In the process of industrial production, super-purity cleaning of electronic components, optical components, mechanical parts, polymer materials and other surfaces to remove extremely small dirt particles is often a very critical process.
Most of the traditional cleaning methods are wet cleaning. With the continuous development of modern high technology, this cleaning method has exposed many defects, that is, the residual cleaning agent and tiny particles will adhere to the surface after cleaning and drying, which cannot meet the requirements of modern high technology.
The low-temperature plasma cleaning process actually removes the pollutants from the treated workpiece and takes them away under the impact of plasma reaction. Generally, the treatment cycle only takes a few minutes to remove the surface smudge-free and zero pollution.
Because gas penetrates far more into tiny crevices than liquid, complex objects can also be thoroughly cleaned.
The decisive factor in the plasma cleaning process is that no matter in the atmospheric pressure state or vacuum state, even under the greenhouse conditions, the plasma will react with organic pollutants, decompose into molecules such as water and carbon dioxide, and have good volatilization.
Advantages of plasma cleaning:
The treatment temperature is low and has wide suitability.
Clean thoroughly without residue.
Process control, good consistency, support downstream drying process.
Low cost of use and waste disposal.
Environmental protection technology, no harm to the operator's body.
Plasma application Industry:
Science software, semiconductor, microelectronics, printed circuit board, precision machinery, medical polymer, hardware processing, clock manufacturing, optical fiber cable, photovoltaic new energy, glassware.