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The importance of PCB plasma equipment surface plasma treatment technology in PCB applications

Keywords:

plasma,the,and,of,wafer,to,is,adhesion,pcb

Published on:

16 May,2021

        A variety of dedicated surface PCB circuit boards can be used in plasma products. Plasma equipment applications include improving adhesion and surface activation. In the pre-processing of the PCB board, the PCB plasma equipment can change the dyne value and contact angle to achieve the desired effect. Surface treatment technology of PCB plasma equipment
        The vacuum plasma equipment uses a vacuum chamber, so that there is no conductive channel between the tape and the PCB circuit board skeleton area, and there is a free conductive channel in the PCB circuit board skeleton area. The ring material is made of insulating non-conductive material, and the conductive path between aluminum plasma and aluminum is limited to the PCB circuit board area. There is a gap of 2mm between the toroidal tape and the frame piece. Since there is no plasma generation or at the bottom of the wafer and tape, undercuts and delamination are minimized, and there will be no sputtering or tape deposition on the wafer surface. According to our method, the gap between the ring edge and the lower electrode is reduced to obtain an extended area of ​​2mm or less, so that you can get a secondary plasma like other systems instead of a primary plasma.

Plasma equipment surface
        The retention coating improves the adhesion of the retention coating, and it is usually difficult to provide adequate protection to certain materials that meet strict environmental requirements (such as TPU). Plasma treatment technology improves the wettability of the surface and improves the adhesion of the conformal coating to high-performance solder mask materials and other difficult-to-attach substrates. In addition, the use of plasma equipment to process the PCB improves the flow properties of the conformal coating material. Other challenges for conformal layer adhesion include contaminants such as mold release compounds and flux residues. Plasma treatment is an effective way to clean circuit boards. Plasma treatment can remove contaminants without damaging the substrate. It can provide a single-stage plasma treatment plasma processing system-including etch back and cleaning-up to 30 panels per cycle (panel size is 500x813mm/20x32 inches), which can be used in the manufacturing process of flexible electronic PCBs and substrates Achieve a speed of 200 units/hour.
        Plasma equipment is used for PCB circuit board processing and is ideal for wafer-level and 3D packaging. Applications of plasma include dust removal, ashing/photoresist/polymer stripping, dielectric etching, wafer bumping, organic contaminant removal, and wafer demolding.
        Plasma systems are ideal for typical back-end packaging steps before wafer processing, as well as wafer fan-out, wafer-level packaging, 3D packaging, flip-chip and traditional packaging. The cavity design and control structure can achieve a short plasma cycle time and low overhead, which can ensure the throughput of your production process and reduce costs. The plasma cleaner supports automatic processing and handling of round or square wafer/substrate sizes from 75mm to 300mm in diameter. In addition, depending on the thickness of the wafer, it can be processed with or without a carrier sheet. The plasma chamber design provides excellent etching uniformity and process repeatability. The main plasma surface treatment technology applications include various etching, ashing and dust removal steps. Other plasma processes include decontamination, surface roughening, improved wettability, and enhanced bonding and adhesion strength, photoresist/polymer peeling, dielectric corrosion, wafer bumping, organic contaminant removal, and wafer demolding. Wafer cleaning-before the wafer collides, the plasma equipment will remove pollutants, organic pollutants, fluorides and other halogen pollutants, as well as metals and metal oxides. Plasma also improves the adhesion of the film and cleans the metal bonding pads.
        The plasma system of the circuit board plasma equipment removes silicon wafers, is used to redistribute, strip/etch the pattern dielectric layer of the photoresist, enhance the adhesion of the wafer application material, remove the mold/epoxy resin applied to the excess wafer, and enhance the gold The adhesion of the solder bumps reduces the damage to the chip, improves the adhesion of the spin-coated film, and cleans the aluminum bonding pad.

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