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Low-temperature plasma technology manufacturers plasma chemical vapor deposition technology

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18 Mar,2021

Low-temperature plasma technology manufacturers plasma chemical vapor deposition technology:
By low temperature plasma (non-equilibrium plasma) as an energy source, the workpiece on the cathode glow discharge under low pressure, using the glow discharge (or the other heating body) the workpiece heated to a predetermined temperature, then the right amount in the reaction gas is piped in, and then through a series of chemical reactions and plasma reaction, form a solid film on the surface. Includes chemical vapor deposition and glow discharge enhancement and other general technology.

CRF low-temperature plasma technology
The collisions between the particles produce strong ionization of the gas, which activates the reaction gas. Cathode sputtering occurs at the same time, which provides a clean surface with good activity for deposition of thin films. Therefore, the whole deposition process is distinctly different from that of thermal activation alone. The interaction of the two creates favorable conditions for improving the bonding force, reducing the deposition temperature and accelerating the reaction rate of the coating.


According to the type of plasma volume source, plasma chemical vapor deposition technology can be divided into DC glow discharge, RF discharge and microwave plasma discharge. When the frequency of CVD reaction increases, the enhancement effect of plasma on CVD reaction becomes more obvious, and the temperature of compound formation decreases.


The PCVD process unit includes a deposition chamber, a reactant transport system, a discharge power supply, a vacuum system and a detection system. The gas source uses the gas purifier to remove water and other impurities, obtains the required flow rate through the adjustment device, and then sends the gas source into the deposition chamber at the same time, under the conditions of certain temperature and plasma activation, obtains the required products, and deposits them on the surface of the workpiece or substrate. Therefore, the production process of PCVD includes plasma physical process and plasma chemical reaction process.

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