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CRF-APO-R&D-DXX-PW

Atmospheric pressure plasma surface treatment machines can be equipped with various types of plasma guns and nozzles for use in different applications to meet a variety of different products and treatment environments;
Compact size of the equipment, easy to carry and move, saving space for customer use;
In-Line installation in customer equipment production lines, reducing customer input costs;
In-Line installation in customer equipment production lines, reducing customer input costs;

Applications

Equipment parameters

Applications

Plasma treatment equipment is mainly used in the electronics industry for cell phone case printing, coating, dispensing and other pre-treatment, cell phone screen surface treatment; connector surface cleaning; general industry screen printing, transfer printing pre-treatment, etc.

1、Ashing surface organic layer:

Material surface will suffer chemical bombardment; subject to high temperature state pollutants will evaporate out; environmental pollutants are broken under the impact of higher energy positive ions, and subsequently released.

Because plasma only through a few nanometers per second thin, and therefore the pollution layer can not be too thick.

2, plasma cleaning equipment to remove metal oxides:

Oxide and treatment of the gas to produce chemical changes, this process with hydrogen or hydrogen and argon mixture to carry out. Sometimes also choose two-step production processing technology, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.

3, plasma etching for soldering:

In general conditions, printed circuit boards are treated with organic chemical flux before soldering. This chemical needs to be removed by plasma method after soldering, otherwise it will produce problems such as corrosion.

4, plasma debonding, bonding:

Plating process, bonding, welding work in the residue will weaken the excellent bonding, this residue can be selectively removed with the plasma method. In addition, air oxidation which will also harm the quality of bonding, is also the need for plasma cleaning.

 
    • Commodity name: CRF-APO-R&D-DXX-PW
    • Commodity ID: CRF-APO-R&D-DXX-PW
    • Plasma产品名称:
    • Plasma参数:

    Atmospheric pressure plasma surface treatment machines can be equipped with various types of plasma guns and nozzles for use in different applications to meet a variety of different products and treatment environments;<br> Compact size of the equipment, easy to carry and move, saving space for customer use;<br> In-Line installation in customer equipment production lines, reducing customer input costs;<br> In-Line installation in customer equipment production lines, reducing customer input costs;

    Plasma treatment equipment is mainly used in the electronics industry for cell phone case printing, coating, dispensing and other pre-treatment, cell phone screen surface treatment; connector surface cleaning; general industry screen printing, transfer printing pre-treatment, etc.

    1、Ashing surface organic layer:

    Material surface will suffer chemical bombardment; subject to high temperature state pollutants will evaporate out; environmental pollutants are broken under the impact of higher energy positive ions, and subsequently released.

    Because plasma only through a few nanometers per second thin, and therefore the pollution layer can not be too thick.

    2, plasma cleaning equipment to remove metal oxides:

    Oxide and treatment of the gas to produce chemical changes, this process with hydrogen or hydrogen and argon mixture to carry out. Sometimes also choose two-step production processing technology, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.

    3, plasma etching for soldering:

    In general conditions, printed circuit boards are treated with organic chemical flux before soldering. This chemical needs to be removed by plasma method after soldering, otherwise it will produce problems such as corrosion.

    4, plasma debonding, bonding:

    Plating process, bonding, welding work in the residue will weaken the excellent bonding, this residue can be selectively removed with the plasma method. In addition, air oxidation which will also harm the quality of bonding, is also the need for plasma cleaning.

     
    Key words:
    • CRF-APO-R&D-DXX-022
  • Plasma treatment equipment is mainly used in the electronics industry for cell phone case printing, coating, dispensing and other pre-treatment, cell phone screen surface treatment; connector surface cleaning; general industry screen printing, transfer printing pre-treatment, etc.

    1、Ashing surface organic layer:

    Material surface will suffer chemical bombardment; subject to high temperature state pollutants will evaporate out; environmental pollutants are broken under the impact of higher energy positive ions, and subsequently released.

    Because plasma only through a few nanometers per second thin, and therefore the pollution layer can not be too thick.

    2, plasma cleaning equipment to remove metal oxides:

    Oxide and treatment of the gas to produce chemical changes, this process with hydrogen or hydrogen and argon mixture to carry out. Sometimes also choose two-step production processing technology, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.

    3, plasma etching for soldering:

    In general conditions, printed circuit boards are treated with organic chemical flux before soldering. This chemical needs to be removed by plasma method after soldering, otherwise it will produce problems such as corrosion.

    4, plasma debonding, bonding:

    Plating process, bonding, welding work in the residue will weaken the excellent bonding, this residue can be selectively removed with the plasma method. In addition, air oxidation which will also harm the quality of bonding, is also the need for plasma cleaning.

  • Name

    Jet type plasma processing system

    Plasma power   model

    CRF-APO-R&D-DXX-PW

    Power supply

    220V/AC,50/60Hz

    Power

    1000W/25KHz

    Power factor

    0.8

    Internal control mode

    Digital control

    External conteol mode

    ON/OFF I/O

    Gas

    Compressed Air (0.4mpa)/N2

    • Commodity name: CRF-APO-R&D-DXX-PW
    • Commodity ID: CRF-APO-R&D-DXX-PW
    • Plasma产品名称:
    • Plasma参数:

    Atmospheric pressure plasma surface treatment machines can be equipped with various types of plasma guns and nozzles for use in different applications to meet a variety of different products and treatment environments;<br> Compact size of the equipment, easy to carry and move, saving space for customer use;<br> In-Line installation in customer equipment production lines, reducing customer input costs;<br> In-Line installation in customer equipment production lines, reducing customer input costs;

    Plasma treatment equipment is mainly used in the electronics industry for cell phone case printing, coating, dispensing and other pre-treatment, cell phone screen surface treatment; connector surface cleaning; general industry screen printing, transfer printing pre-treatment, etc.

    1、Ashing surface organic layer:

    Material surface will suffer chemical bombardment; subject to high temperature state pollutants will evaporate out; environmental pollutants are broken under the impact of higher energy positive ions, and subsequently released.

    Because plasma only through a few nanometers per second thin, and therefore the pollution layer can not be too thick.

    2, plasma cleaning equipment to remove metal oxides:

    Oxide and treatment of the gas to produce chemical changes, this process with hydrogen or hydrogen and argon mixture to carry out. Sometimes also choose two-step production processing technology, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.

    3, plasma etching for soldering:

    In general conditions, printed circuit boards are treated with organic chemical flux before soldering. This chemical needs to be removed by plasma method after soldering, otherwise it will produce problems such as corrosion.

    4, plasma debonding, bonding:

    Plating process, bonding, welding work in the residue will weaken the excellent bonding, this residue can be selectively removed with the plasma method. In addition, air oxidation which will also harm the quality of bonding, is also the need for plasma cleaning.

     
    Key words:
    • CRF-APO-R&D-DXX-022
  • Plasma treatment equipment is mainly used in the electronics industry for cell phone case printing, coating, dispensing and other pre-treatment, cell phone screen surface treatment; connector surface cleaning; general industry screen printing, transfer printing pre-treatment, etc.

    1、Ashing surface organic layer:

    Material surface will suffer chemical bombardment; subject to high temperature state pollutants will evaporate out; environmental pollutants are broken under the impact of higher energy positive ions, and subsequently released.

    Because plasma only through a few nanometers per second thin, and therefore the pollution layer can not be too thick.

    2, plasma cleaning equipment to remove metal oxides:

    Oxide and treatment of the gas to produce chemical changes, this process with hydrogen or hydrogen and argon mixture to carry out. Sometimes also choose two-step production processing technology, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.

    3, plasma etching for soldering:

    In general conditions, printed circuit boards are treated with organic chemical flux before soldering. This chemical needs to be removed by plasma method after soldering, otherwise it will produce problems such as corrosion.

    4, plasma debonding, bonding:

    Plating process, bonding, welding work in the residue will weaken the excellent bonding, this residue can be selectively removed with the plasma method. In addition, air oxidation which will also harm the quality of bonding, is also the need for plasma cleaning.

  • Name

    Jet type plasma processing system

    Plasma power   model

    CRF-APO-R&D-DXX-PW

    Power supply

    220V/AC,50/60Hz

    Power

    1000W/25KHz

    Power factor

    0.8

    Internal control mode

    Digital control

    External conteol mode

    ON/OFF I/O

    Gas

    Compressed Air (0.4mpa)/N2


Our Partners

Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.

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