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Introduction of new resistive memory and the application of plasma etching in plasma Cleaning machine

Introduction of new resistive memory and the application of plasma etching in plasma Cleaning machine

Resistance changing Memory (Resistive Random Access Memory, RRAM) is one of the fast-growing non-volatile Memory, its storage mechanism and material is multivariate. The extensive use of metal and metal oxides means that the magnetotunneling metal material plasma cleaning machine etching problem will also be faced in the process of the graphics of resistive memory.   However, the storage mechanism of the RMS determines that the upper and lower electrodes of the RMS can adopt the same materials compatible with the logical process, thus greatly reducing the complexity and cost of r&d and mass production. The upper and lower electrodes (BE, Metal C, Metal D) and the resistive layer are all materials that will BE used in the logical back-end process. HfO2, TiN, Ti and W of the resistent layer are commonly used materials in logic process without cross contamination.   At present, RIE/ICP etching of plasma cleaning machine is still mostly used in the resistance memory, which is faced with problems such as too inclined etching profile of memory unit and serious lateral corrosion after etching metal electrode. Further progress should be made with subsequent process optimizations (power pulses, etc.) or the introduction of new reaction gases. Neutral beam etching (NBE) of plasma cleaning machine, which is unique in magnetic tunnel junction etching, is more inclined to form metal oxides in RRAM.

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Basic principle and application of plasma plasma cleaning machine surface treatment and degumming

Basic principle and application of plasma plasma cleaning machine surface treatment and degumming

1) Gel removal reaction principle: Oxygen is the main component of corrosive gases in dry rubber removal. Plasma plasma cleaning machine surface treatment of gel with high frequency and microwave energy weak electrolyte, so that oxygen ions, free oxygen molecules O, oxygen atoms and electron mixture in high frequency working voltage and lithography film reaction: O2→O*+O*, CxHy+O*→CO2↑+H2O↑, after the reaction is completed, remove CO2 and H2O.   2) Plasma plasma technology for gum removal: Take vacuum plasma cleaning machine as an example. The material to remove adhesive was placed in the vacuum system and inserted between two electrodes, and the high-voltage output power was increased under the sound chamber working pressure of 1.3-13PA. Glow charging and discharging was performed in the middle of the electrode. By adjusting the performance parameters such as output power and total flow rate, different speed of removing adhesive could be obtained.   Influence of plasma-cleaning machine surface treatment on removing glue: Frequency selection: the higher the frequency, the easier it is for oxygen ionization to produce plasma, the amplitude of electrons is less than the average category, the probability of collision between electrons and gas molecular structure is reduced, so that the weak electric solution speed is reduced. Frequency selection is usually 13.56MHz and 2.45GHz. Efficacy output: For a certain amount of gas, the output power is large, the density of active particles is large, and the degumming speed is fast. However, when the output power is increased to a certain value, the energy-consuming active ions reach saturation, and the degumming speed is not obvious when the output power is increased. The size of the power needs to be adjusted according to the actual application standard. Selection of vacuum value: the moderate increase of vacuum value can increase the average free motion of electrons and increase the kinetic energy obtained from electrostatic field, which is beneficial to the weak electrolyte. When oxygen fluidity is maintained, the higher the vacuum value, the greater the relative share of oxygen and the greater the concentration of specific particles. If the vacuum degree is too high, the concentration of the active particle will decrease. The influence of oxygen flow rate on the surface treatment of plasma plasma cleaning machine: high oxygen flow rate, high density of activated particles, fast degumming speed, but too fast, increase the probability of positive ion synthesis, reduce the average free path of electrons, reduce the compressive strength of the weak electrolyte. Assuming that the working pressure of the reflecting chamber is stable and the total flow rate rises, the gas extraction rate will also rise, and the pumping rate of the active particles not involved in the reaction will also rise, so the flow rate has no obvious effect on the degumming effect.

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Failure time of plasma surface treatment

Failure time of plasma surface treatment

Plasma surface treatment machine processing materials, surface failure time depends on the treatment of which kind of materials, different materials after processing can meet the relevant bonding function. Cleaning generally involves several links on the reaction mechanism: inorganic gas is fully mobilized into the plasma state, the gas adheres to the solid surface, and the adhesion group reacts with the solid surface to form the molecular structure of products; The molecular structure of the product is dissolved and the residue is shed after the reaction.   It can be measured with a Dyne pen and an antenna tester. Through repeated tests on different materials, it is found that the service life of some metal products is long and will fail after one or two days, while the service life of plexiglass and plastic board is short and even fails within a few minutes. Therefore, the next stage of processing should be carried out according to the aging effect of plasma equipment after processing the material surface.   After treatment, components or components cannot be stored outdoors because they absorb dust, organic air pollutants, and water. Shrink-wrapped products, for example, have a longer shelf life than products stored outdoors. In general, users are advised to proceed to the next step immediately after obtaining good surface energy from plasma surface processing to prevent the adverse effects of reduced surface energy.   The failure time of plasma surface treatment is mainly affected by gas type, process parameters, chemical composition, molecular structure and storage environment of materials. Therefore, in the specific processing material surface to be treated with equipment, surface to ensure that clean, storage temperature should not be too high, at the same time, timely completion of packaging, printing, spraying or bonding procedures, to prevent the debilitating effect of processing and surface adaptability reduced.

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Plasma cleaner plasma cleaning machine

Plasma cleaner plasma cleaning machine

Plasma cleaning machine dry cleaning, cleaning is a common concept in the electronic industry, it involves a process level, related to the removal of pollution sources, different parts of the cleaning method is different. In recent years, physical cleaning and chemical cleaning are widely used in mechanical manufacturing industry. According to the cleaning purposes, it can be divided into wet cleaning and dry cleaning. Plasma plasma plasma dry cleaning has been widely used in the industrial production of electronic products.   The key to wet cleaning is to use the effect of physical and chemical (organic solvent), such as adsorption, penetration, decomposition, separation, etc. to remove dirt with the physical properties of ultrasonic wave, spray, rotation, mechanical vibration, etc. This kind of cleaning function and application field are different, the cleaning effect is also different to some extent.   In the past, chlorofluorocarbons (CFCS) play a key role in cleaning efficiency and post-treatment, but they are limited by their damage to the ozone layer of atmospheric environment. Compared with the alternative technology, cleaning stage inevitably need to dry in the late (ODS cleaning does not need to be dry, but it will destroy the atmospheric ozone layer, limited use) and waste water treatment, need a lot of money for product safety in production, especially cleaning process of electronic components, precision machinery and equipment of high-speed development puts forward higher standards on cleaning process, pollution to air environment management has increased the investment cost of wet cleaning.   Plasma cleaning plasma dry cleaning has a considerable competitive advantage in this aspect, especially the cleaning process of plasma cleaning machine has been used in semiconductor materials, electronic devices, precision machinery and other manufacturing industries. Unlike wet cleaning, the basic principle of plasma cleaning is to remove contaminants from the surface by means of "activation" of plasma components. In terms of various cleaning methods, plasma cleaning is a thorough stripping cleaning method, a good way of environmental cleaning.

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Influence of plasma etching on HCI in plasma equipment

Influence of plasma etching on HCI in plasma equipment

The HCI in the reliability of plasma etching process refers to the degradation of device performance caused by high-energy electrons and holes injected into gate oxide layer. The interface state and oxide layer trap charges will be generated during injection, causing damage to the oxide layer. With the deepening of the damage degree, the current and voltage characteristics of the device will change. When the variation of device parameters exceeds a certain limit, the device will fail. The inhibition of hot carrier effect depends mainly on the choice of suitable source and substrate concentration, and the method of Lightly Doped Drain area (LDD) can be used to suppress the hot carrier effect quite well. Li studied plasma equipment such as plasma related process after injury grid oxide layer, the HCI performance significantly worse, this is because in the process of plasma equipment of plasma technology, grid will flow through a certain amount of current in the oxygen, the charging current will cause new oxide traps and interface state, when the hot carrier injection of oxide layer damage more easily.

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Plasma surface treatment equipment for the use of bottled compressed gas introduction

Plasma surface treatment equipment for the use of bottled compressed gas introduction

Compressed gas is a key component of industrialization. The compressed air commonly used in industrial production includes air compression and bottled compressed gas. Air compression is called the second power plant, only secondary to power engineering, it is also a multifunctional processing process gas; Industrial grade bottled gas is generally packaged in controllable gas bottles, the standard pressure is 13-15MPa, with the advantages of saving indoor space, safety and conducive to transportation. The compressed gas will be based on the application of specific working pressure reduction and stable working pressure, so how should the pressure of the gas of the plasma cleaner be regulated? Gas pressure control is one of the key factors to ensure the normal operation of plasma cleaning machine. Gas cylinder decompresser is a kind of equipment that changes the high pressure vapor body into the low pressure vapor body in the gas. The processing process vapor body applied by cleaning equipment is mainly the high pressure vapor body of the bottle, so as to ensure the reliability of various processing techniques and operation reliability. Generally, according to the use, the high pressure vapor body will be reduced to 0.2-0.4Mpa. In the application, it is necessary to ensure the tightness of the connection between the cylinder and the pressure reducer. The raw material belt is used as the sealing medium, and the thread of the cylinder mouth is wrapped when the reducer is installed on the cylinder. It is proposed to choose 3/8 interface to replace the original vertical connecting head, and choose the quick torsion connecting head or double jacket connecting head to ensure the tightness between the steam output pipe and the plasma cleaning machine. If the chemical gas is argon, it is suggested to decompress with oxygen. The reason is that the output working pressure of the argon gas decompressor is generally 0.15MPa. For example, if a bottle of gas is supplied to several cleaning machines, the output working pressure cannot be met, which is very easy to cause the working pressure alarm of the machine and equipment. Pneumatic pressure regulating valve is the key component of pneumatic control, its role is to manipulate the external vapor body in the required pressure, to ensure that its working pressure and flow stable. Whether it is vacuum plasma cleaning equipment or atmospheric pressure equipment input gas need to install pressure regulating valve, in order to ensure the cleanliness of the vapor body in the application. In order to facilitate the observation of air pressure, a barometer or a pressure regulating valve with a barometer should be installed on the pressure regulating valve. If you want to show an underpressure protection alarm, you can also select an alarm barometer or add a pressure controller. Pipeline throttle valves are commonly used in atmospheric plasma cleaning equipment, which can be used to adjust the size of the vent to achieve pressure and flow monitoring. The use of most of the fast fast plug joint, small volume. Atmospheric pressure plasma cleaning machine commonly used processing technology vapor body is a kind of clean compressed air, can also decide which kind of gas to use according to the effect of the treatment of products, the stability of the gas working pressure is far less than the vacuum cleaning machine. In addition, you can install a monitoring system if you want to view in real time.

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