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Ionization degluing of circuit board of plasma surface treatment machine
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Published on:
04 Feb,2021
Ionization degluing of circuit board of plasma surface treatment machine:
Plasma surface processor glue removal process, the glue removal gas is oxygen. In this method, the circuit board is placed in the vacuum reaction system, through a small amount of oxygen, coupled with high frequency and high pressure, the high frequency signal generator generates high frequency signal, in the quartz tube to form a strong electromagnetic field, the oxygen ionization, the formation of oxygen ions, activated oxygen atoms, oxygen molecules and electrons and other mixed-quality glow column. Reactive oxygen species (active atomic oxygen) can quickly oxidize the residual gel into volatile gas, and volatilize away.
After the residue is removed from the board, it will be cleaned. The advantages of plasma surface processor are simple operation, high efficiency, clean and smooth surface, no scratches, low cost and environmental protection. The desizing machine processing of plasma surface processor is an important part of micromachining. After micromachining, such as electron beam exposure and ultraviolet exposure, photoresists need to be removed or treated with substrate film. The cleaning degree of photoresist will directly affect the smooth implementation of the subsequent process.
The CRF Plasma Surface Proctor uses high-performance components to accurately control process parameters, and its process monitoring and data acquisition software allows for strict quality control. This technology has been successfully applied to power transistors, simulator parts, sensors, optical devices, optoelectronics, electronic components, MOEMS, biological devices, LED and other fields. The CRF plasma degluing machine is used to remove the contaminants on PCB board, and the effect is very obvious. Plasma glue removing machine has the characteristics of simple process, reliable, high efficiency, treatment, no acid waste water and other residues.
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