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The application of plasma surface cleaning technology in the field of IC packaging will become more and more extensive
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30 Jan,2022
The application of plasma surface cleaning technology in the field of IC packaging will become more and more extensive:
The current cleaning of electronic components is mainly plasma cleaning. Traditional electronic components are cleaned by wet method, and some components on the circuit board, such as crystal oscillators, have metal shells. After cleaning, it is difficult to dry the moisture inside the components. The water and other manual cleaning, the smell is big, the cleaning efficiency is low, and the labor cost is wasted.
Integrated circuits, or IC chips, are the complex building blocks of today's electronics. Modern IC chips include integrated circuits printed on a wafer and attached to a "package" that contains electrical connections to a printed circuit board on which the IC chip is soldered. Packaging for IC chips also provides head transfer away from the wafer and, in some cases, a lead frame around the wafer itself. When an IC chip includes a lead frame, the electrical connections on the die are bonded to pads on the lead frame, which is then soldered to the package.
In the field of IC chip manufacturing, plasma treatment technology has become an irreplaceable mature process, whether it is in the implantation of chip source ions, or the coating of wafers, or what our low-temperature plasma surface treatment equipment can achieve: Ultra-purification treatment and surface activation to remove oxide film, organic matter, and masking on the surface of the wafer improve the wettability of the wafer surface.
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