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Vacuum low temperature plasma processor technology provides activation effect in flexible materials

Keywords:

vacuum,the,and,plasma,of,can,surface,processor,process

Published on:

21 May,2021

        The vacuum low temperature plasma processor technology provides an excellent surface activation effect on flexible materials. It can be used for plasma cleaning before wire bonding to provide a cleaner bonding surface, provide surface activation function for flexible materials, and the removal process is uniform and stable. .

Vacuum low temperature plasma processor technology
        The plasma treatment of the vacuum low temperature plasma processor has always been regarded as an important process in the microelectronics and semiconductor packaging industry. Before introducing a suitable plasma process, plasma cleaning can make the bonding surface cleaner, thereby reducing product failures. The potential benefits are improved surface activity of flexible materials, improved equipment reliability, and elimination of deviations due to unsystematic effects, such as random surface contamination caused by uncontrollable factors.

Vacuum low temperature plasma processor technology
        The low-temperature plasma processor has an "alchemy" or "black box" halo. The plasma contributes to the performance of the lead connection process and the long-term reliability of the packaged device. Plasma has a double advantage: it improves the wire connection process itself and ensures the long-term reliability of the device. In order to greatly improve the quality and success rate of its manufacturing process and products through plasma cleaning before in-line bonding, the vacuum low temperature plasma processor plasma is a completely independent system. It not only saves energy, but also occupies a small space, so that the processing capacity is enlarged, and the production base area is reduced at the same time.
        The double-layer rack cabinet of the vacuum low temperature plasma processor can install 20 30x35 inch panels in one cycle, and the multi-functional horizontal rack cabinet can handle a variety of different flexible PCB sizes and can be loaded easily. Efficient anti-fouling etching technology can remove epoxy resin, polyimide, compound and other resins, and has the ability to remove dust, which can effectively remove the resist residue on the inner layer and the panel and the residual solder paste exudation Objects, thereby improving adhesion and solderability.

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