the concentration of active particles will decrease.

Influence of oxygen flow: high oxygen flow, high density of active particles, and faster degumming rate; However, if the flow rate is too high, the probability of ion recombination will increase, the average free path of electron motion will shorten, and the ionization strength will decrease. If the pressure of the reaction chamber remains unchanged and the flow rate increases, the amount of gas extracted also increases, and the amount of active particles that have not yet participated in the reaction also increases accordingly. Therefore, the effect of the increase of the flow rate on the degumming rate is not obvious.

Principle of plasma-cleaning machine to remove glue

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