A variety of plasma spray guns and nozzles can be selected to be used in different occasions to meet a variety of different products and processing environments;

The small size of the device makes it easy to carry and move, saving customers space;

It can be installed in the customer's equipment production line in the in-line type, reducing the customer's input cost;

Long service life, low maintenance and repair cost, convenient for customer cost control.

Scope of application

Plasma treatment equipment is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pre-treatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.

Plasma is a state of existence of matter, generally substances exist in solid, liquid, gas three situations, but in some special cases can exist in the fourth state, such as the surface of the sun and ionized substances in the atmosphere. This type of substance is in a condition called plasma, the fourth state of matter. The following substances are present in plasma: electrons running at high speed, neutral atoms, molecules, atomic groups (free radicals), ionized atoms, molecules; Ultraviolet light, unreacted molecules, atoms, etc. generated by the molecular structure dissociation reaction, but the substance still maintains a neutral charge balance.

The equipment produced by plasma treatment equipment manufacturers can be used to eliminate the degreasing organic matter and oxide layer cleaning on the metal surface, and carry out plasma treatment before sputtering, spraying, bonding, welding, soldering and PVD, CVD coating, in order to obtain a completely clean surface without oxidation. Plasma resolution in such conditions can cause the following reactions:

1. Organic layer on the ashed surface:
the surface of the material will be subjected to chemical bombardment; Pollutants will evaporate when subjected to high temperatures; Environmental pollutants are broken up under the impact of higher energy positive ions and subsequently released.
Because plasma is only a few nanometers thick per second, the contamination layer should not be too thick.

2. Plasma cleaning equipment is used to remove metal oxides:
the oxide and the treated gas produce chemical changes, this process is carried out with hydrogen or a mixture of hydrogen and argon. Sometimes a two-step production process is used, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.

3. Plasma etching for welding:
Under normal circumstances, the printed circuit board is treated with organic chemical flux before welding. This chemical needs to be removed by plasma method after welding, otherwise corrosion and other problems will occur.

4. Plasma degumming and bonding:
the residues in the electroplating process, bonding and welding work will weaken the excellent bonding, and this residue can be selectively removed by the plasma method. In addition, air oxidation, which also jeopardizes the quality of bonding, also requires plasma cleaning.

- Commodity name: Jet-type AP plasma treatment system CRF-APO-R&D-DXX
- Commodity ID: CRF-APO-R＆D-DXX
- Plasma产品名称:
- Plasma参数:
Product features

A variety of plasma spray guns and nozzles can be selected to be used in different occasions to meet a variety of different products and processing environments;

The small size of the device makes it easy to carry and move, saving customers space;

It can be installed in the customer's equipment production line in the in-line type, reducing the customer's input cost;

Long service life, low maintenance and repair cost, convenient for customer cost control.

Scope of application

Plasma treatment equipment is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pre-treatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.

Plasma is a state of existence of matter, generally substances exist in solid, liquid, gas three situations, but in some special cases can exist in the fourth state, such as the surface of the sun and ionized substances in the atmosphere. This type of substance is in a condition called plasma, the fourth state of matter. The following substances are present in plasma: electrons running at high speed, neutral atoms, molecules, atomic groups (free radicals), ionized atoms, molecules; Ultraviolet light, unreacted molecules, atoms, etc. generated by the molecular structure dissociation reaction, but the substance still maintains a neutral charge balance.

The equipment produced by plasma treatment equipment manufacturers can be used to eliminate the degreasing organic matter and oxide layer cleaning on the metal surface, and carry out plasma treatment before sputtering, spraying, bonding, welding, soldering and PVD, CVD coating, in order to obtain a completely clean surface without oxidation. Plasma resolution in such conditions can cause the following reactions:

1. Organic layer on the ashed surface:
the surface of the material will be subjected to chemical bombardment; Pollutants will evaporate when subjected to high temperatures; Environmental pollutants are broken up under the impact of higher energy positive ions and subsequently released.
Because plasma is only a few nanometers thick per second, the contamination layer should not be too thick.

2. Plasma cleaning equipment is used to remove metal oxides:
the oxide and the treated gas produce chemical changes, this process is carried out with hydrogen or a mixture of hydrogen and argon. Sometimes a two-step production process is used, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.

3. Plasma etching for welding:
Under normal circumstances, the printed circuit board is treated with organic chemical flux before welding. This chemical needs to be removed by plasma method after welding, otherwise corrosion and other problems will occur.

4. Plasma degumming and bonding:
the residues in the electroplating process, bonding and welding work will weaken the excellent bonding, and this residue can be selectively removed by the plasma method. In addition, air oxidation, which also jeopardizes the quality of bonding, also requires plasma cleaning.

Name	Jet type plasma processing system
Plasma power model	CRF-APO-R＆D-XXXD
Direct jet type plasma spray gun modet	Direct injection: DXX (Option: 2mm-6mm)
Power supply	220V/AC,50/60Hz
Power	1000W/25KHz（Option）
Power factor	0.8
Processing height	5-15mm
Processing width	Direct jet type：1-6mm（Option）
Internal control mode	Digital control
External conteol mode	Start/stop I/O (ON/OFF I/O)
Operating Gas (Gas)	Compressed Air （0.4mpa）/N2（0.2mpa）
Power weight	8kg

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- Commodity name: Jet-type AP plasma treatment system CRF-APO-R&D-DXX
- Commodity ID: CRF-APO-R＆D-DXX
- Plasma产品名称:
- Plasma参数:
Product features

A variety of plasma spray guns and nozzles can be selected to be used in different occasions to meet a variety of different products and processing environments;

The small size of the device makes it easy to carry and move, saving customers space;

It can be installed in the customer's equipment production line in the in-line type, reducing the customer's input cost;

Long service life, low maintenance and repair cost, convenient for customer cost control.

Scope of application

Plasma treatment equipment is mainly used in the electronics industry mobile phone case printing, coating, dispensing and other pre-treatment, mobile phone screen surface treatment; connector surface cleaning; Screen printing, transfer pre-processing, etc. for general industries.

Plasma is a state of existence of matter, generally substances exist in solid, liquid, gas three situations, but in some special cases can exist in the fourth state, such as the surface of the sun and ionized substances in the atmosphere. This type of substance is in a condition called plasma, the fourth state of matter. The following substances are present in plasma: electrons running at high speed, neutral atoms, molecules, atomic groups (free radicals), ionized atoms, molecules; Ultraviolet light, unreacted molecules, atoms, etc. generated by the molecular structure dissociation reaction, but the substance still maintains a neutral charge balance.

The equipment produced by plasma treatment equipment manufacturers can be used to eliminate the degreasing organic matter and oxide layer cleaning on the metal surface, and carry out plasma treatment before sputtering, spraying, bonding, welding, soldering and PVD, CVD coating, in order to obtain a completely clean surface without oxidation. Plasma resolution in such conditions can cause the following reactions:

1. Organic layer on the ashed surface:
the surface of the material will be subjected to chemical bombardment; Pollutants will evaporate when subjected to high temperatures; Environmental pollutants are broken up under the impact of higher energy positive ions and subsequently released.
Because plasma is only a few nanometers thick per second, the contamination layer should not be too thick.

2. Plasma cleaning equipment is used to remove metal oxides:
the oxide and the treated gas produce chemical changes, this process is carried out with hydrogen or a mixture of hydrogen and argon. Sometimes a two-step production process is used, starting with oxygen to oxidize the surface layer for five minutes, followed by a mixture of hydrogen and argon to remove the oxide layer.

3. Plasma etching for welding:
Under normal circumstances, the printed circuit board is treated with organic chemical flux before welding. This chemical needs to be removed by plasma method after welding, otherwise corrosion and other problems will occur.

4. Plasma degumming and bonding:
the residues in the electroplating process, bonding and welding work will weaken the excellent bonding, and this residue can be selectively removed by the plasma method. In addition, air oxidation, which also jeopardizes the quality of bonding, also requires plasma cleaning.

Name	Jet type plasma processing system
Plasma power model	CRF-APO-R＆D-XXXD
Direct jet type plasma spray gun modet	Direct injection: DXX (Option: 2mm-6mm)
Power supply	220V/AC,50/60Hz
Power	1000W/25KHz（Option）
Power factor	0.8
Processing height	5-15mm
Processing width	Direct jet type：1-6mm（Option）
Internal control mode	Digital control
External conteol mode	Start/stop I/O (ON/OFF I/O)
Operating Gas (Gas)	Compressed Air （0.4mpa）/N2（0.2mpa）
Power weight	8kg

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Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.

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