A variety of plasma spray guns and nozzles can be selected to be used in different occasions to meet a variety of different products and processing environments;

The small size of the device makes it easy to carry and move, saving customers space;

It can be installed in the customer's equipment production line to reduce customer input costs;

Long service life, low maintenance and repair cost, convenient for customer cost control;

Scope of application:

Plasma cleaning machine plasma processing instrument is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pretreatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.

Plasma cleaning is the only way to improve product yield. Flip-chip machines are becoming more and more visible in the market, and plasma technology has an incomparable advantage in penetrating the fine voids of the mold, and the surface layer can be activated and activated regardless of the size of the object.

Plasma treatment systems provide fast, uniform cleaning or peeling results. The cleaning process of plasma processing instrument is made by heating a high concentration of free radicals and low density plasma. Good uniformity, good process manipulation control, and hands-on operation on a single substrate are critical.

Pre-package plasma cleaning and activation:
The cleaning activity of plasma processing instrument has a significant improvement effect on the package mold adhesion characteristics in semiconductor material microintegrated circuit chips. Highly reactive plasma uses the organic chemical kinetic energy of free radicals to treat a wide variety of substrate surfaces: weld mask materials, mold passivation treatment layers, pad and lead frame surfaces, etc. This clears the mold delamination challenge and, depending on the plasma applied to polyvinyl alcohol, there is no electrostatic induced discharge or other potentially hazardous adverse reactions.

Plasma etching packaging:
The packaging of packaged components such as integrated circuit chip IC and printed circuit board PCB makes the internal components exposed. Open the depackaging device to inspect the mold, the joint, and the characteristics it inspects during common fault analysis. The selective etching of polymer encapsulation materials is the key basis for component failure analysis, without compromising the consistency of the wire and component layers. Plasma cleaning is used to clean and remove the encapsulation material, and plasma etching is highly selective and will not be affected by the plasma etching process.

Plasma cleaning before soldering:
Plasma processing instrument cleaning is an important process to improve the cleanliness of pads in integrated circuit chips. After plasma cleaning treatment, the shear strength and tensile strength of the ball are significantly enhanced. Ideally, during the tensile test, when the wire breaks in the span, the electrowelding should be maintained on the adhesive pad. PVAtepla's distinctive plasma effectively removes organic contaminants and metal oxides.

Plasma cleaner cleaning is also suitable for touch display processing. For example, before bonding, the LCD screen or OLED terminal is removed from the organic contaminants at the junction, and then fused with the conductive film. In addition to this, plasma activity against glass in integrated IC mounting (COG) pretreatment is another key application.

- Commodity name: Jet-type AP plasma treatment system CRF-APO-RP1020-D
- Commodity ID: CRF-APO-RP1020-D
- Plasma产品名称:
- Plasma参数:
Product Features:

PFC full-bridge digital plasma power supply is adopted, with stable output power, strong anti-interference ability and fast response;

A variety of plasma spray guns and nozzles can be selected to be used in different occasions to meet a variety of different products and processing environments;

The small size of the device makes it easy to carry and move, saving customers space;

It can be installed in the customer's equipment production line to reduce customer input costs;

Long service life, low maintenance and repair cost, convenient for customer cost control;

Scope of application:

Plasma cleaning machine plasma processing instrument is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pretreatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.

Plasma cleaning is the only way to improve product yield. Flip-chip machines are becoming more and more visible in the market, and plasma technology has an incomparable advantage in penetrating the fine voids of the mold, and the surface layer can be activated and activated regardless of the size of the object.

Plasma treatment systems provide fast, uniform cleaning or peeling results. The cleaning process of plasma processing instrument is made by heating a high concentration of free radicals and low density plasma. Good uniformity, good process manipulation control, and hands-on operation on a single substrate are critical.

Pre-package plasma cleaning and activation:
The cleaning activity of plasma processing instrument has a significant improvement effect on the package mold adhesion characteristics in semiconductor material microintegrated circuit chips. Highly reactive plasma uses the organic chemical kinetic energy of free radicals to treat a wide variety of substrate surfaces: weld mask materials, mold passivation treatment layers, pad and lead frame surfaces, etc. This clears the mold delamination challenge and, depending on the plasma applied to polyvinyl alcohol, there is no electrostatic induced discharge or other potentially hazardous adverse reactions.

Plasma etching packaging:
The packaging of packaged components such as integrated circuit chip IC and printed circuit board PCB makes the internal components exposed. Open the depackaging device to inspect the mold, the joint, and the characteristics it inspects during common fault analysis. The selective etching of polymer encapsulation materials is the key basis for component failure analysis, without compromising the consistency of the wire and component layers. Plasma cleaning is used to clean and remove the encapsulation material, and plasma etching is highly selective and will not be affected by the plasma etching process.

Plasma cleaning before soldering:
Plasma processing instrument cleaning is an important process to improve the cleanliness of pads in integrated circuit chips. After plasma cleaning treatment, the shear strength and tensile strength of the ball are significantly enhanced. Ideally, during the tensile test, when the wire breaks in the span, the electrowelding should be maintained on the adhesive pad. PVAtepla's distinctive plasma effectively removes organic contaminants and metal oxides.

Plasma cleaner cleaning is also suitable for touch display processing. For example, before bonding, the LCD screen or OLED terminal is removed from the organic contaminants at the junction, and then fused with the conductive film. In addition to this, plasma activity against glass in integrated IC mounting (COG) pretreatment is another key application.

Name	Jet type plasma processing system
Plasma power model	CRF-APO-R&D-XXXHD
Direct jet type plasma spray gun modet	Rotary spray type: RXX (Option: 20mm-80mm)
Power supply	220V/AC,50/60Hz
Power	600-1000W/25KHz（Option）
Power factor	0.98
Processing height	5-15mm
Processing width	Rotary spray type: 20-80mm (Option)
Internal control mode	numerical control
External control mode	RS485/RS232, analog communication port, start-stop I/O
Operating Gas (Gas)	Compressed Air （0.4mpa）/N2（0.2mpa）
Power weight	10kg

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- Commodity name: Jet-type AP plasma treatment system CRF-APO-RP1020-D
- Commodity ID: CRF-APO-RP1020-D
- Plasma产品名称:
- Plasma参数:
Product Features:

PFC full-bridge digital plasma power supply is adopted, with stable output power, strong anti-interference ability and fast response;

A variety of plasma spray guns and nozzles can be selected to be used in different occasions to meet a variety of different products and processing environments;

The small size of the device makes it easy to carry and move, saving customers space;

It can be installed in the customer's equipment production line to reduce customer input costs;

Long service life, low maintenance and repair cost, convenient for customer cost control;

Scope of application:

Plasma cleaning machine plasma processing instrument is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pretreatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.

Plasma cleaning is the only way to improve product yield. Flip-chip machines are becoming more and more visible in the market, and plasma technology has an incomparable advantage in penetrating the fine voids of the mold, and the surface layer can be activated and activated regardless of the size of the object.

Plasma treatment systems provide fast, uniform cleaning or peeling results. The cleaning process of plasma processing instrument is made by heating a high concentration of free radicals and low density plasma. Good uniformity, good process manipulation control, and hands-on operation on a single substrate are critical.

Pre-package plasma cleaning and activation:
The cleaning activity of plasma processing instrument has a significant improvement effect on the package mold adhesion characteristics in semiconductor material microintegrated circuit chips. Highly reactive plasma uses the organic chemical kinetic energy of free radicals to treat a wide variety of substrate surfaces: weld mask materials, mold passivation treatment layers, pad and lead frame surfaces, etc. This clears the mold delamination challenge and, depending on the plasma applied to polyvinyl alcohol, there is no electrostatic induced discharge or other potentially hazardous adverse reactions.

Plasma etching packaging:
The packaging of packaged components such as integrated circuit chip IC and printed circuit board PCB makes the internal components exposed. Open the depackaging device to inspect the mold, the joint, and the characteristics it inspects during common fault analysis. The selective etching of polymer encapsulation materials is the key basis for component failure analysis, without compromising the consistency of the wire and component layers. Plasma cleaning is used to clean and remove the encapsulation material, and plasma etching is highly selective and will not be affected by the plasma etching process.

Plasma cleaning before soldering:
Plasma processing instrument cleaning is an important process to improve the cleanliness of pads in integrated circuit chips. After plasma cleaning treatment, the shear strength and tensile strength of the ball are significantly enhanced. Ideally, during the tensile test, when the wire breaks in the span, the electrowelding should be maintained on the adhesive pad. PVAtepla's distinctive plasma effectively removes organic contaminants and metal oxides.

Plasma cleaner cleaning is also suitable for touch display processing. For example, before bonding, the LCD screen or OLED terminal is removed from the organic contaminants at the junction, and then fused with the conductive film. In addition to this, plasma activity against glass in integrated IC mounting (COG) pretreatment is another key application.

Name	Jet type plasma processing system
Plasma power model	CRF-APO-R&D-XXXHD
Direct jet type plasma spray gun modet	Rotary spray type: RXX (Option: 20mm-80mm)
Power supply	220V/AC,50/60Hz
Power	600-1000W/25KHz（Option）
Power factor	0.98
Processing height	5-15mm
Processing width	Rotary spray type: 20-80mm (Option)
Internal control mode	numerical control
External control mode	RS485/RS232, analog communication port, start-stop I/O
Operating Gas (Gas)	Compressed Air （0.4mpa）/N2（0.2mpa）
Power weight	10kg

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Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.

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