PRODUCTS

Automatic plasma cleaning machine applied to FPC & PCB surface treatment, composite materials, glass, ITO and other industry fields of surface treatment;<br> Patented design of built-in cooling system to improve and ensure the life and performance of the equipment;<br> With flexible On-Line installation, the energy of electrons and ions can reach more than 10eV, and the efficiency of material batch processing can be more than 10 times higher than the efficiency of low-pressure glow discharge device.

1, high thickness to diameter ratio of the double-layer soft board to remove the slag, hard and soft fusion board to remove the slag to improve the hole edge and copper plating layer bonding compressive strength, remove the slag to enhance reliability and avoid copper plating of the inner layer after causing open circuit.

2, high frequency sink copper Teflon plate before the hole wall surface modification activity to improve the hole wall and copper plating layer bonding strength, to avoid the black hole, burst hole condition. Solder resist and character before the board activation effectively avoid solder resist character off.

3, HDI board laser through-hole, blind / buried holes to eliminate the laser burned carbon compounds. Not subject to the specifications of the aperture, the diameter of less than 50μm microporous plate actual effect is more significant.

4、Plasma cleaning machine in the meticulous production line to remove the film residue of the dry film.

5, hard and soft board composite pressed together before PI surface passivation treatment, flexible circuit board reinforcement before PI surface roughening treatment tensile strength value can be increased beyond ten times.

6, chemical sink gold / plating process before the finger, pad surface cleaning to eliminate solder resist ink and other residues, improve adhesion. Because of its reliability, some very large soft plate processing plant has chosen plasma fully automatic equipment to replace the traditional type of grinding machine.

7, chemical sink gold / plating, SMT before the pad surface clearance to improve the solderability, to avoid the SMT before the virtual solder empty solder rate, the low rate of tin, improve the strength.

8, PCB board BGA packaging before the surface layer of the cleaning, hit the gold line pre-processing, EMC pre-encapsulation production processing to change the alignment / connection strength.

9, LCD LCD industry module board to remove the gold finger air oxidation and pressed together in the process of protection film pollution such as leakage of glue, polarizer lamination before cleaning the surface layer.

10, IC semiconductor materials industry semiconductor materials polishing sheet (Wafer), the removal of oxidation film, organic compounds; processing process of COB/COG/COF/ACF and other external pollutants clean, enhance the adhesion and reliability.

• CRF -APS- 500W

Automatic plasma cleaning machine applied to FPC & PCB surface treatment, composite materials, glass, ITO and other industry fields of surface treatment;<br> Patented design of built-in cooling system to improve and ensure the life and performance of the equipment;<br> With flexible On-Line installation, the energy of electrons and ions can reach more than 10eV, and the efficiency of material batch processing can be more than 10 times higher than the efficiency of low-pressure glow discharge device.

1, high thickness to diameter ratio of the double-layer soft board to remove the slag, hard and soft fusion board to remove the slag to improve the hole edge and copper plating layer bonding compressive strength, remove the slag to enhance reliability and avoid copper plating of the inner layer after causing open circuit.

2, high frequency sink copper Teflon plate before the hole wall surface modification activity to improve the hole wall and copper plating layer bonding strength, to avoid the black hole, burst hole condition. Solder resist and character before the board activation effectively avoid solder resist character off.

3, HDI board laser through-hole, blind / buried holes to eliminate the laser burned carbon compounds. Not subject to the specifications of the aperture, the diameter of less than 50μm microporous plate actual effect is more significant.

4、Plasma cleaning machine in the meticulous production line to remove the film residue of the dry film.

5, hard and soft board composite pressed together before PI surface passivation treatment, flexible circuit board reinforcement before PI surface roughening treatment tensile strength value can be increased beyond ten times.

6, chemical sink gold / plating process before the finger, pad surface cleaning to eliminate solder resist ink and other residues, improve adhesion. Because of its reliability, some very large soft plate processing plant has chosen plasma fully automatic equipment to replace the traditional type of grinding machine.

7, chemical sink gold / plating, SMT before the pad surface clearance to improve the solderability, to avoid the SMT before the virtual solder empty solder rate, the low rate of tin, improve the strength.

8, PCB board BGA packaging before the surface layer of the cleaning, hit the gold line pre-processing, EMC pre-encapsulation production processing to change the alignment / connection strength.

9, LCD LCD industry module board to remove the gold finger air oxidation and pressed together in the process of protection film pollution such as leakage of glue, polarizer lamination before cleaning the surface layer.

10, IC semiconductor materials industry semiconductor materials polishing sheet (Wafer), the removal of oxidation film, organic compounds; processing process of COB/COG/COF/ACF and other external pollutants clean, enhance the adhesion and reliability.

• CRF -APS- 500W