PRODUCTS

Super processing space to enhance processing capacity, PLC + touch screen control system for precise control of equipment operation;<br> The capacity of the cavity and the number of layers of the equipment can be customized according to customer requirements to meet customer needs; low maintenance and repair costs to facilitate customer cost control；<br> High precision, fast response, good maneuverability and compatibility, perfect functions and professional technical support.

Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning, de-drilling dirt, soft board, soft and hard combination board surface cleaning, de-drilling dirt, soft board before reinforcement activation. Semiconductor IC field: COB, COG, COF, ACF process, for cleaning before hitting the line and soldering; silicone, plastic, polymer field silicone, plastic, polymer surface roughening, etching, activation.

Vacuum plasma treatment equipment is also known as plasma surface processor, plasma treatment machine, commonly used for precision machinery and equipment, printing and dyeing, powder materials, automotive industry, aerospace, pollution control and other high-tech industry activity, modification. Plasma cleaning technology of is the use of low-temperature plasma, it is a dry environmentally friendly treatment equipment. Plasma cleaning machine mainly relies on high temperature, high frequency, high energy and other external conditions.

The plasma treatment of vacuum plasma treatment equipment is a dry process. Using electric energy to catalyze the reaction, it can provide a low temperature working environment and avoid using dangerous wet chemical cleaning substances. It belongs to the safe, reliable and environmentally friendly. Simply put, plasma cleaning technology incorporates plasma physical, chemical and solid state surface reactions, which can reasonably and effectively eliminate residual contaminants from the material surface and ensure that the material surface and its own characteristics are not affected.

The plasma cleaning technology of vacuum plasma processing equipment has excellent processing effect on semiconductor materials, metal materials and polymer most of the fiber materials, regardless of the shape of the material to be processed, the overall, specified local and complicated structure of the cleaning can be completed. The processing process is easy to realize automation and intelligence, and is equipped with high precision manipulation equipment that can accurately control time, memory points and other functions. Due to its practical ease of operation, high precision, good maneuverability and environmental protection, plasma cleaning technology for material surface modification, activation etching and other functions have been well received in many industries. After cleaning with plasma cleaning machine, there is no residue on the surface layer of the material, and according to the selection and pairing of different plasma cleaning methods, it can achieve different cleaning effects, which can meet the various requirements of the subsequent production process for material processing. Because the plasma is not strong in specificity, it can also adapt to the processing of objects with complicated structures such as depressions, holes, and folds.

• CRF-VPO-MC -6L

Super processing space to enhance processing capacity, PLC + touch screen control system for precise control of equipment operation;<br> The capacity of the cavity and the number of layers of the equipment can be customized according to customer requirements to meet customer needs; low maintenance and repair costs to facilitate customer cost control；<br> High precision, fast response, good maneuverability and compatibility, perfect functions and professional technical support.

Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning, de-drilling dirt, soft board, soft and hard combination board surface cleaning, de-drilling dirt, soft board before reinforcement activation. Semiconductor IC field: COB, COG, COF, ACF process, for cleaning before hitting the line and soldering; silicone, plastic, polymer field silicone, plastic, polymer surface roughening, etching, activation.

Vacuum plasma treatment equipment is also known as plasma surface processor, plasma treatment machine, commonly used for precision machinery and equipment, printing and dyeing, powder materials, automotive industry, aerospace, pollution control and other high-tech industry activity, modification. Plasma cleaning technology of is the use of low-temperature plasma, it is a dry environmentally friendly treatment equipment. Plasma cleaning machine mainly relies on high temperature, high frequency, high energy and other external conditions.

The plasma treatment of vacuum plasma treatment equipment is a dry process. Using electric energy to catalyze the reaction, it can provide a low temperature working environment and avoid using dangerous wet chemical cleaning substances. It belongs to the safe, reliable and environmentally friendly. Simply put, plasma cleaning technology incorporates plasma physical, chemical and solid state surface reactions, which can reasonably and effectively eliminate residual contaminants from the material surface and ensure that the material surface and its own characteristics are not affected.

The plasma cleaning technology of vacuum plasma processing equipment has excellent processing effect on semiconductor materials, metal materials and polymer most of the fiber materials, regardless of the shape of the material to be processed, the overall, specified local and complicated structure of the cleaning can be completed. The processing process is easy to realize automation and intelligence, and is equipped with high precision manipulation equipment that can accurately control time, memory points and other functions. Due to its practical ease of operation, high precision, good maneuverability and environmental protection, plasma cleaning technology for material surface modification, activation etching and other functions have been well received in many industries. After cleaning with plasma cleaning machine, there is no residue on the surface layer of the material, and according to the selection and pairing of different plasma cleaning methods, it can achieve different cleaning effects, which can meet the various requirements of the subsequent production process for material processing. Because the plasma is not strong in specificity, it can also adapt to the processing of objects with complicated structures such as depressions, holes, and folds.

• CRF-VPO-MC -6L