图片名称

Hydrogen plasma surface treatment process plasma cleaning BAG to improve the solderability of BGA

Keywords:

plasma,the,of,and,bga,to,solder,is,hydrogen

Published on:

15 May,2021

        The solder balls of BGA devices are often very easy to oxidize, and the soldered BGA solder joints are not only inferior in appearance, but their electrical and thermal properties are also greatly reduced. The plasma surface treatment process can effectively remove the oxide on the surface of the BGA solder ball. The method has simple process, significant effect and high efficiency, and is an effective method for removing oxides of BGA components and other surface-mounted components.

Plasma surface treatment process
        To achieve good reliability in the soldering of BGA devices, the solderability of the BGA solder balls is very important. However, due to various reasons, such as long storage period, exposure to the atmosphere, high baking temperature, and some corrosive industrial waste gas in the atmosphere, it is easy to cause oxidation and corrosion of BGA solder balls.
        The oxidative corrosion of the solder ball makes the solder ball look dull, gray, dark and black, making it impossible for the vision system of the automated placement machine to recognize it, making it impossible to carry out large-scale automated production. More importantly, the poor solderability of the solder balls will bring about a series of problems, such as welding voids, false soldering, and desoldering. These soldering defects will cause the reliability and long-term working life of the BGA. Serious impact.
        Methods to improve the solderability of BGA solder balls Once the BGA solder balls are oxidized and corroded, appropriate treatment measures must be taken to restore their solderability. Common methods are:
        (1) Coat active flux on the solder balls, and then re-melt them. In this way, the BGA has to undergo a high temperature melting, which may cause thermal damage to the BGA. In addition, an additional cleaning process must be added, because active flux is used, and all flux residues must be completely removed, which increases the complexity of the process.
        (2) Remove the solder balls of the BGA and replant the balls. The ball planting process is complicated, difficult, time-consuming, and needs to heat the BGA twice. Two times of heating may cause adverse effects on the internal circuit of the BGA. And the work efficiency is low, not suitable for mass production. In addition, the success rate of planting the ball is not very high.
        (3) Use high-temperature hydrogen for reduction. Hydrogen has a strong reducing ability and can effectively remove the oxide corrosion layer on the surface of the solder ball. But high temperature is likely to damage BGA devices.
        (4) Use reducing acid gas for reduction, but it also requires a high temperature of about 220 degrees Celsius, and formic acid is corrosive to a certain extent.
        (5) The method of pickling is adopted. Using a relatively dilute acid, such as dilute hydrochloric acid and citric acid with a volume fraction of about 10%, can remove the oxide on the BGA solder ball, but the acid solution is likely to corrode the BGA device.
        (6) Of course, it can be discarded. But many BGA devices are very expensive, and discarding them will cause huge losses.
        None of the above methods are very good. Now we introduce a novel method to treat BGA devices with hydrogen plasma in the plasma surface treatment process, which can greatly improve the reliability of BGA devices, and the process is simple, effective and efficient. high.

Děnglízǐ biǎomiàn chǔlǐ gōngyì BGA qìjiàn de hàn qiú wǎngwǎng dōu fēicháng róngyì yǎnghuà, hànjiē hòu de BGA hàn diǎn bùjǐn wàiguān shàng bùguò guān, qí diàn xìngnéng hé rè xìngnéng yě dà dǎzhékòu. Děnglízǐ biǎomiàn chǔlǐ gōngyì néng yǒuxiào de qùchú BGA hàn qiú biǎomiàn de yǎnghuà wù. Gāi fāngfǎ gōngyì jiǎndān, xiàoguǒ xiǎnzhù, xiàolǜ yě hěn gāo, shì qīngchú BGA yuán qìjiàn hé qítā biǎomiàn tiē zhuāng yuán qìjiàn yǎnghuà wù de yǒuxiào fāngfǎ. Děnglízǐ biǎomiàn chǔlǐ gōngyì BGA qìjiàn hànjiē yào dádào liánghǎo de kěkào xìng,BGA hàn qiú de kě hàn xìng shì fēicháng zhòngyào de. Dànshì yóuyú zhǒngzhǒng yuányīn, bǐrú, cúnchú qīguò zhǎng, bàolù zài dàqì zhòng, hōng kǎo wēndùguò gāo, dàqì zhòng de yīxiē fǔshí xìng de gōngyè fèiqì dōu róngyì zàochéng BGA hàn qiú de yǎnghuà hé fǔshí. Hàn qiú de yǎnghuà fǔshí ràng hàn qiú kàn qǐlái méiyǒu guāngzé, fā huī, fā àn hé fā hēi, shǐ zìdònghuà tiē piàn jī de shìjué xìtǒng wúfǎ shìbié, wúfǎ jìnxíng dà guīmó zìdònghuà shēngchǎn. Gèng zhòngyào de shì, hàn qiú dīliè de kě hàn xìng, jiāng huì dài lái yī xìliè de wèntí, bǐrú hànjiē kōngdòng, xū hàn hé tuō hàn děng yīxiē hànjiē quēxiàn, zhèxiē hànjiē quēxiàn jiāng gěi BGA de kěkào xìng hé chángqí gōngzuò shòumìng zàochéng yán chóng yǐngxiǎng. Tígāo BGA hàn qiú kě hàn xìng de fāngfǎ BGA de hàn qiú yīdàn bèi yǎnghuà fǔshí, jiù bìxū cǎiqǔ shìdàng de chǔlǐ cuòshī lái huīfù tā de kě hàn xìng, chángjiàn de fāngfǎ yǒu: (1) Zài hàn qiú shàng tú fù huóxìng hànjì, ránhòu zài chóngxīn róngróng yīcì. Zhè zhǒng fāngfǎ BGA yào jīnglì yīcì gāowēn róngróng, kěnéng duì BGA zàochéng rè sǔnshāng. Lìngwài, bìxū zēngjiā yīgè éwài de qīngxǐ guòchéng, yīnwèi cǎiyòng de shì huóxìng hànjì, suǒyǒu de hànjì cánliú dū bìxū chèdǐ qīngchú, zhèyàng jiù zēngjiāle gōngyì de fùzá xìng. (2) Bǎ BGA de hàn qiú qùdiào, chóngxīn zhí qiú. Zhí qiú gōngyì fùzá, nándù dà, fèi shícháng, érqiě xūyào gěi BGA jiārè èr cì. Liǎng cì jiārè kěnéng duì BGA de nèibù diànlù zàochéng bùliáng yǐngxiǎng. Érqiě gōngzuò xiàolǜ dī, bùshìhé dà pīliàng shēngchǎn. Lìngwài, zhí qiú de chénggōng lǜ yě bùshì chénggōng lǜ hěn gāo. (3) Cǎiyòng gāowēn qīngqì jìnxíng huányuán. Qīngqì yǒu hěn qiáng de huányuán nénglì, néng yǒuxiào de qùchú hàn qiú biǎomiàn de yǎnghuà fǔshí céng. Dànshì gāowēn hěn yǒu kěnéng sǔnhuài BGA qìjiàn. (4) Lìyòng huányuán xìng de suān qìtǐ jìnxíng huányuán, dànshì tóngyàng yě xūyào 220 shèshìdù zuǒyòu de gāowēn, érqiě yǐ suān hái yǒu yīdìng de fǔshí xìng. (5) Cǎiyòng suān xǐ de bànfǎ. Yòng bǐjiào xī de suān, rú tǐjī fēnshù wèi 10%zuǒyòu de xī yánsuān, níngméng suān jìnxíng suān xǐ, kěyǐ qùdiào BGA hàn qiú shàng de yǎnghuà wù, dànshì suān róngyè róngyì fǔshí BGA qìjiàn. (6) Dāngrán yě kěyǐ qì zhī bùyòng. Dànshì hěnduō BGA qìjiàn fēicháng ángguì, fèiqì jiù huì zàochéng jù'é sǔnshī. Yǐshàng fāngfǎ dōu bù shì hěn hǎo fāngfǎ, xiànzài wǒmen jièshào yī zhǒng xīnyǐng de fāngfǎ, yòng děnglízǐ biǎomiàn chǔlǐ gōngyì zhōng de qīng děnglízǐ tǐ duì BGA qìjiàn jìnxíng chǔlǐ, nénggòu dàdà gǎishàn BGA qìjiàn de kěkào xìng, érqiě gōngyì jiǎndān, xiàoguǒ hǎo, xiàolǜ gāo. Yòng qīng děnglízǐ tǐ qīngchú BGA yǎnghuà wù de yōudiǎn: Yòng qīng děnglízǐ tǐ huányuán BGA hàn qiú shàng de yǎnghuà wù, gōngyì jiǎndān, wúxū gāowēn, duì qìjiàn sǔnshāng xiǎo, wúxū qīngxǐ hé gānzào, érqiě qīngchú xiàoguǒ hǎo, shēngchǎn xiàolǜ yě hěn gāo. BGA hàn qiú yǎnghuà céng fāngmiàn de yùnyòng, kěyǐ dé chū yǐxià jiélùn: (1) Qīng děnglízǐ tǐ de huóxìng bǐ fēnzǐ tài qīng yàoqiáng dé duō, érqiě zài dīwēn zhuàngtài jiù yǒu hěn hǎo de huányuán huóxìng; (2) qīng děnglízǐ tǐ shìdù jiā wēn, kěyǐ dàdà tígāo qīng děnglízǐ tǐ de huányuán huóxìng; (3) qīng děnglízǐ tǐ chǔlǐ kěyǐ gǎishàn BGA hàn diǎn de wàiguān, shǐ hàn diǎn xiǎndé bǎomǎn, yuánrùn hé guāngliàng; (4) qīng děnglízǐ tǐ chǔlǐ BGA hàn qiú shàng de yǎnghuà wù, gōngyì jiǎndān, xiàoguǒ hǎo hé xiàolǜ gāo; (5) qīng děnglízǐ tǐ qùchú yǎnghuà céng de fāngfǎ kěyǐ kuòzhǎn dào suǒyǒu biǎomiàn tiē zhuāng yuán qìjiàn de yǎnghuà wù de qùchú. 展开 1392 / 5000 翻译结果 Plasma surface treatment process
        Advantages of using hydrogen plasma to remove BGA oxide:
        The hydrogen plasma is used to reduce the oxide on the BGA solder ball, the process is simple, no high temperature is required, the device is less damaged, no cleaning and drying are required, and the removal effect is good, and the production efficiency is also high.
        The application of BGA solder ball oxide layer can draw the following conclusions:
        (1) The activity of hydrogen plasma is much stronger than that of molecular hydrogen, and it has good reducing activity at low temperatures;
        (2) Proper heating of the hydrogen plasma can greatly improve the reducing activity of the hydrogen plasma;
        (3) Hydrogen plasma treatment can improve the appearance of BGA solder joints, making the solder joints appear full, round and bright;
        (4) Hydrogen plasma treatment of oxides on BGA solder balls has simple process, good effect and high efficiency;
        (5) The method of hydrogen plasma to remove the oxide layer can be extended to the removal of oxides of all surface mount components.

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