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Vacuum type plasma treatment system CRF-VPO-10L-S


Applications

Equipment parameters

Applications

Product features
Large processing space, improve processing capacity, PLC + touch screen control system, accurate control equipment operation;
The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;
High precision, fast response, good handling and compatibility, perfect function and professional technical support.
 
Scope of application
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board plasma surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft and hard board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Surface roughening, etching and activation of silica gel, plastic, polymer in the field of silica gel, plastic and polymer.
 
The plasma used by Chengfeng Intelligent Manufacturing, a manufacturer of vacuum plasma cleaning machines, is a gas produced by ionization, which includes electrons, ions and free radicals. The interaction of plasma with an applied magnetic field affects the charged ions in its internal magnetic field, improving the fluid characteristics of the plasma, which in turn causes group effects such as fluidity, undulation, instability and self-organization. The particles in each plasma have a relatively separate motion energy distribution, and the energy retained by each particle cannot always be equivalently equilibrium. The internal energy of the plasma is composed of thermal energy, electric field energy and radiation field, which influence and convert each other, so that the plasma exists in a wider range and in the interconnected multi-dimensional parameter space.

After touching the plasma, the material will produce a series of physical and chemical reactions. Plasma production technology manufacturers not only complete the material production, processing and manufacturing, but also complete the modification of the material itself, which enhances the additional use value of the material. Vacuum plasma cleaning machine is composed of vacuum generation system, electronic control system, plasma generator, vacuum cavity, machinery and other parts, according to the customer's special requirements, customized customer satisfaction vacuum equipment. The vacuum cleaning machine adopts CNC processing technology and has a high level of automation technology; Equipped with high-precision control equipment; Since the treatment is carried out in a vacuum environment, it will not cause environmental pollution, ensuring that the cleaning surface will not be subject to secondary pollution.

Vacuum plasma cleaning machine can be used for etching of polytetrafluorine and polytetrafluoro compounds, active cleaning of plastics, laminated glass, porcelain, and can also be used in precision processing industries such as automotive electronic products, electronic devices, PCB manufacturing, etc.
    • Commodity name: Vacuum type plasma treatment system CRF-VPO-10L-S
    • Commodity ID: CRF-VPO-10L-S
    • Plasma产品名称:
    • Plasma参数:
    Product features
    Large processing space, improve processing capacity, PLC + touch screen control system, accurate control equipment operation;
    The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;
    High precision, fast response, good handling and compatibility, perfect function and professional technical support.
     
    Scope of application
    Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board plasma surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft and hard board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Surface roughening, etching and activation of silica gel, plastic, polymer in the field of silica gel, plastic and polymer.
     
    The plasma used by Chengfeng Intelligent Manufacturing, a manufacturer of vacuum plasma cleaning machines, is a gas produced by ionization, which includes electrons, ions and free radicals. The interaction of plasma with an applied magnetic field affects the charged ions in its internal magnetic field, improving the fluid characteristics of the plasma, which in turn causes group effects such as fluidity, undulation, instability and self-organization. The particles in each plasma have a relatively separate motion energy distribution, and the energy retained by each particle cannot always be equivalently equilibrium. The internal energy of the plasma is composed of thermal energy, electric field energy and radiation field, which influence and convert each other, so that the plasma exists in a wider range and in the interconnected multi-dimensional parameter space.

    After touching the plasma, the material will produce a series of physical and chemical reactions. Plasma production technology manufacturers not only complete the material production, processing and manufacturing, but also complete the modification of the material itself, which enhances the additional use value of the material. Vacuum plasma cleaning machine is composed of vacuum generation system, electronic control system, plasma generator, vacuum cavity, machinery and other parts, according to the customer's special requirements, customized customer satisfaction vacuum equipment. The vacuum cleaning machine adopts CNC processing technology and has a high level of automation technology; Equipped with high-precision control equipment; Since the treatment is carried out in a vacuum environment, it will not cause environmental pollution, ensuring that the cleaning surface will not be subject to secondary pollution.

    Vacuum plasma cleaning machine can be used for etching of polytetrafluorine and polytetrafluoro compounds, active cleaning of plastics, laminated glass, porcelain, and can also be used in precision processing industries such as automotive electronic products, electronic devices, PCB manufacturing, etc.
  •  

    Name

    Vacuum plasma treatment system

    Model

    CRF-VPO-10L-S

    Control system

    PLC+ touch screen

    Power supply

    380V/AC,50/60Hz,3kw

    RF Power

    600W/13.56MHz

    Volume

    120L(Option)

    Electrode of plies 

    8(Option)

    Area

    400(L)*300(W)(Option)

    Gas

    Two working gases are optional: Ar, N2, H2, CF4, O2

    Appearance

    Sheet metal construction

     

    • Commodity name: Vacuum type plasma treatment system CRF-VPO-10L-S
    • Commodity ID: CRF-VPO-10L-S
    • Plasma产品名称:
    • Plasma参数:
    Product features
    Large processing space, improve processing capacity, PLC + touch screen control system, accurate control equipment operation;
    The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;
    High precision, fast response, good handling and compatibility, perfect function and professional technical support.
     
    Scope of application
    Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board plasma surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft and hard board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Surface roughening, etching and activation of silica gel, plastic, polymer in the field of silica gel, plastic and polymer.
     
    The plasma used by Chengfeng Intelligent Manufacturing, a manufacturer of vacuum plasma cleaning machines, is a gas produced by ionization, which includes electrons, ions and free radicals. The interaction of plasma with an applied magnetic field affects the charged ions in its internal magnetic field, improving the fluid characteristics of the plasma, which in turn causes group effects such as fluidity, undulation, instability and self-organization. The particles in each plasma have a relatively separate motion energy distribution, and the energy retained by each particle cannot always be equivalently equilibrium. The internal energy of the plasma is composed of thermal energy, electric field energy and radiation field, which influence and convert each other, so that the plasma exists in a wider range and in the interconnected multi-dimensional parameter space.

    After touching the plasma, the material will produce a series of physical and chemical reactions. Plasma production technology manufacturers not only complete the material production, processing and manufacturing, but also complete the modification of the material itself, which enhances the additional use value of the material. Vacuum plasma cleaning machine is composed of vacuum generation system, electronic control system, plasma generator, vacuum cavity, machinery and other parts, according to the customer's special requirements, customized customer satisfaction vacuum equipment. The vacuum cleaning machine adopts CNC processing technology and has a high level of automation technology; Equipped with high-precision control equipment; Since the treatment is carried out in a vacuum environment, it will not cause environmental pollution, ensuring that the cleaning surface will not be subject to secondary pollution.

    Vacuum plasma cleaning machine can be used for etching of polytetrafluorine and polytetrafluoro compounds, active cleaning of plastics, laminated glass, porcelain, and can also be used in precision processing industries such as automotive electronic products, electronic devices, PCB manufacturing, etc.
  •  

    Name

    Vacuum plasma treatment system

    Model

    CRF-VPO-10L-S

    Control system

    PLC+ touch screen

    Power supply

    380V/AC,50/60Hz,3kw

    RF Power

    600W/13.56MHz

    Volume

    120L(Option)

    Electrode of plies 

    8(Option)

    Area

    400(L)*300(W)(Option)

    Gas

    Two working gases are optional: Ar, N2, H2, CF4, O2

    Appearance

    Sheet metal construction

     


Our Partners

Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.

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