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Plasma cleaning technology research

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Published on:

23 Sep,2020

Plasma cleaning technology research:

Plasma cleaning operation time, optimize organization parameters and adjust the operation mode of transmission organization, thus improving Plasma organization operation efficiency and reducing cleaning cost.

During the production of TFT-LCD module, the main purpose of the pressing zone cleaning is to remove the remaining solid particles and organic substances on the surface of the glass substrate. Solid particles can be removed by brush cleaning and dust-free cloth cleaning, but organic materials require Plasma cleaning. Due to the requirements of the front-end process, there are many organic compounds in the production process, the main common liquid crystal in the liquid crystal irrigation process, UV glue, etc. If these organics cannot be effectively removed, there will be pressing foreign matter, IC pressing migration and other adverse phenomena, resulting in line defects and no picture problems.

1. Plasma cleaning principle

Plasma, also known as Plasma, is the product of ultraviolet fluorescence. Plasma is the fourth state of matter after solid, liquid and gas. A plasma is a gas of positively and negatively charged particles containing neutral gas atoms, molecules and free radicals. Organics are mainly compounds composed of C and O elements. Plasma USES electrode discharge to clean organics, which is mainly aimed at some inert materials with weak activity. This type of material is not easy to be activated by acid or alkali. For the small impurities remaining after cleaning, the kinetic energy generated by the high-speed impact of medium gas molecules can be used to achieve the purpose of removal. After cleaning, the use of water droplets on the surface infiltration to form a droplet Angle, is a good method to detect the surface activity of materials. The surface of the activated material is mainly for the cleaning of hydrocarbons, so the kind of compounds are oleophilic, so the Angle of the water drop Angle test will be larger (70° ~ 100 °); After plasma treatment, ions or active radicals in the plasma react easily with hydrocarbons to generate volatile hydrocarbon synthesis, such as CO, CO2, CH4, CHxOy, etc., so the Angle of water droplets after plasma will be small (10° ~ 30 °).

2. Study on Plasma cleaning technology

In the Plasma cleaning process, as the electrode works under the electric field, the arc root of the electrode front end is consumed seriously. As the cleaning effect directly affects the pressing effect and the electrode cost is high, it is necessary to formulate the electrode replacement cycle. In addition, the Plasma cleaning time is 12.9s, so it is necessary to optimize the running time of the organization and improve production efficiency.

3, conclusion

CRF-plasma studies the service life of the electrode, and tests the Plasma cleaning effect by measuring the droplet Angle, and concludes that the service life of the electrode is 1440h. The time in the Plasma cleaning process is optimized to reduce the time of the Plasma cleaning unit from 12.9s to 8.6s by reducing the waiting time and modifying the transmission mode. Through the study of Plasma cleaning process, it provides a method to solve the parameter setting, improves the utilization rate of equipment and saves the operating cost, which has practical reference significance for reducing the cost and improving the efficiency of key equipment in production.

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