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Comparison of the advantages and disadvantages of the wet and dry etching methods

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06 Dec,2021

Comparison of the advantages and disadvantages of the wet and dry etching methods:
The wet cleaning system is suitable for advanced non-destructive megasonic cleaning. It can be used to make easily damaged substrates with or without patterns, including templates with protective films. In order to achieve a good cleaning effect while ensuring that the substrate is not damaged, the megasonic energy density must be kept slightly below the damage threshold at any position on the sample. The wet etching technology makes the surface acoustic energy of the substrate evenly distributed, increases the distributed energy to support ideal cleaning, and ensures that it is within the damage threshold of the sample. The system has high repeatability, good uniformity, Z-level advanced megasonic cleaning function, and megasonic assisted photoresist stripping and wet etching functions. The product can be subjected to non-destructive testing, chemical reagent cleaning, brush cleaning, drying, etc. according to the process steps.
Comparison of the advantages and disadvantages of the two wet and dry etching methods:
The wet etching system is an etching method in which the chemical reaction between a chemical etching solution and the object to be etched makes it peel off. Wet etching is mostly isotropic etching, which is not easy to control.
Features: Strong adaptability, uniform surface, little damage to silicon wafers, suitable for almost all metals, glass, plastics and other materials.
Disadvantages: The drawing quality is not ideal, and the small lines in the drawing are difficult to grasp.
The etching medium of the dry etching system is plasma, which uses plasma to react with the surface film to generate volatile substances, or directly bombard the surface of the film to etch it.
Characteristic: It can realize anisotropic etching to ensure the fidelity of the image after the detail conversion.
Disadvantages: the cost is average, and the preparation of microfluidic chips is less.
The dry etching system includes: a cavity for accommodating plasma; a quartz disk above the cavity; a plurality of magnets above the quartz disk; A magnetic field where the magnets rotate together. By further increasing the collision frequency of the particles, a better plasma uniformity can be obtained and the plasma concentration can be increased.