图片名称

The application of vacuum plasma machine in semiconductors solves three major technological problems

Keywords:

,plasma,machine

Published on:

08 Sep,2021

The application of vacuum plasma machine in semiconductors solves three major technological problems:
People in the field of vacuum plasma machines know that vacuum plasma machines are widely used in industries such as semiconductors, biology, medical treatment, optics, flat panel displays, etc. It uses some active components to process samples. The surface layer achieves the functions of cleaning, cleaning, modification and so on. The application of vacuum plasma equipment in the semiconductor industry has a certain foundation, because a series of problems such as oxidation and humidity occurred during the filling process during the manufacturing process, so people in the LED industry thought of using vacuum plasma machine cleaning to achieve Good sealing, reducing current leakage, and providing good bonding performance. In addition, the electronic products processed by the vacuum plasma machine can also improve the surface energy, trace its hydrophilicity, and improve the adhesion. The application of vacuum plasma machine technology in the semiconductor industry has been well known by many industrial product manufacturers, and it is believed that it will also be popular and admired in the electronics industry. This is the application of vacuum plasma machines. At present, many semiconductor manufacturers in China are already using this technology. To deal with the material, then I will explain which three major process problems are solved by its application in semiconductors.
Process problem 1. Die bonding pre-treatment

 plasma machine The bonding between the chip or silicon wafer and the package substrate is often two materials with different properties. The surface of the material is usually hydrophobic and inert, and its surface bonding performance is poor. The interface is prone to voids during the bonding process. Sealed and packaged chips or silicon wafers bring great hidden dangers. Silicon wafer cleaning machines industrial plasma cleaning machines can perform plasma treatment on the surfaces of chips and packaging substrates, which can effectively increase their surface activity. Vacuum plasma machines greatly improve adhesion. The fluidity of the epoxy resin on its surface improves the bonding wettability of the chip and the package substrate, reduces the delamination between the chip and the substrate, improves the thermal conductivity, improves the reliability and stability of the IC package, and increases the life of the product.
Process problem 2. Surface treatment of lead frame
In the field of microelectronics packaging, lead frame plastic packaging is still used, which still accounts for 80%. Copper alloy materials with good thermal conductivity, electrical conductivity, and processing performance are mainly used as lead frame copper oxides and other organic pollutants will cause sealing molds. The delamination of the plastic and copper lead frame will cause poor sealing performance and chronic gas leakage after packaging, and will also affect the bonding and wire bonding quality of the chip. To ensure the cleanliness of the lead frame is to ensure the reliability and yield of the package. The key is that the cleaning and activation of the lead frame surface after cleaning by the industrial vacuum plasma machine will greatly improve the yield of the finished product compared with the traditional wet cleaning, and it will avoid waste water discharge and reduce the cost of chemical medicine procurement.
Process problem 3. Optimize wire bonding (wire bonding)
The quality of integrated circuit wire bond pads has a decisive influence on the reliability of microelectronic devices, and the bonding area must be free of contaminants and have good bonding characteristics. The presence of contaminants, such as chlorides and organic residues, will severely weaken the pull value of the wire bond pad. The wet cleaning of the traditional industrial cleaning machine does not completely remove or can not remove the contaminants in the bonding area. However, the vacuum plasma machine equipment cleaning of the plasma manufacturer can effectively remove the surface contamination of the bonding area and activate the surface, which can obviously Increasing the bonding tension of the lead wire greatly improves the reliability of the packaged device.
The mechanism of the vacuum plasma machine mainly relies on the "activation" of the active particles in the plasma to achieve the purpose of removing stains on the surface of the object. In terms of reaction mechanism, plasma cleaning usually includes the following processes: inorganic gas is excited into a plasma state; gas phase substances are adsorbed on the solid surface; adsorbed groups react with solid surface molecules to form product molecules; product molecules resolve to form a gas phase; reaction The residue is detached from the surface.
The great feature of vacuum plasma machine technology is that regardless of the type of substrate to be processed, it can process metals, semiconductors, oxides and most polymer materials, such as polypropylene, polyester, polyimide, and polyimide. Ethylene chloride, epoxy, and even polytetrafluoroethylene can be handled well, and can be used to clean the whole and part as well as complex structures.
I believe that plasma equipment technology will become more and more popular and trusted by industry professionals as the quality requirements become higher and higher in the future.

Hot Products

Related articles