PRODUCTS

Product features

● Large processing space, improve processing capacity, adopt PLC + touch screen control system, accurate control equipment operation;
● The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;
● High precision, fast response, good control and compatibility, perfect function and professional technical support.
 

Scope of application

Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft and hard combination board plasma surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Surface roughening, etching and activation of silica gel, plastic, polymer in the field of silica gel, plastic and polymer.

The vacuum plasma cleaner adopts the excitation plasma method as the cleaning medium, which can effectively prevent the secondary pollution caused by the liquid cleaning substance to the cleaned target. The machine is equipped with a vacuum pump, which can discharge the pollutants reacted in the plasma while maintaining the vacuum in the vacuum chamber of the vacuum equipment, so that the pollutants can be quickly and completely eliminated in a short time.

The design scheme of vacuum plasma cleaning machine is reasonable and effective, and it needs to be combined with different materials. Antistatic support brackets avoid the effects of static electricity on the product. The plasma cleaner can complete the ion implantation, activation and cleaning of the surface layer of the product according to plasma bombardment or chemical reaction. Bonding the surface layer can significantly enhance the compressive strength of the bond.

The plasma cleaner has safety functions such as overcurrent leakage protector, power switch, self-diagnosis power circuit, abnormal phenomenon buzzer alarm and so on. At present, it is used for cleaning and etching processes of liquid crystal displays, LEDs, integrated circuit chips, printed circuit boards, SMD types, BGA, wire frames, touch panels, etc. Plasma cleaning integrated circuit chips can significantly enhance the bonding strength and reduce the probability of circuit failure. Upon contact with the plasma, residual photoresists, epoxy resins, organic solvent residues and other organic contaminants can be removed in a short time.

The vacuum plasma cleaning machine adopts temperature, working pressure, abnormal alarm lamp three-layer alarm light, which can monitor and operate the operation of machinery and equipment in real time. In electronics, aviation and other industrial processes, the reliability of plasma cleaners depends on the strength of the bond between the surface layers of the two materials. Whether metal, porcelain, polymers, plastics or their composites, plasma can improve adhesion and product quality.

Plasma cleaners can also change the surface properties of some materials according to specific conditions. Glow discharge during cleaning of plasma equipment improves adhesion, compatibility and lubricity of these materials. The power supply of the cleaning machine adopts RF power supply, stable and reliable power amplifier module and DC module, ensures the RF output power output of the power supply, and adopts high-quality electronic components to ensure product reliability.

Product features

● Large processing space, improve processing capacity, adopt PLC + touch screen control system, accurate control equipment operation;
● The equipment cavity capacity and number of layers can be customized according to customer requirements to meet customer needs; Low maintenance and repair cost, convenient for customer cost control;
● High precision, fast response, good control and compatibility, perfect function and professional technical support.
 

Scope of application

Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, drilling dirt removal, soft board, soft and hard combination board plasma surface cleaning, drilling dirt removal, flexible board activation before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire punching and soldering; Surface roughening, etching and activation of silica gel, plastic, polymer in the field of silica gel, plastic and polymer.

The vacuum plasma cleaner adopts the excitation plasma method as the cleaning medium, which can effectively prevent the secondary pollution caused by the liquid cleaning substance to the cleaned target. The machine is equipped with a vacuum pump, which can discharge the pollutants reacted in the plasma while maintaining the vacuum in the vacuum chamber of the vacuum equipment, so that the pollutants can be quickly and completely eliminated in a short time.

The design scheme of vacuum plasma cleaning machine is reasonable and effective, and it needs to be combined with different materials. Antistatic support brackets avoid the effects of static electricity on the product. The plasma cleaner can complete the ion implantation, activation and cleaning of the surface layer of the product according to plasma bombardment or chemical reaction. Bonding the surface layer can significantly enhance the compressive strength of the bond.

The plasma cleaner has safety functions such as overcurrent leakage protector, power switch, self-diagnosis power circuit, abnormal phenomenon buzzer alarm and so on. At present, it is used for cleaning and etching processes of liquid crystal displays, LEDs, integrated circuit chips, printed circuit boards, SMD types, BGA, wire frames, touch panels, etc. Plasma cleaning integrated circuit chips can significantly enhance the bonding strength and reduce the probability of circuit failure. Upon contact with the plasma, residual photoresists, epoxy resins, organic solvent residues and other organic contaminants can be removed in a short time.

The vacuum plasma cleaning machine adopts temperature, working pressure, abnormal alarm lamp three-layer alarm light, which can monitor and operate the operation of machinery and equipment in real time. In electronics, aviation and other industrial processes, the reliability of plasma cleaners depends on the strength of the bond between the surface layers of the two materials. Whether metal, porcelain, polymers, plastics or their composites, plasma can improve adhesion and product quality.

Plasma cleaners can also change the surface properties of some materials according to specific conditions. Glow discharge during cleaning of plasma equipment improves adhesion, compatibility and lubricity of these materials. The power supply of the cleaning machine adopts RF power supply, stable and reliable power amplifier module and DC module, ensures the RF output power output of the power supply, and adopts high-quality electronic components to ensure product reliability.