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Research on the improvement of interlayer separation defects by the de-drilling process of plasma cleaning equipment

Keywords:

,plasma,cleaning,equipmen

Published on:

10 Aug,2021

Research on the improvement of interlayer separation defects by the de-drilling process of plasma cleaning equipment:
With the continuous upgrading of the electronic information industry, especially the advent of the "Internet +" era, higher requirements have been placed on printed circuit boards (PCB) for signal transmission, and higher requirements have also been placed on PCB processing technology. Interlayer separation (ICD) is a common defect in the copper immersion process. ICD defects have a significant impact on the reliability of PCB products.
 The low Dk characteristics of high-speed materials have extremely high advantages in signal transmission. This characteristic is very consistent with the needs of 5G products. Therefore, it is increasingly applied to 5G products. However, due to the physical and chemical properties of the material during the processing process, after drilling, the excess slag in the hole is difficult to be removed by the traditional chemical de-drilling method, which brings great hidden dangers to the product functionality, and the product needs to be further improved. Reliability.
Plasma cleaning equipment Plasma cleaning is to use the ionization effect of a strong electric field to form a fourth state of plasma through the ionization of a mixture of CF4 and O2 through the radio frequency power of the electric field under vacuum conditions. The epoxy resin residue is converted into volatile organic fluoride, so as to achieve the effect of removing drilling dirt. Plasma cleaning equipment not only has a strong drilling dirt removal ability, but also has a great advantage in the long-term reliability of the product.
The plasma cleaning equipment is dry processing, and it is done under the directional action of the electric field, so it avoids the traditional way of drilling pollution. The fluffing agent attacks the position of the glass fiber on the hole wall, which can greatly reduce the whitening and whitening of the glass fiber. Abnormal stratification also has great advantages in preventing CAF.

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The processing temperature affects the effect of drilling dirt removal. Because the Plasma processing process is mainly a chemical change, in a chemical reaction, temperature is one of the important factors affecting the chemistry. Increasing the temperature can increase the reaction rate, and vice versa, the de-drilling rate will decrease. In the same way, in the process of Plasma de-drilling, increasing the reaction temperature can improve the ICD.
In the process of de-drilling, we need to obtain a clean surface of the hole wall for post-process processing. The hole wall is the part that participates in the reaction during the processing of the plasma cleaning equipment. The size of the exposed area is related to the effect of the de-drilling . If the cavity of the equipment is regarded as a whole, in the same constant cavity, the resin area of ​​the hole wall affects the amount of bite for removing dirt.
During Plasma processing, power directly affects the amount of plasma generated. The more plasma ionized by the electrode, the better the effect of de-drilling the hole wall, and vice versa;
We know from the knowledge of physics that the electric field ionizes the gas, and it needs enough energy to make the gas appear in an excited state, and the energy is expressed as processing power in the plasma cleaning equipment. The greater the processing power of the plasma, the more sufficient the ionization effect of the plasma, and the better the effect of de-drilling.

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