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Vacuum type plasma treatment system CRF-VPO-2L-S


Applications

Equipment parameters

Applications

Product features
Large processing space, improve processing capacity, PLC + touch screen control system, accurate control equipment operation;
The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;
High precision, fast response, good handling and compatibility, perfect function and professional technical support.
 
Scope of application
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Surface roughening, etching and activation of silica gel, plastic, polymer in the field of silica gel, plastic and polymer.
 
Plasma vacuum treatment system equipment plasma is a substance produced by gas molecules in a unique cavity environment such as vacuum and discharge. Two electrodes are set in a sealed vacuum chamber to activate multiple electrodes to form a magnetic field, which is used to generate plasma required for plasma cleaning or etching. After generating a magnetic field, the vacuum pump is used to adjust to a certain vacuum value, and when the gas becomes thinner and thinner, the spacing between molecules and ion movement becomes longer and longer, suffering from the action of electromagnetic fields, colliding with each other to produce plasma, and at the same time producing glow and shining. The plasma is constantly moving in space in the magnetic field, and the chemical reaction occurs by ion bombardment on the surface of the object to be treated, so as to achieve the effect of cleaning the surface and etching and activation.
 
Many materials cannot be well packaged and printed without a plasma surface treatment system. We know that the use of active sodium alkaline metals can improve bonding ability, but this method is not easy to control, and the solution is harmful. The use of plasma technology can not only protect the ecological environment, but also achieve better results. The plasma structure increases the activity of the surface layer of the object, and the active layer is generated on the surface layer for bonding, printing and other operations.
 
Plasma treatment has no damage to the product, the treatment surface is very uniform, will not produce harmful substances, clean and environmentally friendly, and can also process hollow and gapal products. Plasma treatment allows the product to be pretreated without chemical solvents; Processes such as plastic materials, metals or semiconductors can be applied; It has environmental significance, occupies little working space, and has low project cost.
    • Commodity name: Vacuum type plasma treatment system CRF-VPO-2L-S
    • Commodity ID: CRF-VPO-2L-S
    • Plasma产品名称:
    • Plasma参数:
    Product features
    Large processing space, improve processing capacity, PLC + touch screen control system, accurate control equipment operation;
    The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;
    High precision, fast response, good handling and compatibility, perfect function and professional technical support.
     
    Scope of application
    Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Surface roughening, etching and activation of silica gel, plastic, polymer in the field of silica gel, plastic and polymer.
     
    Plasma vacuum treatment system equipment plasma is a substance produced by gas molecules in a unique cavity environment such as vacuum and discharge. Two electrodes are set in a sealed vacuum chamber to activate multiple electrodes to form a magnetic field, which is used to generate plasma required for plasma cleaning or etching. After generating a magnetic field, the vacuum pump is used to adjust to a certain vacuum value, and when the gas becomes thinner and thinner, the spacing between molecules and ion movement becomes longer and longer, suffering from the action of electromagnetic fields, colliding with each other to produce plasma, and at the same time producing glow and shining. The plasma is constantly moving in space in the magnetic field, and the chemical reaction occurs by ion bombardment on the surface of the object to be treated, so as to achieve the effect of cleaning the surface and etching and activation.
     
    Many materials cannot be well packaged and printed without a plasma surface treatment system. We know that the use of active sodium alkaline metals can improve bonding ability, but this method is not easy to control, and the solution is harmful. The use of plasma technology can not only protect the ecological environment, but also achieve better results. The plasma structure increases the activity of the surface layer of the object, and the active layer is generated on the surface layer for bonding, printing and other operations.
     
    Plasma treatment has no damage to the product, the treatment surface is very uniform, will not produce harmful substances, clean and environmentally friendly, and can also process hollow and gapal products. Plasma treatment allows the product to be pretreated without chemical solvents; Processes such as plastic materials, metals or semiconductors can be applied; It has environmental significance, occupies little working space, and has low project cost.
  • Name

    Vacuum-type plasma treatment system

    Model

    CRF-VPO-2L-S

    Control system

    PLC+ touch screen

    Power supply

    380V/AC,50/60Hz,3kw

    Intermediate frequency power supply power (RF Power)

    1000W/40KHz

    Volume

    10L(Option)

    Electrode of plies 

    2(Option)

    Cavity Specifications (Area)

    220(W)*230(D)*230(H)

    Gas channel (Gas)

    Two working gases are optional: Ar, N2, CF4, O2

    • Commodity name: Vacuum type plasma treatment system CRF-VPO-2L-S
    • Commodity ID: CRF-VPO-2L-S
    • Plasma产品名称:
    • Plasma参数:
    Product features
    Large processing space, improve processing capacity, PLC + touch screen control system, accurate control equipment operation;
    The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;
    High precision, fast response, good handling and compatibility, perfect function and professional technical support.
     
    Scope of application
    Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft board surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Surface roughening, etching and activation of silica gel, plastic, polymer in the field of silica gel, plastic and polymer.
     
    Plasma vacuum treatment system equipment plasma is a substance produced by gas molecules in a unique cavity environment such as vacuum and discharge. Two electrodes are set in a sealed vacuum chamber to activate multiple electrodes to form a magnetic field, which is used to generate plasma required for plasma cleaning or etching. After generating a magnetic field, the vacuum pump is used to adjust to a certain vacuum value, and when the gas becomes thinner and thinner, the spacing between molecules and ion movement becomes longer and longer, suffering from the action of electromagnetic fields, colliding with each other to produce plasma, and at the same time producing glow and shining. The plasma is constantly moving in space in the magnetic field, and the chemical reaction occurs by ion bombardment on the surface of the object to be treated, so as to achieve the effect of cleaning the surface and etching and activation.
     
    Many materials cannot be well packaged and printed without a plasma surface treatment system. We know that the use of active sodium alkaline metals can improve bonding ability, but this method is not easy to control, and the solution is harmful. The use of plasma technology can not only protect the ecological environment, but also achieve better results. The plasma structure increases the activity of the surface layer of the object, and the active layer is generated on the surface layer for bonding, printing and other operations.
     
    Plasma treatment has no damage to the product, the treatment surface is very uniform, will not produce harmful substances, clean and environmentally friendly, and can also process hollow and gapal products. Plasma treatment allows the product to be pretreated without chemical solvents; Processes such as plastic materials, metals or semiconductors can be applied; It has environmental significance, occupies little working space, and has low project cost.
  • Name

    Vacuum-type plasma treatment system

    Model

    CRF-VPO-2L-S

    Control system

    PLC+ touch screen

    Power supply

    380V/AC,50/60Hz,3kw

    Intermediate frequency power supply power (RF Power)

    1000W/40KHz

    Volume

    10L(Option)

    Electrode of plies 

    2(Option)

    Cavity Specifications (Area)

    220(W)*230(D)*230(H)

    Gas channel (Gas)

    Two working gases are optional: Ar, N2, CF4, O2


Our Partners

Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.

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