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CRF-VPO-8L-M
The capacity and number of layers of the cavity of the equipment can be customized according to customer requirements to meet customer needs; low maintenance and repair costs to facilitate customer cost control;
High precision, fast response, good maneuverability and compatibility, perfect functions and professional technical support.
Applications
Equipment parameters
Applications
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning, de-drilling, soft board, soft and hard combination board plasma surface cleaning, de-drilling, soft board reinforcement before activation. Semiconductor IC field: COB, COG, COF, ACF process, for cleaning before hitting the line, soldering; silicone, plastic, polymer field silicone, plastic, polymer surface roughening, etching, activation.
Vacuum plasma cleaning machine using the excitation of plasma as the cleaning medium, can effectively prevent the secondary pollution caused by liquid cleaning substances to the target being cleaned. The machine equipment is equipped with a vacuum pump, in the maintenance of vacuum equipment cavity vacuum conditions, can be the plasma in the reaction of the pollutant discharge, that can be quickly and completely eliminate pollutants in a short period of time.
Vacuum plasma cleaning machine design scheme is reasonable and effective, need to match the combination for different materials. Anti-static support frame can avoid the effect of static electricity on the product. Plasma cleaning machine can be based on plasma bombardment or chemical reaction to complete the product surface ion injection, activation and cleaning. Bonding to the surface layer can significantly enhance the bonding compressive strength.
Plasma cleaning machine has over-current leakage protector power switch, self-diagnosis power circuit, abnormal phenomenon buzzer alarm and other safety roles. At this stage for the LCD, LED, integrated circuit chips, printed circuit boards, SMD, BGA, wire frame, touch panel and other cleaning and etching process. Plasma cleaning integrated circuit chips can significantly enhance the bonding strength and reduce the probability of circuit invalidation. After touching the plasma, the residual photoresist, epoxy resin, organic solvent residues and other organic pollutants can be removed in a short time.
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- Commodity name: CRF-VPO-8L-M
- Commodity ID: CRF-VPO-8L-M
- Plasma产品名称:
- Plasma参数:
Super processing space to enhance processing capacity, PLC + touch screen control system for precise control of equipment operation;<br> The capacity and number of layers of the cavity of the equipment can be customized according to customer requirements to meet customer needs; low maintenance and repair costs to facilitate customer cost control;<br> High precision, fast response, good maneuverability and compatibility, perfect functions and professional technical support.
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning, de-drilling, soft board, soft and hard combination board plasma surface cleaning, de-drilling, soft board reinforcement before activation. Semiconductor IC field: COB, COG, COF, ACF process, for cleaning before hitting the line, soldering; silicone, plastic, polymer field silicone, plastic, polymer surface roughening, etching, activation.
Vacuum plasma cleaning machine using the excitation of plasma as the cleaning medium, can effectively prevent the secondary pollution caused by liquid cleaning substances to the target being cleaned. The machine equipment is equipped with a vacuum pump, in the maintenance of vacuum equipment cavity vacuum conditions, can be the plasma in the reaction of the pollutant discharge, that can be quickly and completely eliminate pollutants in a short period of time.
Vacuum plasma cleaning machine design scheme is reasonable and effective, need to match the combination for different materials. Anti-static support frame can avoid the effect of static electricity on the product. Plasma cleaning machine can be based on plasma bombardment or chemical reaction to complete the product surface ion injection, activation and cleaning. Bonding to the surface layer can significantly enhance the bonding compressive strength.
Plasma cleaning machine has over-current leakage protector power switch, self-diagnosis power circuit, abnormal phenomenon buzzer alarm and other safety roles. At this stage for the LCD, LED, integrated circuit chips, printed circuit boards, SMD, BGA, wire frame, touch panel and other cleaning and etching process. Plasma cleaning integrated circuit chips can significantly enhance the bonding strength and reduce the probability of circuit invalidation. After touching the plasma, the residual photoresist, epoxy resin, organic solvent residues and other organic pollutants can be removed in a short time.
Key words:- CRF-VPO-8L-M
-
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning, de-drilling, soft board, soft and hard combination board plasma surface cleaning, de-drilling, soft board reinforcement before activation. Semiconductor IC field: COB, COG, COF, ACF process, for cleaning before hitting the line, soldering; silicone, plastic, polymer field silicone, plastic, polymer surface roughening, etching, activation.
Vacuum plasma cleaning machine using the excitation of plasma as the cleaning medium, can effectively prevent the secondary pollution caused by liquid cleaning substances to the target being cleaned. The machine equipment is equipped with a vacuum pump, in the maintenance of vacuum equipment cavity vacuum conditions, can be the plasma in the reaction of the pollutant discharge, that can be quickly and completely eliminate pollutants in a short period of time.
Vacuum plasma cleaning machine design scheme is reasonable and effective, need to match the combination for different materials. Anti-static support frame can avoid the effect of static electricity on the product. Plasma cleaning machine can be based on plasma bombardment or chemical reaction to complete the product surface ion injection, activation and cleaning. Bonding to the surface layer can significantly enhance the bonding compressive strength.
Plasma cleaning machine has over-current leakage protector power switch, self-diagnosis power circuit, abnormal phenomenon buzzer alarm and other safety roles. At this stage for the LCD, LED, integrated circuit chips, printed circuit boards, SMD, BGA, wire frame, touch panel and other cleaning and etching process. Plasma cleaning integrated circuit chips can significantly enhance the bonding strength and reduce the probability of circuit invalidation. After touching the plasma, the residual photoresist, epoxy resin, organic solvent residues and other organic pollutants can be removed in a short time.
-
Name
Vacuum type plasma treatment system
Model
CRF-VPO-8L-M
Control system
PLC + touch screen
Power supply
380V/AC,50/60Hz, 3kw
RF Power
600W/13.56MHz
Volume
80L(Option)
Electrode of plies
8(Option)
Area
400(L)*300(W)(Option)
Gas
Two working gas options:Ar、N2、H2、CF4、O2
Appearance
Sheet metal structure
-
- Commodity name: CRF-VPO-8L-M
- Commodity ID: CRF-VPO-8L-M
- Plasma产品名称:
- Plasma参数:
Super processing space to enhance processing capacity, PLC + touch screen control system for precise control of equipment operation;<br> The capacity and number of layers of the cavity of the equipment can be customized according to customer requirements to meet customer needs; low maintenance and repair costs to facilitate customer cost control;<br> High precision, fast response, good maneuverability and compatibility, perfect functions and professional technical support.
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning, de-drilling, soft board, soft and hard combination board plasma surface cleaning, de-drilling, soft board reinforcement before activation. Semiconductor IC field: COB, COG, COF, ACF process, for cleaning before hitting the line, soldering; silicone, plastic, polymer field silicone, plastic, polymer surface roughening, etching, activation.
Vacuum plasma cleaning machine using the excitation of plasma as the cleaning medium, can effectively prevent the secondary pollution caused by liquid cleaning substances to the target being cleaned. The machine equipment is equipped with a vacuum pump, in the maintenance of vacuum equipment cavity vacuum conditions, can be the plasma in the reaction of the pollutant discharge, that can be quickly and completely eliminate pollutants in a short period of time.
Vacuum plasma cleaning machine design scheme is reasonable and effective, need to match the combination for different materials. Anti-static support frame can avoid the effect of static electricity on the product. Plasma cleaning machine can be based on plasma bombardment or chemical reaction to complete the product surface ion injection, activation and cleaning. Bonding to the surface layer can significantly enhance the bonding compressive strength.
Plasma cleaning machine has over-current leakage protector power switch, self-diagnosis power circuit, abnormal phenomenon buzzer alarm and other safety roles. At this stage for the LCD, LED, integrated circuit chips, printed circuit boards, SMD, BGA, wire frame, touch panel and other cleaning and etching process. Plasma cleaning integrated circuit chips can significantly enhance the bonding strength and reduce the probability of circuit invalidation. After touching the plasma, the residual photoresist, epoxy resin, organic solvent residues and other organic pollutants can be removed in a short time.
Key words:- CRF-VPO-8L-M
-
Vacuum plasma cleaner is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning, de-drilling, soft board, soft and hard combination board plasma surface cleaning, de-drilling, soft board reinforcement before activation. Semiconductor IC field: COB, COG, COF, ACF process, for cleaning before hitting the line, soldering; silicone, plastic, polymer field silicone, plastic, polymer surface roughening, etching, activation.
Vacuum plasma cleaning machine using the excitation of plasma as the cleaning medium, can effectively prevent the secondary pollution caused by liquid cleaning substances to the target being cleaned. The machine equipment is equipped with a vacuum pump, in the maintenance of vacuum equipment cavity vacuum conditions, can be the plasma in the reaction of the pollutant discharge, that can be quickly and completely eliminate pollutants in a short period of time.
Vacuum plasma cleaning machine design scheme is reasonable and effective, need to match the combination for different materials. Anti-static support frame can avoid the effect of static electricity on the product. Plasma cleaning machine can be based on plasma bombardment or chemical reaction to complete the product surface ion injection, activation and cleaning. Bonding to the surface layer can significantly enhance the bonding compressive strength.
Plasma cleaning machine has over-current leakage protector power switch, self-diagnosis power circuit, abnormal phenomenon buzzer alarm and other safety roles. At this stage for the LCD, LED, integrated circuit chips, printed circuit boards, SMD, BGA, wire frame, touch panel and other cleaning and etching process. Plasma cleaning integrated circuit chips can significantly enhance the bonding strength and reduce the probability of circuit invalidation. After touching the plasma, the residual photoresist, epoxy resin, organic solvent residues and other organic pollutants can be removed in a short time.
-
Name
Vacuum type plasma treatment system
Model
CRF-VPO-8L-M
Control system
PLC + touch screen
Power supply
380V/AC,50/60Hz, 3kw
RF Power
600W/13.56MHz
Volume
80L(Option)
Electrode of plies
8(Option)
Area
400(L)*300(W)(Option)
Gas
Two working gas options:Ar、N2、H2、CF4、O2
Appearance
Sheet metal structure
Our Partners
Ltd. is a high-tech enterprise specialized in providing plasma equipment and process solutions. As a plasma cleaning machine manufacturer, we use plasma surface treatment technology to solve product surface treatment problems for our customers.












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