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CRF-VPO-4L-S
The capacity and number of layers of the cavity of the equipment can be customized according to customer requirements to meet customer needs; low maintenance and repair costs to facilitate customer cost control;
High precision, fast response, good maneuverability and compatibility, perfect functions and professional technical support.
Applications
Equipment parameters
Applications
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning, de-drilling dirt, soft board, soft and hard combination board surface cleaning, de-drilling dirt, soft board reinforcement before activation. Semiconductor IC field: COB, COG, COF, ACF process, for cleaning before hitting the line, soldering; silicone, plastic, polymer field silicone, plastic, polymer plasma surface roughening, etching, activation.
Vacuum plasma cleaner system manufacturers are the use of gas ionization to form the plasma on the surface treatment of the product workpiece, whether it is cleaning or surface activation, in order to better achieve quality processing results, for different products need to select different processing gases, plasma cleaning machine common processing gases are oxygen, argon, nitrogen, air compression, carbon dioxide, hydrogen, carbon tetrafluoride etc.
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- Commodity name: CRF-VPO-4L-S
- Commodity ID: CRF-VPO-4L-S[0]
- Plasma产品名称:
- Plasma参数:
Super processing space to enhance processing capacity, PLC + touch screen control system for precise control of equipment operation;<br> The capacity and number of layers of the cavity of the equipment can be customized according to customer requirements to meet customer needs; low maintenance and repair costs to facilitate customer cost control;<br> High precision, fast response, good maneuverability and compatibility, perfect functions and professional technical support.
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning, de-drilling dirt, soft board, soft and hard combination board surface cleaning, de-drilling dirt, soft board reinforcement before activation. Semiconductor IC field: COB, COG, COF, ACF process, for cleaning before hitting the line, soldering; silicone, plastic, polymer field silicone, plastic, polymer plasma surface roughening, etching, activation.
Vacuum plasma cleaner system manufacturers are the use of gas ionization to form the plasma on the surface treatment of the product workpiece, whether it is cleaning or surface activation, in order to better achieve quality processing results, for different products need to select different processing gases, plasma cleaning machine common processing gases are oxygen, argon, nitrogen, air compression, carbon dioxide, hydrogen, carbon tetrafluoride etc.
Key words:- CRF-VPO-4L-S
-
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft and hard board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Silica gel, plastic, polymer field of silica gel, plastic, polymer plasma surface roughening, etching, activation.
Vacuum plasma cleaning machine system manufacturers are using gas ionization to form plasma to the product workpiece surface treatment, whether it is cleaning or surface activation, in order to better achieve high-quality treatment results, for different products need to select different processing process gases, plasma cleaning machine common processing process gases are oxygen, argon, nitrogen, air compression, carbon dioxide, hydrogen, carbon tetrafluoride and so on.
-
Name
Vacuum plasma treatment system
Model
CRF-VPO-4L-S
Control system
PLC+ touch screen
Power supply
380V/AC,50/60Hz,3kw
Intermediate frequency power supply power (RF Power)
1000W/40KHz/13.56MHz
Volume
30L(Option)
Electrode of plies
4(Option)
Effective treatment area (Area)
200(L)*150(W)(Option)
Gas channel (Gas)
Two working gases are optional: Ar, N2, CF4, O2
-
- Commodity name: CRF-VPO-4L-S
- Commodity ID: CRF-VPO-4L-S[0]
- Plasma产品名称:
- Plasma参数:
Super processing space to enhance processing capacity, PLC + touch screen control system for precise control of equipment operation;<br> The capacity and number of layers of the cavity of the equipment can be customized according to customer requirements to meet customer needs; low maintenance and repair costs to facilitate customer cost control;<br> High precision, fast response, good maneuverability and compatibility, perfect functions and professional technical support.
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning, de-drilling dirt, soft board, soft and hard combination board surface cleaning, de-drilling dirt, soft board reinforcement before activation. Semiconductor IC field: COB, COG, COF, ACF process, for cleaning before hitting the line, soldering; silicone, plastic, polymer field silicone, plastic, polymer plasma surface roughening, etching, activation.
Vacuum plasma cleaner system manufacturers are the use of gas ionization to form the plasma on the surface treatment of the product workpiece, whether it is cleaning or surface activation, in order to better achieve quality processing results, for different products need to select different processing gases, plasma cleaning machine common processing gases are oxygen, argon, nitrogen, air compression, carbon dioxide, hydrogen, carbon tetrafluoride etc.
Key words:- CRF-VPO-4L-S
-
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft and hard board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Silica gel, plastic, polymer field of silica gel, plastic, polymer plasma surface roughening, etching, activation.
Vacuum plasma cleaning machine system manufacturers are using gas ionization to form plasma to the product workpiece surface treatment, whether it is cleaning or surface activation, in order to better achieve high-quality treatment results, for different products need to select different processing process gases, plasma cleaning machine common processing process gases are oxygen, argon, nitrogen, air compression, carbon dioxide, hydrogen, carbon tetrafluoride and so on.
-
Name
Vacuum plasma treatment system
Model
CRF-VPO-4L-S
Control system
PLC+ touch screen
Power supply
380V/AC,50/60Hz,3kw
Intermediate frequency power supply power (RF Power)
1000W/40KHz/13.56MHz
Volume
30L(Option)
Electrode of plies
4(Option)
Effective treatment area (Area)
200(L)*150(W)(Option)
Gas channel (Gas)
Two working gases are optional: Ar, N2, CF4, O2
Our Partners
Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.












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