Adopting PFC full-bridge digital plasma power supply, with stable output power, strong anti-interference ability and rapid response;
A wide range of optional plasma guns and nozzles for use in different applications to meet a variety of different products and processing environments;
Compact size of the equipment, easy to carry and move, saving space for customer use;
Can be installed in customer's equipment production line in ln-Line style, reducing customer's input cost；
Long service life and low maintenance and repair costs, facilitating cost control for customers;

Customized Solutions

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Applications

Equipment parameters

Applications

Pre-encapsulation plasma cleaning and activation:

Plasma processor cleaning activity technically has a significant improvement effect on the enhancement of the packaging die bonding characteristics in micro integrated circuit chips of semiconductor materials. Highly reactive plasma uses the organic chemical kinetic energy of free radicals to treat a wide variety of substrate surfaces: solder mask materials, die passivation layers, pad and leadframe surfaces, etc. This eliminates the problem of die delamination and, depending on the plasma applied to the polyvinyl alcohol, there is no electrostatic induction discharge or other potentially harmful adverse effects.

Plasma Etch Packaging:

The de-encapsulation of packaged components such as integrated circuit chips ICs and printed circuit boards pcb allows the internal components to be revealed. Open unpacking equipment can check the die, coupling and its characteristics in the common failure analysis process check. The selective leaching of polymer encapsulation materials is a key basis for component failure analysis, without jeopardizing the consistency of the wire and component layers. The use of plasma cleaning to clean up the package material to remove, plasma etching with high selectivity, will not be affected by the plasma etching process.

Plasma cleaning before soldering:

Plasma processor cleaning is an important process to enhance the cleanliness of pads in IC chips. After plasma cleaning treatment, the shear strength and tensile strength of the ball are significantly enhanced. Ideally, the wire should be maintained electrically welded to the bonding pad when it breaks in the span during the tension test.

- Commodity name: CRF-APO-RP1020-D
- Commodity ID: CRF-APO-RP1020-D[0]
- Plasma产品名称:
- Plasma参数:
Adopting PFC full-bridge digital plasma power supply, with stable output power, strong anti-interference ability and rapid response; A wide range of optional plasma guns and nozzles for use in different applications to meet a variety of different products and processing environments; Compact size of the equipment, easy to carry and move, saving space for customer use; Can be installed in customer's equipment production line in ln-Line style, reducing customer's input cost； Long service life and low maintenance and repair costs, facilitating cost control for customers;

Pre-encapsulation plasma cleaning and activation:

Plasma processor cleaning activity technically has a significant improvement effect on the enhancement of the packaging die bonding characteristics in micro integrated circuit chips of semiconductor materials. Highly reactive plasma uses the organic chemical kinetic energy of free radicals to treat a wide variety of substrate surfaces: solder mask materials, die passivation layers, pad and leadframe surfaces, etc. This eliminates the problem of die delamination and, depending on the plasma applied to the polyvinyl alcohol, there is no electrostatic induction discharge or other potentially harmful adverse effects.

Plasma Etch Packaging:

The de-encapsulation of packaged components such as integrated circuit chips ICs and printed circuit boards pcb allows the internal components to be revealed. Open unpacking equipment can check the die, coupling and its characteristics in the common failure analysis process check. The selective leaching of polymer encapsulation materials is a key basis for component failure analysis, without jeopardizing the consistency of the wire and component layers. The use of plasma cleaning to clean up the package material to remove, plasma etching with high selectivity, will not be affected by the plasma etching process.

Plasma cleaning before soldering:

Plasma processor cleaning is an important process to enhance the cleanliness of pads in IC chips. After plasma cleaning treatment, the shear strength and tensile strength of the ball are significantly enhanced. Ideally, the wire should be maintained electrically welded to the bonding pad when it breaks in the span during the tension test.
Key words:
- CRF-APO-RP1020-D
Pre-encapsulation plasma cleaning and activation:
Plasma processor cleaning activity technically has a significant improvement effect on the enhancement of the packaging die bonding characteristics in micro integrated circuit chips of semiconductor materials. Highly reactive plasma uses the organic chemical kinetic energy of free radicals to treat a wide variety of substrate surfaces: solder mask materials, die passivation layers, pad and leadframe surfaces, etc. This eliminates the problem of die delamination and, depending on the plasma applied to the polyvinyl alcohol, there is no electrostatic induction discharge or other potentially harmful adverse effects.

Plasma Etch Packaging:
The de-encapsulation of packaged components such as integrated circuit chips ICs and printed circuit boards pcb allows the internal components to be revealed. Open unpacking equipment can check the die, coupling and its characteristics in the common failure analysis process check. The selective leaching of polymer encapsulation materials is a key basis for component failure analysis, without jeopardizing the consistency of the wire and component layers. The use of plasma cleaning to clean up the package material to remove, plasma etching with high selectivity, will not be affected by the plasma etching process.

Plasma cleaning before soldering:
Plasma processor cleaning is an important process to enhance the cleanliness of pads in IC chips. After plasma cleaning treatment, the shear strength and tensile strength of the ball are significantly enhanced. Ideally, the wire should be maintained electrically welded to the bonding pad when it breaks in the span during the tension test.

Name	Jet type plasma processing system
Plasma power model	CRF-APO-RP1020-D
Direct jet type plasma spray gun modet	Rotary spray type: RXX（Option:20mm-80mm）
Power supply	220V/AC,50/60Hz
Power	600-1000W/25KHz（Option）
Power factor	0.98
Processing height	5-15mm
Processing width	Rotary spray type: 20-80mm (Option)
Internal control mode	Digital Control

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Plasma grafting

- Commodity name: CRF-APO-RP1020-D
- Commodity ID: CRF-APO-RP1020-D[0]
- Plasma产品名称:
- Plasma参数:
Adopting PFC full-bridge digital plasma power supply, with stable output power, strong anti-interference ability and rapid response; A wide range of optional plasma guns and nozzles for use in different applications to meet a variety of different products and processing environments; Compact size of the equipment, easy to carry and move, saving space for customer use; Can be installed in customer's equipment production line in ln-Line style, reducing customer's input cost； Long service life and low maintenance and repair costs, facilitating cost control for customers;

Pre-encapsulation plasma cleaning and activation:

Plasma processor cleaning activity technically has a significant improvement effect on the enhancement of the packaging die bonding characteristics in micro integrated circuit chips of semiconductor materials. Highly reactive plasma uses the organic chemical kinetic energy of free radicals to treat a wide variety of substrate surfaces: solder mask materials, die passivation layers, pad and leadframe surfaces, etc. This eliminates the problem of die delamination and, depending on the plasma applied to the polyvinyl alcohol, there is no electrostatic induction discharge or other potentially harmful adverse effects.

Plasma Etch Packaging:

The de-encapsulation of packaged components such as integrated circuit chips ICs and printed circuit boards pcb allows the internal components to be revealed. Open unpacking equipment can check the die, coupling and its characteristics in the common failure analysis process check. The selective leaching of polymer encapsulation materials is a key basis for component failure analysis, without jeopardizing the consistency of the wire and component layers. The use of plasma cleaning to clean up the package material to remove, plasma etching with high selectivity, will not be affected by the plasma etching process.

Plasma cleaning before soldering:

Plasma processor cleaning is an important process to enhance the cleanliness of pads in IC chips. After plasma cleaning treatment, the shear strength and tensile strength of the ball are significantly enhanced. Ideally, the wire should be maintained electrically welded to the bonding pad when it breaks in the span during the tension test.
Key words:
- CRF-APO-RP1020-D
Pre-encapsulation plasma cleaning and activation:
Plasma processor cleaning activity technically has a significant improvement effect on the enhancement of the packaging die bonding characteristics in micro integrated circuit chips of semiconductor materials. Highly reactive plasma uses the organic chemical kinetic energy of free radicals to treat a wide variety of substrate surfaces: solder mask materials, die passivation layers, pad and leadframe surfaces, etc. This eliminates the problem of die delamination and, depending on the plasma applied to the polyvinyl alcohol, there is no electrostatic induction discharge or other potentially harmful adverse effects.

Plasma Etch Packaging:
The de-encapsulation of packaged components such as integrated circuit chips ICs and printed circuit boards pcb allows the internal components to be revealed. Open unpacking equipment can check the die, coupling and its characteristics in the common failure analysis process check. The selective leaching of polymer encapsulation materials is a key basis for component failure analysis, without jeopardizing the consistency of the wire and component layers. The use of plasma cleaning to clean up the package material to remove, plasma etching with high selectivity, will not be affected by the plasma etching process.

Plasma cleaning before soldering:
Plasma processor cleaning is an important process to enhance the cleanliness of pads in IC chips. After plasma cleaning treatment, the shear strength and tensile strength of the ball are significantly enhanced. Ideally, the wire should be maintained electrically welded to the bonding pad when it breaks in the span during the tension test.

Name	Jet type plasma processing system
Plasma power model	CRF-APO-RP1020-D
Direct jet type plasma spray gun modet	Rotary spray type: RXX（Option:20mm-80mm）
Power supply	220V/AC,50/60Hz
Power	600-1000W/25KHz（Option）
Power factor	0.98
Processing height	5-15mm
Processing width	Rotary spray type: 20-80mm (Option)
Internal control mode	Digital Control

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Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.

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