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What are the characteristics and industry applications of the wide linear plasma cleaner

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25 Nov,2021

What are the characteristics and industry applications of the wide linear plasma cleaner:
The wide linear plasma cleaner is one of the high-power plasma processor control systems, which includes touch screen + PLC automatic control + high-power plasma generator, the air intake system 2-5 working gas options: Ar2, N2, H2, CF4, O2.
The characteristics of the wide-width linear plasma cleaner: high precision, fast response, controllability, good compatibility, complete functions, and professionalism. Widely used in: printed circuit board industry, semiconductor IC field, silica gel, plastics, polymers, automotive electronics, aviation industry and other fields.
Printed circuit board industry: high-frequency circuit board surface activation, multi-layer circuit board surface cleaning, de-drilling pollution, soft and hard combined circuit board surface cleaning, de-drilling pollution, activation before soft board reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, suitable for wire cleaning before and during welding.
Silica gel, plastics, and polymers: the surface roughening, etching and activation of silica gel, plastics, and polymers; the wide linear plasma cleaner PTLplasma cleaning method can be used to change the surface characteristics of BGA organic substrates. Cleaned the liquid crystal display device: the ITO electrode, after the ITO electrode is cleaned, the bonding strength of the ACF is improved. Cleaning COF (ILB) bonding surface: cleaning all parts of the film substrate bonded with the chip (Chip).
Cleaning the OLB (FOG) interface surface: cleaning the interface surface between the LCD/PDP panel and the film substrate. Clean the COG: clean the driver IC directly before mounting it on the glass substrate. Cleaning the film substrate: remove organic contaminants attached to the film substrate. Cleaning the metal substrate: remove the attached organic contaminants on the connection part to improve the shear strength of the sealing resin.
The photosensitive film of the chip: The photosensitive film (protective film) on the chip is removed by the plasma method of a wide-format linear plasma cleaner. Cleaning the BGA substrate and bonding pad: Clean the bonding pad with a wide-width linear plasma cleaner to improve the lead adhesion and the shear peel strength of the sealing resin. Clean CPS: Remove organic contaminants on the contact surface of the chip and CSP solder balls. Clean the combined chip packaging: clean the contact parts of the composite electronic components.