0-1250W power adjustable solid state microwave source, pulse, continuous wave mode adjustable, frequency 2.45GHz ± 25Hz, circulating water cooling to reduce the temperature.
Circulator + water load with coupler to absorb reflected microwaves and greatly extend the service life of the microwave source.
The three-pin tuner adjusts the load impedance to improve microwave utilization and reduce reflected wave damage.

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Applications

Plasma cleaning is one of the most common equipment in the semiconductor backchannel process. Microwave plasma cleaner generates oxygen plasma under the excitation of microwave source. This excited oxygen plasma can effectively remove the organic contaminants left on the chip surface during the processing of semiconductor chips, which can seriously affect the yield of the device in bonding package. In the fabrication process of integrated circuits, many kinds of contaminants will be generated, including fluorinated resins, oxides, epoxy resins, solder, photoresist, etc. These contaminants will seriously affect the reliability and qualification rate of integrated circuits and their components. Plasma cleaning as a process technology can effectively remove surface contaminants are widely used in the process of integrated circuits.

Microwave plasma cleaning as a green non-polluting high precision dry cleaning method, can effectively remove surface contaminants, to avoid electrostatic damage. The principle and characteristics of microwave plasma cleaning are briefly described, the composition of the equipment, cleaning process and mode are introduced, and the two key technologies of microwave introduction and matching of microwave source and load are investigated; through process verification, microwave plasma cleaning reduces the contact angle and improves the bonding strength of leads.

- Commodity name: Microwave Plasma Cleaner
- Commodity ID: 微波等离子清洗机
- Plasma产品名称:
- Plasma参数:
0-1250W power adjustable solid state microwave source, pulse, continuous wave mode adjustable, frequency 2.45GHz ± 25Hz, circulating water cooling to reduce the temperature.<br> Circulator + water load with coupler to absorb reflected microwaves and greatly extend the service life of the microwave source.<br> The three-pin tuner adjusts the load impedance to improve microwave utilization and reduce reflected wave damage.

Plasma cleaning is one of the most common equipment in the semiconductor backchannel process. Microwave plasma cleaner generates oxygen plasma under the excitation of microwave source. This excited oxygen plasma can effectively remove the organic contaminants left on the chip surface during the processing of semiconductor chips, which can seriously affect the yield of the device in bonding package. In the fabrication process of integrated circuits, many kinds of contaminants will be generated, including fluorinated resins, oxides, epoxy resins, solder, photoresist, etc. These contaminants will seriously affect the reliability and qualification rate of integrated circuits and their components. Plasma cleaning as a process technology can effectively remove surface contaminants are widely used in the process of integrated circuits.

Microwave plasma cleaning as a green non-polluting high precision dry cleaning method, can effectively remove surface contaminants, to avoid electrostatic damage. The principle and characteristics of microwave plasma cleaning are briefly described, the composition of the equipment, cleaning process and mode are introduced, and the two key technologies of microwave introduction and matching of microwave source and load are investigated; through process verification, microwave plasma cleaning reduces the contact angle and improves the bonding strength of leads.
Key words:
- CRF-APO-500W-W
Plasma cleaning is one of the most common equipment in the semiconductor backchannel process. Microwave plasma cleaner generates oxygen plasma under the excitation of microwave source. This excited oxygen plasma can effectively remove the organic contaminants left on the chip surface during the processing of semiconductor chips, which can seriously affect the yield of the device in bonding package. In the fabrication process of integrated circuits, many kinds of contaminants will be generated, including fluorinated resins, oxides, epoxy resins, solder, photoresist, etc. These contaminants will seriously affect the reliability and qualification rate of integrated circuits and their components. Plasma cleaning as a process technology can effectively remove surface contaminants are widely used in the process of integrated circuits.

Microwave plasma cleaning as a green non-polluting high precision dry cleaning method, can effectively remove surface contaminants, to avoid electrostatic damage. The principle and characteristics of microwave plasma cleaning are briefly described, the composition of the equipment, cleaning process and mode are introduced, and the two key technologies of microwave introduction and matching of microwave source and load are investigated; through process verification, microwave plasma cleaning reduces the contact angle and improves the bonding strength of leads.

Name	Microwave Plasma Cleaner
Equipment power supply	Three-phase 380V/AC, 50/60Hz, 7.2KW
Plasma Microwave Source	2.45GHz，0-1250W
Load cooling method	Circulating water cooling
Circulating water cooling	Two-stage rotary lobe pump + Roots pump
Equipment control mode	PLC+PC
Vacuum Detection	Pirani type vacuum gauge
Process Gases	2-channel gas selectable (CF4,SF6,O2,Cl2,BCI2 etc.)
Gas flow	MFC/0-500sccm，Two gas options available
Chamber volume	110L
Processing efficiency	Simultaneous placement of 8 rack-type cassettes
Touch Screen	Touch Screen
Dimension	1400mm770mm1660mm

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- Commodity name: Microwave Plasma Cleaner
- Commodity ID: 微波等离子清洗机
- Plasma产品名称:
- Plasma参数:
0-1250W power adjustable solid state microwave source, pulse, continuous wave mode adjustable, frequency 2.45GHz ± 25Hz, circulating water cooling to reduce the temperature.<br> Circulator + water load with coupler to absorb reflected microwaves and greatly extend the service life of the microwave source.<br> The three-pin tuner adjusts the load impedance to improve microwave utilization and reduce reflected wave damage.

Plasma cleaning is one of the most common equipment in the semiconductor backchannel process. Microwave plasma cleaner generates oxygen plasma under the excitation of microwave source. This excited oxygen plasma can effectively remove the organic contaminants left on the chip surface during the processing of semiconductor chips, which can seriously affect the yield of the device in bonding package. In the fabrication process of integrated circuits, many kinds of contaminants will be generated, including fluorinated resins, oxides, epoxy resins, solder, photoresist, etc. These contaminants will seriously affect the reliability and qualification rate of integrated circuits and their components. Plasma cleaning as a process technology can effectively remove surface contaminants are widely used in the process of integrated circuits.

Microwave plasma cleaning as a green non-polluting high precision dry cleaning method, can effectively remove surface contaminants, to avoid electrostatic damage. The principle and characteristics of microwave plasma cleaning are briefly described, the composition of the equipment, cleaning process and mode are introduced, and the two key technologies of microwave introduction and matching of microwave source and load are investigated; through process verification, microwave plasma cleaning reduces the contact angle and improves the bonding strength of leads.
Key words:
- CRF-APO-500W-W
Plasma cleaning is one of the most common equipment in the semiconductor backchannel process. Microwave plasma cleaner generates oxygen plasma under the excitation of microwave source. This excited oxygen plasma can effectively remove the organic contaminants left on the chip surface during the processing of semiconductor chips, which can seriously affect the yield of the device in bonding package. In the fabrication process of integrated circuits, many kinds of contaminants will be generated, including fluorinated resins, oxides, epoxy resins, solder, photoresist, etc. These contaminants will seriously affect the reliability and qualification rate of integrated circuits and their components. Plasma cleaning as a process technology can effectively remove surface contaminants are widely used in the process of integrated circuits.

Microwave plasma cleaning as a green non-polluting high precision dry cleaning method, can effectively remove surface contaminants, to avoid electrostatic damage. The principle and characteristics of microwave plasma cleaning are briefly described, the composition of the equipment, cleaning process and mode are introduced, and the two key technologies of microwave introduction and matching of microwave source and load are investigated; through process verification, microwave plasma cleaning reduces the contact angle and improves the bonding strength of leads.

Name	Microwave Plasma Cleaner
Equipment power supply	Three-phase 380V/AC, 50/60Hz, 7.2KW
Plasma Microwave Source	2.45GHz，0-1250W
Load cooling method	Circulating water cooling
Circulating water cooling	Two-stage rotary lobe pump + Roots pump
Equipment control mode	PLC+PC
Vacuum Detection	Pirani type vacuum gauge
Process Gases	2-channel gas selectable (CF4,SF6,O2,Cl2,BCI2 etc.)
Gas flow	MFC/0-500sccm，Two gas options available
Chamber volume	110L
Processing efficiency	Simultaneous placement of 8 rack-type cassettes
Touch Screen	Touch Screen
Dimension	1400mm770mm1660mm

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Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.

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