Cheng Feng 20 years focus on plasma cleaning
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Address: 1303, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.
CRF-APO-R＆D-DXX-021
Compact size of the equipment, easy to carry and move, saving space for customers;
In-Line installation in customer's equipment production line to reduce customer's input cost.
Long service life, low maintenance and repair costs, easy for customers to control costs.
Applications
Equipment parameters
Applications
Plasma treatment equipment is mainly used in the electronics industry for cell phone case printing, coating, dispensing and other pre-treatment, cell phone screen surface treatment; connector surface cleaning; general industry screen printing, transfer printing pre-treatment, etc.
1、Ashing surface organic layer:
Material surface will suffer chemical bombardment; subject to high temperature state pollutants will evaporate out; environmental pollutants are broken under the impact of higher energy positive ions, and subsequently released.
Because plasma only through a few nanometers per second thin, and therefore the pollution layer can not be too thick.
2, plasma cleaning equipment to remove metal oxides:
Oxide and treatment of the gas to produce chemical changes, this process with hydrogen or hydrogen and argon mixture to carry out. Sometimes also choose two-step production processing technology, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.
3, plasma etching for soldering:
In general conditions, printed circuit boards are treated with organic chemical flux before soldering. This chemical needs to be removed by plasma method after soldering, otherwise it will produce problems such as corrosion.
4, plasma debonding, bonding:
Plating process, bonding, welding work in the residue will weaken the excellent bonding, this residue can be selectively removed with the plasma method. In addition, air oxidation which will also harm the quality of bonding, is also the need for plasma cleaning.
-
- Commodity name: CRF-APO-R＆D-DXX-021
- Commodity ID: CRF-APO-R＆D-DXX-021
- Plasma产品名称: Plasma
- Plasma参数:
Various types of plasma guns and nozzles are available for different applications to meet different products and processing environments；<br> Compact size of the equipment, easy to carry and move, saving space for customers;<br> In-Line installation in customer's equipment production line to reduce customer's input cost.<br> Long service life, low maintenance and repair costs, easy for customers to control costs.
Plasma treatment equipment is mainly used in the electronics industry for cell phone case printing, coating, dispensing and other pre-treatment, cell phone screen surface treatment; connector surface cleaning; general industry screen printing, transfer printing pre-treatment, etc.
1、Ashing surface organic layer:
Material surface will suffer chemical bombardment; subject to high temperature state pollutants will evaporate out; environmental pollutants are broken under the impact of higher energy positive ions, and subsequently released.
Because plasma only through a few nanometers per second thin, and therefore the pollution layer can not be too thick.
2, plasma cleaning equipment to remove metal oxides:
Oxide and treatment of the gas to produce chemical changes, this process with hydrogen or hydrogen and argon mixture to carry out. Sometimes also choose two-step production processing technology, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.
3, plasma etching for soldering:
In general conditions, printed circuit boards are treated with organic chemical flux before soldering. This chemical needs to be removed by plasma method after soldering, otherwise it will produce problems such as corrosion.
4, plasma debonding, bonding:
Plating process, bonding, welding work in the residue will weaken the excellent bonding, this residue can be selectively removed with the plasma method. In addition, air oxidation which will also harm the quality of bonding, is also the need for plasma cleaning.
Key words:- CRF-APO-R＆D-DXX-021
-
Plasma treatment equipment is mainly used in the electronics industry for cell phone case printing, coating, dispensing and other pre-treatment, cell phone screen surface treatment; connector surface cleaning; general industry screen printing, transfer printing pre-treatment, etc.
1、Ashing surface organic layer:
Material surface will suffer chemical bombardment; subject to high temperature state pollutants will evaporate out; environmental pollutants are broken under the impact of higher energy positive ions, and subsequently released.
Because plasma only through a few nanometers per second thin, and therefore the pollution layer can not be too thick.
2, plasma cleaning equipment to remove metal oxides:
Oxide and treatment of the gas to produce chemical changes, this process with hydrogen or hydrogen and argon mixture to carry out. Sometimes also choose two-step production processing technology, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.
3, plasma etching for soldering:
In general conditions, printed circuit boards are treated with organic chemical flux before soldering. This chemical needs to be removed by plasma method after soldering, otherwise it will produce problems such as corrosion.
4, plasma debonding, bonding:
Plating process, bonding, welding work in the residue will weaken the excellent bonding, this residue can be selectively removed with the plasma method. In addition, air oxidation which will also harm the quality of bonding, is also the need for plasma cleaning.
-
Name
Jet type plasma processing system
Plasma power model
CRF-APO-R＆D-DXX-021
Direct jet type plasma spray gun modet
Direct injection type：DXX（Option:2mm-6mm）
Power supply
220V/AC,50/60Hz
Power
1000W/25KHz（Option）
Power factor
0.8
Processing height
5-15mm
Processing width
Direct jet type：1-6mm（Option）
-
- Commodity name: CRF-APO-R＆D-DXX-021
- Commodity ID: CRF-APO-R＆D-DXX-021
- Plasma产品名称: Plasma
- Plasma参数:
Various types of plasma guns and nozzles are available for different applications to meet different products and processing environments；<br> Compact size of the equipment, easy to carry and move, saving space for customers;<br> In-Line installation in customer's equipment production line to reduce customer's input cost.<br> Long service life, low maintenance and repair costs, easy for customers to control costs.
Plasma treatment equipment is mainly used in the electronics industry for cell phone case printing, coating, dispensing and other pre-treatment, cell phone screen surface treatment; connector surface cleaning; general industry screen printing, transfer printing pre-treatment, etc.
1、Ashing surface organic layer:
Material surface will suffer chemical bombardment; subject to high temperature state pollutants will evaporate out; environmental pollutants are broken under the impact of higher energy positive ions, and subsequently released.
Because plasma only through a few nanometers per second thin, and therefore the pollution layer can not be too thick.
2, plasma cleaning equipment to remove metal oxides:
Oxide and treatment of the gas to produce chemical changes, this process with hydrogen or hydrogen and argon mixture to carry out. Sometimes also choose two-step production processing technology, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.
3, plasma etching for soldering:
In general conditions, printed circuit boards are treated with organic chemical flux before soldering. This chemical needs to be removed by plasma method after soldering, otherwise it will produce problems such as corrosion.
4, plasma debonding, bonding:
Plating process, bonding, welding work in the residue will weaken the excellent bonding, this residue can be selectively removed with the plasma method. In addition, air oxidation which will also harm the quality of bonding, is also the need for plasma cleaning.
Key words:- CRF-APO-R＆D-DXX-021
-
Plasma treatment equipment is mainly used in the electronics industry for cell phone case printing, coating, dispensing and other pre-treatment, cell phone screen surface treatment; connector surface cleaning; general industry screen printing, transfer printing pre-treatment, etc.
1、Ashing surface organic layer:
Material surface will suffer chemical bombardment; subject to high temperature state pollutants will evaporate out; environmental pollutants are broken under the impact of higher energy positive ions, and subsequently released.
Because plasma only through a few nanometers per second thin, and therefore the pollution layer can not be too thick.
2, plasma cleaning equipment to remove metal oxides:
Oxide and treatment of the gas to produce chemical changes, this process with hydrogen or hydrogen and argon mixture to carry out. Sometimes also choose two-step production processing technology, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.
3, plasma etching for soldering:
In general conditions, printed circuit boards are treated with organic chemical flux before soldering. This chemical needs to be removed by plasma method after soldering, otherwise it will produce problems such as corrosion.
4, plasma debonding, bonding:
Plating process, bonding, welding work in the residue will weaken the excellent bonding, this residue can be selectively removed with the plasma method. In addition, air oxidation which will also harm the quality of bonding, is also the need for plasma cleaning.
-
Name
Jet type plasma processing system
Plasma power model
CRF-APO-R＆D-DXX-021
Direct jet type plasma spray gun modet
Direct injection type：DXX（Option:2mm-6mm）
Power supply
220V/AC,50/60Hz
Power
1000W/25KHz（Option）
Power factor
0.8
Processing height
5-15mm
Processing width
Direct jet type：1-6mm（Option）
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Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.
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