National consulting hotline:
Free proofing is available for consultation by appointment

Popular Articles
Contact Us


Service Hotline
13632675935
CRF
Address: 1303, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.

CRF-APO-R&D-RXX-2020
Compact size of the equipment, easy to carry and move, saving the customer's use of space;
It can be installed in the production line of customer's equipment in-line, reducing the investment cost of the customer;;
Long service life, low maintenance and repair costs, easy for customers to control costs.
Applications
Equipment parameters
Applications
Plasma treatment equipment is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pre-treatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.
The use of plasma ions for pure physics impact, plasma cleaning instrument is mainly the surface of the chemical substance molecules or adherent chemical surface molecules knocked out, because ions in the working pressure is low, its mean free radicals are relatively light and long, with a certain kinetic energy accumulation, therefore, in the physical impact, the higher the kinetic energy of the ion, the more molecules impacted, if you want to be dominated by the physical reaction, you need to reflect under lower working pressure, so that the actual cleaning effect is stronger.
The principle of plasma cleaner is to use the "active effect" of active particles in the plasma to achieve the purpose of removing dirt. Plasma cleaning generally involves the following processes: inorganic gas is excited into a plasma state; The gas-phase material is sucked into the surface layer of the solid; Convert the suction functional group into product molecules by reacting with solid surface molecules; Analyze the molecular structure of the product into the gas phase; The reaction residue gets rid of the surface layer. The great feature of plasma cleaning instrument technology is that there is no need to distinguish the types of targets to be cleaned, and metal materials, semiconductor materials, metal oxides and most fiber materials, such as polypropylene, polyester, polyimide film, polychloroethane, epoxy resin, and even polytetrafluoroethylene, etc., can be treated to obtain corresponding effects, and can carry out overall, local and complex structure cleaning.
-
- Commodity name: CRF-APO-R&D-RXX-2020
- Commodity ID: CRF-APO-R&D-RXX-2020
- Plasma产品名称:
- Plasma参数:
Atmospheric pressure plasma surface treatment machine can be equipped with a variety of types of plasma guns and nozzles, used in different occasions, to meet a variety of different products and treatment environment;<br> Compact size of the equipment, easy to carry and move, saving the customer's use of space;<br> It can be installed in the production line of customer's equipment in-line, reducing the investment cost of the customer;;<br> Long service life, low maintenance and repair costs, easy for customers to control costs.
Plasma treatment equipment is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pre-treatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.
The use of plasma ions for pure physics impact, plasma cleaning instrument is mainly the surface of the chemical substance molecules or adherent chemical surface molecules knocked out, because ions in the working pressure is low, its mean free radicals are relatively light and long, with a certain kinetic energy accumulation, therefore, in the physical impact, the higher the kinetic energy of the ion, the more molecules impacted, if you want to be dominated by the physical reaction, you need to reflect under lower working pressure, so that the actual cleaning effect is stronger.
The principle of plasma cleaner is to use the "active effect" of active particles in the plasma to achieve the purpose of removing dirt. Plasma cleaning generally involves the following processes: inorganic gas is excited into a plasma state; The gas-phase material is sucked into the surface layer of the solid; Convert the suction functional group into product molecules by reacting with solid surface molecules; Analyze the molecular structure of the product into the gas phase; The reaction residue gets rid of the surface layer. The great feature of plasma cleaning instrument technology is that there is no need to distinguish the types of targets to be cleaned, and metal materials, semiconductor materials, metal oxides and most fiber materials, such as polypropylene, polyester, polyimide film, polychloroethane, epoxy resin, and even polytetrafluoroethylene, etc., can be treated to obtain corresponding effects, and can carry out overall, local and complex structure cleaning.
Key words:- CRF-APO-R&D-RXX-2020
-
Plasma treatment equipment is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pre-treatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.
1. Organic layer on the ashed surface:
the surface of the material will be subjected to chemical bombardment; Pollutants will evaporate when subjected to high temperatures; Environmental pollutants are broken up under the impact of higher energy positive ions and subsequently released.
Because plasma is only a few nanometers thick per second, the contamination layer should not be too thick.2. Plasma cleaning equipment is used to remove metal oxides:
the oxide and the treated gas produce chemical changes, this process is carried out with hydrogen or a mixture of hydrogen and argon. Sometimes a two-step production process is used, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.3. Plasma etching for welding:
Under normal circumstances, the printed circuit board is treated with organic chemical flux before welding. This chemical needs to be removed by plasma method after welding, otherwise corrosion and other problems will occur.4. Plasma degumming and bonding:
the residues in the electroplating process, bonding and welding work will weaken the excellent bonding, and this residue can be selectively removed by the plasma method. In addition, air oxidation, which also jeopardizes the quality of bonding, also requires plasma cleaning. -
Name
Jet-type AP plasma treatment system
(Jet type plasma processing system)
Plasma power model
CRF-APO-R&D-DXX-PW
Power supply
220V/AC,50/60Hz
Power
1000W/25KHz
(Option)
Power factor
0.8
Internal control mode
numerical control
(Digital control)
External conteol mode
Start-Stop I/O
(ON/OFF I/O)
Gas
Compressed Air (0.4mpa)/N2
-
- Commodity name: CRF-APO-R&D-RXX-2020
- Commodity ID: CRF-APO-R&D-RXX-2020
- Plasma产品名称:
- Plasma参数:
Atmospheric pressure plasma surface treatment machine can be equipped with a variety of types of plasma guns and nozzles, used in different occasions, to meet a variety of different products and treatment environment;<br> Compact size of the equipment, easy to carry and move, saving the customer's use of space;<br> It can be installed in the production line of customer's equipment in-line, reducing the investment cost of the customer;;<br> Long service life, low maintenance and repair costs, easy for customers to control costs.
Plasma treatment equipment is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pre-treatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.
The use of plasma ions for pure physics impact, plasma cleaning instrument is mainly the surface of the chemical substance molecules or adherent chemical surface molecules knocked out, because ions in the working pressure is low, its mean free radicals are relatively light and long, with a certain kinetic energy accumulation, therefore, in the physical impact, the higher the kinetic energy of the ion, the more molecules impacted, if you want to be dominated by the physical reaction, you need to reflect under lower working pressure, so that the actual cleaning effect is stronger.
The principle of plasma cleaner is to use the "active effect" of active particles in the plasma to achieve the purpose of removing dirt. Plasma cleaning generally involves the following processes: inorganic gas is excited into a plasma state; The gas-phase material is sucked into the surface layer of the solid; Convert the suction functional group into product molecules by reacting with solid surface molecules; Analyze the molecular structure of the product into the gas phase; The reaction residue gets rid of the surface layer. The great feature of plasma cleaning instrument technology is that there is no need to distinguish the types of targets to be cleaned, and metal materials, semiconductor materials, metal oxides and most fiber materials, such as polypropylene, polyester, polyimide film, polychloroethane, epoxy resin, and even polytetrafluoroethylene, etc., can be treated to obtain corresponding effects, and can carry out overall, local and complex structure cleaning.
Key words:- CRF-APO-R&D-RXX-2020
-
Plasma treatment equipment is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pre-treatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.
1. Organic layer on the ashed surface:
the surface of the material will be subjected to chemical bombardment; Pollutants will evaporate when subjected to high temperatures; Environmental pollutants are broken up under the impact of higher energy positive ions and subsequently released.
Because plasma is only a few nanometers thick per second, the contamination layer should not be too thick.2. Plasma cleaning equipment is used to remove metal oxides:
the oxide and the treated gas produce chemical changes, this process is carried out with hydrogen or a mixture of hydrogen and argon. Sometimes a two-step production process is used, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.3. Plasma etching for welding:
Under normal circumstances, the printed circuit board is treated with organic chemical flux before welding. This chemical needs to be removed by plasma method after welding, otherwise corrosion and other problems will occur.4. Plasma degumming and bonding:
the residues in the electroplating process, bonding and welding work will weaken the excellent bonding, and this residue can be selectively removed by the plasma method. In addition, air oxidation, which also jeopardizes the quality of bonding, also requires plasma cleaning. -
Name
Jet-type AP plasma treatment system
(Jet type plasma processing system)
Plasma power model
CRF-APO-R&D-DXX-PW
Power supply
220V/AC,50/60Hz
Power
1000W/25KHz
(Option)
Power factor
0.8
Internal control mode
numerical control
(Digital control)
External conteol mode
Start-Stop I/O
(ON/OFF I/O)
Gas
Compressed Air (0.4mpa)/N2
Our Partners
Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.












Honor Certificate










Related Products
Related articles