The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;

High precision, fast response, good handling and compatibility, perfect function and professional technical support.

Scope of application

Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft and hard board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Silica gel, plastic, polymer field of silica gel, plastic, polymer plasma surface roughening, etching, activation.

Vacuum plasma cleaner system manufacturers are using plasma formed by gas ionization to surface treatment of product workpieces, whether it is cleaning or surface activation, in order to better achieve high-quality treatment results, different products need to select different processing process gases, plasma cleaning machine common processing process gases are oxygen (Oxygen, O2), argon (Argon, Argon), nitrogen (Nitrogen, N2), air compression (Compressed Air, CDA), carbon dioxide (Carbon, CO2), hydrogen (Hydrogen, H2), tetrafluoride (CF4), etc.

Oxygen:
Oxygen is a common plasma cleaning active gas, which belongs to the physics + chemical treatment method, and the ions caused by ionization after ionization can physically bombard the surface, resulting in an unsmooth and rough surface. In addition, highly reactive oxygen ions can chemically react with the broken molecular structure chain and transform into a hydrophilic surface layer with active groups to complete the purpose of surface activity. The organic pollutants that are broken can chemically react with active oxygen ions to produce CO, CO2, H2O and other molecules to leave the surface layer and complete surface cleaning. Oxygen is used for the surface activity of polymers and the removal of pollutants, but not for oxidized metal surfaces. Under vacuum plasma, oxygen plasma is light blue, and part of it is milky white when charged and discharged; The light in the discharge environment is bright, and it is likely that the true intraluminal discharge will not be visible when viewed with the naked eye.

Hydrogen:

Hydrogen, like oxygen, is a highly reactive gas that activates and cleanses the surface. The difference between hydrogen and oxygen depends on the functional groups produced after the reaction, and hydrogen also has reducing properties, which can be used to remove the microscopic oxide layer of the metal surface, and is not easy to destroy the sensitive organic layer of the surface. Therefore, it is widely used in microelectronics technology, semiconductor materials and PCB circuit board processing and manufacturing. Because hydrogen is a dangerous gas, it is easy to fuse with oxygen and produce an explosion without ionization, so it is not allowed to mix these two gases in the plasma cleaner. In the vacuum plasma state, hydrogen plasma is bright red, similar to argon plasma, and slightly darker than argon plasma in the same discharge environment.

Nitrogen:

The plasma formed by the ionization of nitrogen has a bonding reaction with some molecules, so it is also an active gas, but compared to oxygen and hydrogen, its particles are heavier, in the application of general plasma cleaning machines, such gases are generally defined as a gas between the active gas oxygen, hydrogen and the rare gas argon. When cleaning and activating, it is necessary to achieve a certain effect of bombardment and etching, and at the same time avoid air oxidation of part of the metal surface. Plasma made by mixing nitrogen and other gases is generally used to process some special materials. In the vacuum chamber, nitrogen plasma will be brighter than argon and hydrogen plasma under the same discharge.

- Commodity name: Vacuum type plasma treatment system CRF-VPO-4L-S
- Commodity ID: CRF-VPO-4L-S
- Plasma产品名称:
- Plasma参数:
Product features

Large processing space, improve processing capacity, PLC + touch screen control system, accurate control equipment operation;

The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;

High precision, fast response, good handling and compatibility, perfect function and professional technical support.

Scope of application

Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft and hard board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Silica gel, plastic, polymer field of silica gel, plastic, polymer plasma surface roughening, etching, activation.

Vacuum plasma cleaner system manufacturers are using plasma formed by gas ionization to surface treatment of product workpieces, whether it is cleaning or surface activation, in order to better achieve high-quality treatment results, different products need to select different processing process gases, plasma cleaning machine common processing process gases are oxygen (Oxygen, O2), argon (Argon, Argon), nitrogen (Nitrogen, N2), air compression (Compressed Air, CDA), carbon dioxide (Carbon, CO2), hydrogen (Hydrogen, H2), tetrafluoride (CF4), etc.

Oxygen:
Oxygen is a common plasma cleaning active gas, which belongs to the physics + chemical treatment method, and the ions caused by ionization after ionization can physically bombard the surface, resulting in an unsmooth and rough surface. In addition, highly reactive oxygen ions can chemically react with the broken molecular structure chain and transform into a hydrophilic surface layer with active groups to complete the purpose of surface activity. The organic pollutants that are broken can chemically react with active oxygen ions to produce CO, CO2, H2O and other molecules to leave the surface layer and complete surface cleaning. Oxygen is used for the surface activity of polymers and the removal of pollutants, but not for oxidized metal surfaces. Under vacuum plasma, oxygen plasma is light blue, and part of it is milky white when charged and discharged; The light in the discharge environment is bright, and it is likely that the true intraluminal discharge will not be visible when viewed with the naked eye.

Hydrogen:

Hydrogen, like oxygen, is a highly reactive gas that activates and cleanses the surface. The difference between hydrogen and oxygen depends on the functional groups produced after the reaction, and hydrogen also has reducing properties, which can be used to remove the microscopic oxide layer of the metal surface, and is not easy to destroy the sensitive organic layer of the surface. Therefore, it is widely used in microelectronics technology, semiconductor materials and PCB circuit board processing and manufacturing. Because hydrogen is a dangerous gas, it is easy to fuse with oxygen and produce an explosion without ionization, so it is not allowed to mix these two gases in the plasma cleaner. In the vacuum plasma state, hydrogen plasma is bright red, similar to argon plasma, and slightly darker than argon plasma in the same discharge environment.

Nitrogen:

The plasma formed by the ionization of nitrogen has a bonding reaction with some molecules, so it is also an active gas, but compared to oxygen and hydrogen, its particles are heavier, in the application of general plasma cleaning machines, such gases are generally defined as a gas between the active gas oxygen, hydrogen and the rare gas argon. When cleaning and activating, it is necessary to achieve a certain effect of bombardment and etching, and at the same time avoid air oxidation of part of the metal surface. Plasma made by mixing nitrogen and other gases is generally used to process some special materials. In the vacuum chamber, nitrogen plasma will be brighter than argon and hydrogen plasma under the same discharge.

Name	Vacuum plasma treatment system
Model	CRF-VPO-4L-S
Control system	PLC+ touch screen
Power supply	380V/AC,50/60Hz,3kw
Intermediate frequency power supply power (RF Power)	1000W/40KHz/13.56MHz
Volume	30L(Option)
Electrode of plies	4(Option)
Area	200(L)*150(W)(Option)
Gas	Two working gases are optional: Ar, N2, CF4, O2

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- Commodity name: Vacuum type plasma treatment system CRF-VPO-4L-S
- Commodity ID: CRF-VPO-4L-S
- Plasma产品名称:
- Plasma参数:
Product features

Large processing space, improve processing capacity, PLC + touch screen control system, accurate control equipment operation;

The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;

High precision, fast response, good handling and compatibility, perfect function and professional technical support.

Scope of application

Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft and hard board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Silica gel, plastic, polymer field of silica gel, plastic, polymer plasma surface roughening, etching, activation.

Vacuum plasma cleaner system manufacturers are using plasma formed by gas ionization to surface treatment of product workpieces, whether it is cleaning or surface activation, in order to better achieve high-quality treatment results, different products need to select different processing process gases, plasma cleaning machine common processing process gases are oxygen (Oxygen, O2), argon (Argon, Argon), nitrogen (Nitrogen, N2), air compression (Compressed Air, CDA), carbon dioxide (Carbon, CO2), hydrogen (Hydrogen, H2), tetrafluoride (CF4), etc.

Oxygen:
Oxygen is a common plasma cleaning active gas, which belongs to the physics + chemical treatment method, and the ions caused by ionization after ionization can physically bombard the surface, resulting in an unsmooth and rough surface. In addition, highly reactive oxygen ions can chemically react with the broken molecular structure chain and transform into a hydrophilic surface layer with active groups to complete the purpose of surface activity. The organic pollutants that are broken can chemically react with active oxygen ions to produce CO, CO2, H2O and other molecules to leave the surface layer and complete surface cleaning. Oxygen is used for the surface activity of polymers and the removal of pollutants, but not for oxidized metal surfaces. Under vacuum plasma, oxygen plasma is light blue, and part of it is milky white when charged and discharged; The light in the discharge environment is bright, and it is likely that the true intraluminal discharge will not be visible when viewed with the naked eye.

Hydrogen:

Hydrogen, like oxygen, is a highly reactive gas that activates and cleanses the surface. The difference between hydrogen and oxygen depends on the functional groups produced after the reaction, and hydrogen also has reducing properties, which can be used to remove the microscopic oxide layer of the metal surface, and is not easy to destroy the sensitive organic layer of the surface. Therefore, it is widely used in microelectronics technology, semiconductor materials and PCB circuit board processing and manufacturing. Because hydrogen is a dangerous gas, it is easy to fuse with oxygen and produce an explosion without ionization, so it is not allowed to mix these two gases in the plasma cleaner. In the vacuum plasma state, hydrogen plasma is bright red, similar to argon plasma, and slightly darker than argon plasma in the same discharge environment.

Nitrogen:

The plasma formed by the ionization of nitrogen has a bonding reaction with some molecules, so it is also an active gas, but compared to oxygen and hydrogen, its particles are heavier, in the application of general plasma cleaning machines, such gases are generally defined as a gas between the active gas oxygen, hydrogen and the rare gas argon. When cleaning and activating, it is necessary to achieve a certain effect of bombardment and etching, and at the same time avoid air oxidation of part of the metal surface. Plasma made by mixing nitrogen and other gases is generally used to process some special materials. In the vacuum chamber, nitrogen plasma will be brighter than argon and hydrogen plasma under the same discharge.

Name	Vacuum plasma treatment system
Model	CRF-VPO-4L-S
Control system	PLC+ touch screen
Power supply	380V/AC,50/60Hz,3kw
Intermediate frequency power supply power (RF Power)	1000W/40KHz/13.56MHz
Volume	30L(Option)
Electrode of plies	4(Option)
Area	200(L)*150(W)(Option)
Gas	Two working gases are optional: Ar, N2, CF4, O2

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Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.

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