National consulting hotline:
Free proofing is available for consultation by appointment

Technical Support
Contact Us


Service Hotline
13632675935
CRF
Address: 1302, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.
(1) Plasma polymerization
By controlling the process conditions, the gas of organic compounds (CF4, CH4, C2H6, etc.) is formed into a plasma state so that it forms a thin polymer coating on the surface of the material. The plasma activates the material surface, generates free radicals and introduces reactive groups, and then modifies the material surface by forming many branched chains with grafting to form a new surface layer.
(2)What gas is used for plasma cleaning machine
① plasma cleaning machine commonly used process gases are oxygen, argon, nitrogen, compressed air, carbon dioxide, hydrogen, carbon tetrafluoride, etc.. ② plasma cleaning machine is to ionize the gas to produce plasma on the surface treatment of the workpiece, whether for cleaning or surface activation, in order to achieve the best treatment effect we will choose a different process gas.
(3) the role of plasma cleaning
Plasma which includes atoms, molecules, ions, electrons, active groups, excited state atoms, activated molecules and free radicals, the activity of these particles is very high, its energy is enough to destroy almost all the chemical bonds in any exposed surface to cause chemical reactions, so that some chemical bonds are opened and combined with oxygen atoms and other highly reactive substances, making the surface of the material hydrophilic greatly improved in bonding, bonding, printing, coating, encapsulation, bonding, printing, coating, encapsulation and other processes to make the product more reliable and better yields.
(4) How does the plasma cleaner clean the product
Using plasma high energy to destroy organic macromolecular bonds such as oil and dirt, and then use oxygen ions and other active ions to carry out new chemical reactions, generating gaseous small molecules, such as carbon dioxide, water gas and other gaseous substances are pumped away by the vacuum pump, so as to achieve the molecular level of cleaning of the material surface.