PRODUCTS

Product features

● Automatic plasma cleaning machine is used in FPC & PCB surface treatment, composite materials, glass, ITO and other industry surface treatment;

● Patented built-in cooling system to improve and ensure the service life and performance of equipment;

● Flexible On-Line installation method, the energy of electrons and ions can reach more than 10eV, and the efficiency of material batch processing can be more than 10 times higher than the efficiency of low-pressure glow discharge device.

Automatic plasma treatment system plasma cleaning machine manufacturers plasma cleaning technology specific applications:
1, high thickness to diameter ratio of double-layer flexible board degumming slag, hard and soft fusion plate degumming slag to improve the bonding compressive strength of the hole edge and the copper plating layer, remove the rubber slag to improve reliability, and avoid the open circuit caused by copper plating in the inner layer.
2. The modification activity of the surface layer of the front hole wall of the high-frequency copper immersion Teflon plate improves the bonding force between the hole wall and the copper plating layer, and avoids the condition of black holes and bursting holes. Solder mask and character front plate activation effectively prevent solder mask character shedding.
3. The through-hole and blind/buried vias of the laser on the HDI board eliminate the carbon compound cauterized by the laser. Microplates with a diameter of less than 50 μm are more effective than the pore size specifications.
4. When the plasma cleaning machine is carefully making the line, the film residue of the dry film is removed.
5. The surface of PI before pressing the composite type of hard and flexible board is passivated, and the tensile force value of the surface roughening treatment of the PI surface before the reinforcement of the flexible circuit board can be increased by more than ten times.
6. Before the chemical precipitation/electroplating process, the finger and pad surface are cleaned to eliminate the solder mask ink and other residues to improve the adhesion. Because of its reliability, some large flexible sheet processing plants have chosen plasma automatic equipment instead of traditional plate grinding machines.
7. After chemical precipitation/electroplating, the surface layer of SMT front pad removal improves solderability, avoids the empty welding rate and low tin rate before SMT, and improves the strength.
8. Cleaning of the surface layer of PCB board BGA packaging, pretreatment of gold wire, and pre-packaging production and processing of EMC to change the wire/connection strength.
9. The LCD industry module board removes the pollution in the process of gold finger air oxidation and pressing protective film, such as glue leakage, etc., and cleans the surface layer before the polarizer is laminated.
10. IC semiconductor material industry semiconductor material polishing sheet (Wafer), the removal of oxide film and organic compounds; The cleaning of external pollutants such as COB/COG/COF/ACF during the processing process improves adhesion and reliability.
11. The pad surface is cleaned before wire wiring in the LED industry, and the organic compounds are removed.
12. Like PTFE, plastic, glass, porcelain and polypropylene are not organic, so this material needs plasma treatment before printing and dispensing. Glass and porcelain surfaces are also slightly contaminated with metal materials, plasma cleaners, silicone functional key connectors, polymer surface modification can improve printing and coating adhesion.

Product features

● Automatic plasma cleaning machine is used in FPC & PCB surface treatment, composite materials, glass, ITO and other industry surface treatment;

● Patented built-in cooling system to improve and ensure the service life and performance of equipment;

● Flexible On-Line installation method, the energy of electrons and ions can reach more than 10eV, and the efficiency of material batch processing can be more than 10 times higher than the efficiency of low-pressure glow discharge device.

Automatic plasma treatment system plasma cleaning machine manufacturers plasma cleaning technology specific applications:
1, high thickness to diameter ratio of double-layer flexible board degumming slag, hard and soft fusion plate degumming slag to improve the bonding compressive strength of the hole edge and the copper plating layer, remove the rubber slag to improve reliability, and avoid the open circuit caused by copper plating in the inner layer.
2. The modification activity of the surface layer of the front hole wall of the high-frequency copper immersion Teflon plate improves the bonding force between the hole wall and the copper plating layer, and avoids the condition of black holes and bursting holes. Solder mask and character front plate activation effectively prevent solder mask character shedding.
3. The through-hole and blind/buried vias of the laser on the HDI board eliminate the carbon compound cauterized by the laser. Microplates with a diameter of less than 50 μm are more effective than the pore size specifications.
4. When the plasma cleaning machine is carefully making the line, the film residue of the dry film is removed.
5. The surface of PI before pressing the composite type of hard and flexible board is passivated, and the tensile force value of the surface roughening treatment of the PI surface before the reinforcement of the flexible circuit board can be increased by more than ten times.
6. Before the chemical precipitation/electroplating process, the finger and pad surface are cleaned to eliminate the solder mask ink and other residues to improve the adhesion. Because of its reliability, some large flexible sheet processing plants have chosen plasma automatic equipment instead of traditional plate grinding machines.
7. After chemical precipitation/electroplating, the surface layer of SMT front pad removal improves solderability, avoids the empty welding rate and low tin rate before SMT, and improves the strength.
8. Cleaning of the surface layer of PCB board BGA packaging, pretreatment of gold wire, and pre-packaging production and processing of EMC to change the wire/connection strength.
9. The LCD industry module board removes the pollution in the process of gold finger air oxidation and pressing protective film, such as glue leakage, etc., and cleans the surface layer before the polarizer is laminated.
10. IC semiconductor material industry semiconductor material polishing sheet (Wafer), the removal of oxide film and organic compounds; The cleaning of external pollutants such as COB/COG/COF/ACF during the processing process improves adhesion and reliability.
11. The pad surface is cleaned before wire wiring in the LED industry, and the organic compounds are removed.
12. Like PTFE, plastic, glass, porcelain and polypropylene are not organic, so this material needs plasma treatment before printing and dispensing. Glass and porcelain surfaces are also slightly contaminated with metal materials, plasma cleaners, silicone functional key connectors, polymer surface modification can improve printing and coating adhesion.