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COG process of plasma surface cleaning technology glass substrate flexible circuit bare chip IC

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15 Mar,2022

COG process of plasma surface cleaning technology glass substrate flexible circuit bare chip IC:
In the LCD panel industry, in the production process of touch screen, notebook computer display screen and other products, the connection between the display screen and the flexible film circuit used to use the hot pressing method, that is, the flexible film circuit is directly attached to the LCD by heating and pressing. On glass with connection points, this process requires the glass plane to be clean, but the glass surface is easily contaminated during actual production, storage, and transportation. If it is not cleaned, fingerprints or dust will inevitably appear.
In the COG process of mounting bare chip IC on a glass substrate (LCD), when the chip is hardened at high temperature after bonding, there is a base plating layer on the surface of the bonding filler to form an analysis. There are also overflowing components of the connecting agent such as Ag paste, which contaminate the bonding filler. If these contaminants can be removed by plasma cleaning before the thermocompression bonding process, the quality of thermocompression bonding can be greatly improved. Furthermore, since the wettability of the substrate and the surface of the bare chip IC is improved, the adhesion and adhesion of the LCD-COG module can also be improved, and the problem of line corrosion can also be reduced.
When the surface of the material has high requirements for smoothness, it is necessary to conduct coating, deposition, bonding, etc. through surface activation without destroying the surface finish of the material, and use plasma for activation. The wetting effect of water droplets on the surface of the material after plasma activation is significantly stronger than that of other treatment methods. We used a plasma cleaning machine to do the cleaning test of the mobile phone screen, and found that the surface of the mobile phone screen after plasma treatment was completely infiltrated by water.
The current trend of assembly technology is mainly SIP, BGA, and CSP packaging, which make semiconductor devices develop in the direction of modularization, high integration and miniaturization. In such packaging and assembly processes, the major problems are organic contamination at the bonding filler and oxide films formed during electrical heating. Due to the presence of contaminants on the bonding surface, the bonding strength of these components is reduced and the potting strength of the resin after encapsulation is reduced, which directly affects the assembly level and continued development of these components. In order to improve and improve the assembly ability of these components, everyone is trying every means to deal with them. Improved practice has proved that proper introduction of plasma cleaning technology in the packaging process for surface treatment can greatly improve packaging reliability and improve yield.
The advantage of plasma equipment lies in the characteristics of surface cleaning, surface modification, and product performance improvement for products.