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Fabric printing and dyeing industry

Fabric printing and dyeing industry

It improves the added value of fabrics and has significant effects on fabric antistatic properties, anti-pilling properties, easy stain removal and water and oil repellency. At the same time plasma treatment and other finishing agents used in combination, can improve the effectiveness of finishing agents and functional finishing effect.

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Consumer Electronics Industry

Consumer Electronics Industry

1、plasma plasma cleaning machine can be used to clean Wafer and remove surface photoresist. With a high degree of uniformity, stable etching rate. 2, the variety of cell phones, the appearance is more colorful and diverse, its bright colors, Logo eye-catching, but people who use cell phones know that after a period of time, the phone's shell is easy to lose paint, and even Logo has become blurred, seriously affecting the appearance of cell phone image. Well-known cell phone brand manufacturers in order to find a solution to these problems, had used chemicals to treat the plastic shell of the phone, its printing bonding effect has improved, but this is to reduce the hardness of the phone shell at the cost of seeking a better solution, plasma technology stands out. Plasma surface treatment technology can not only clean the shell in the injection molding left oil, plasma treatment machine can activate the surface of the plastic shell, enhance its printing, coating and other bonding effects, so that the shell on the coating and the substrate is very firmly connected, coating effect is very uniform, brighter appearance, and wear resistance is greatly enhanced, long time use will not appear grinding paint phenomenon. 3, the use of plasma for the camera glass, CCD components surface clarity, can effectively remove white spots, red dots and other pollutants. And in the mirror frame frame application, activation frame material, greatly improve the adhesion after dispensing, the use of plasma surface treatment machine manufacturers equipment for mobile phone case activation treatment, for baking paint before the surface activation and eliminate static electricity, can improve the baking paint yield. It is also applied to the pre-treatment of LOGO printing of cell phone case after baking to improve the printing quality.

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LCD display assembly

LCD display assembly

In the LCD display assembly, many processes require plasma treatment technology with, such as glass substrate vapor deposition or sputtering ITO film before the glass surface is very dirty due to cleaning difficulties, can not achieve the cleaning effect, and plasma plasma cleaning machine can effectively remove surface grease, dust and other pollutants, it will achieve the purpose of clean cleaning; plasma glass cleaning machine ITO glass coating photoresist before the plasma Treatment can effectively improve the surface wettability, remove pollutants, reduce the bubble products, remove the residual chemicals after the transfer of graphics. Small plasma cleaning machine in the LCD glass module bonding process can remove overflow glue and other organic class pollutants, polarizers, anti-fingerprint film and other lamination before the surface cleaning and activation. 2、LCD display hot pressing Displays in digital gauges, radios, car computers, cell phones and laptops are often covered with a flexible film or conductive rubber by using a heat-press technique. This film forms the flexible connection between the circuit board and the display panel formed by two thin layers of glass panels. In the production process, due to fingerprints, oxides, organic contaminants and various cross-contaminants, can significantly affect the quality of the process associated with the production process, reducing the adhesion between the film and the display panel. The small plasma cleaner cleaning pretreatment process thoroughly removes organic contaminants and other impurities from the glass surface and improves the bonding force, thus improving the bonding quality and reducing the scrap rate. This also applies to processes that use hot-press welding and precision soldering.

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IC semiconductor field

IC semiconductor field

With the rapid development of smart phones, people's requirements for cell phone camera pixels are getting higher and higher, nowadays the pixels of cell phone camera modules made by traditional CSP packaging process can no longer meet people's needs, while cell phone camera modules made by COB/COG/COF packaging process have been used in a large number of megapixel cell phones, but their manufacturing yields are often only about 85% due to their process characteristics.

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FPC/PCB field

FPC/PCB field

FPC printed circuit board (soft board) whose main material is composed of polyimide resin, due to the heat generated when drilling, it is very easy to make a lot of resin residue in the hole, resulting in PTH when the hole wall copper plating layer and the inner layer of the line connection is poor, and even produce fracture open circuit phenomenon, the current industry mostly use resin bulking agent and potassium permanganate potion to remove the hole slag process. As potassium permanganate has great destructive effect on the performance of polyimide wax. The use of low-temperature plasma treatment can effectively remove the residual glue of the hole wall, to achieve the effect of cleaning, activation and uniform etching, which is conducive to the connection between the inner layer of the line and the copper plating layer of the hole wall and enhance the bonding force.

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Heavy Industry

Heavy Industry

Applied to battery diaphragm treatment to improve alkali absorption and hydrophilicity. Battery separators are all polymer materials with weak polarity. Molecules are difficult to pass through, and the use of plasma treatment improves the surface properties of the material and greatly enhances the battery performance.

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Medical Industry

Medical Industry

Catheters have brought a boon to patients requiring indwelling catheterization and are being used more and more widely in clinical practice, but with their increased use, difficult catheter removal is becoming more common. Especially for catheters left in place for a long time, sometimes the aging of the rubber can cause obstruction of the balloon lumen, which may lead to serious complications when forcibly removed. In order to prevent the aging of the silicone rubber contact surface with the human body, oxygen plasma treatment of its surface is required. Scanning electron microscopy (SEM), infrared spectroscopy (FTIR-ATR) and surface contact angle were used to study the changes in surface structure, properties and chemical composition of natural latex catheters before and after oxygen plasma treatment, and the results showed that the surface of catheters treated with low-temperature plasma equipment company oxygen plasma became slippery, the surface contact angle was reduced from 84 degrees to 67 degrees, and no harmful groups were generated on the surface, indicating that oxygen plasma treatment is an effective plasma surface treatment method. In addition, a large plasma cleaner or small treatment of silicone rubber to increase its surface activity, and then coated on the surface of a layer of hydrophobic material is not easy to age, the effect is also very good. 　 2. Intravenous infusion set The infusion needle at the end of the infusion set will be detached from the needle holder and the syringe when it is pulled out in the process of use, once detached, blood will flow out with the syringe, which will pose a serious threat to the patient if not handled correctly in time. In order to ensure that such accidents occur, surface treatment of the needle holder is very necessary. Needle holder holes are very small and difficult to handle by ordinary methods, while plasma is a gas in an ionic state and can be effective for tiny holes. The application of large plasma cleaning machine plasma to its surface activation treatment, can improve the surface activity, improve its bond strength with the needle tube, to ensure that they do not detach from each other. The picture below shows a needle holder undergoing plasma surface cleaning and activation treatment in a plasma cleaner. 3. Biological culture plate The cleaning equipment of True Peak Smart Low Temperature Plasma Equipment Company can be used to improve the hydrophilicity of the culture plate surface, graft specific chemical groups, and sterilize the surface.

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Semiconductor chip industry

Semiconductor chip industry

Chip or silicon wafer and packaging substrate bonding, often two different nature of the material, the surface of the material is usually presented as hydrophobic and Sui characteristics, its surface bonding performance is poor, the bonding process interface is easy to produce voids, to seal the package after the chip or wafer brings great potential problems, silicon wafer cleaning machine industrial plasma cleaning machine can be the chip and packaging substrate surface plasma treatment can effectively increase its Surface activity, plasma treatment machine greatly improve the mobility of the bonding epoxy resin on its surface, improve the bonding wettability of the chip and the packaging substrate, reduce the delamination of the chip and the substrate, improve the thermal conductivity, improve the reliability and stability of IC packaging, and increase the life of the product.

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Automotive Manufacturing

Automotive Manufacturing

With the development of the economy, consumers are demanding higher and higher performance of automobiles, such as the appearance, operational comfort reliability, and durability of use of automobiles. In order to meet the requirements of consumers, various automobile manufacturers pay more attention to the optimization and improvement of details when producing automobiles, such as conducting

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New Energy Industry

New Energy Industry

The silicon wafer surface is very shiny and reflects off a large amount of sunlight. Therefore, it is essential to deposit a protective film of silicon nitride with a very low reflection coefficient on it. By using plasma technology with plasma equipment, the silicon wafer surface can be activated and its surface adhesion can be greatly improved.

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