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Material polycrystalline silicon wafer plasma etching cleaning equipment to remove surface impurities

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04 Feb,2021

Material polycrystalline silicon wafer plasma etching cleaning equipment to remove surface impurities:

With the development of semiconductor technology, wet etching has gradually limited its development due to its inherent limitations, because it has been unable to meet the processing requirements of micron or even nanometer fine wires in VLSI. Dry etching method of polycrystalline silicon wafer plasma etching cleaning equipment is gradually widely used in semiconductor processing technology because of its high ion density, etching uniformity, etching side wall verticality, high surface finish, can remove surface impurities.

wafer plasma etching cleaning equipment

With the development of modern semiconductor technology, the requirement of etching is higher and higher. The plasma etching cleaning equipment of polycrystalline silicon wafer meets this requirement. The stability of equipment is one of the key factors to ensure the stability and repeatability of the production process. CRF plasma cleaning machine is a multi-functional plasma surface treatment equipment, through the configuration of different components, can have a surface coating (coating), etching, plasma chemical reaction, powder plasma processing and other capabilities.

Polysilicon wafers are etched very well by plasma cleaning/etching machines. Through the configuration of etching components, the CRF plasma cleaning machine can achieve etching function, cost-effective, simple operation, so as to achieve multi-function.

Plasma cleaning machine is the use of the characteristics of low temperature plasma to be processed materials of plasma surface treatment equipment, generally after plasma treatment, the surface tension of the material will be changed, wettability and hydrophilic, dyne value changes, suitable for dyne pen test of the material has a lot of, such as stainless steel, glass, plastic, ceramic lamp, etc.

The dyne value is mainly represented by the dyne pen, also known as the surface tension detector pen, the corona treatment pen, and the plastic film surface tension detector pen. Surface tension test pen has 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60 or more dozens of different tension test pen, can test whether the sample surface tension reaches the value of the test pen.

After plasma surface cleaning and activation treatment, the surface energy of traditional materials can be improved, which is reflected in the experiment of material dyne value improvement. Plasma cleaning machine was used to treat the polymer plastic samples, and dyne values were compared before and after treatment.

Before treatment, the Dane was crossed on the surface of the sample. After 40# crossing, the Dane slowly contracted and beads appeared, indicating that the Dane value was between 30 and 40. After plasma cleaning, 30#, 40# and 50# dyne stroke lines can be uniformly distributed without beads, indicating that the surface dyne value of the sample is greater than 50.

After plasma cleaning machine treatment, the surface tension and surface energy of the material are improved, which provides the possibility for the subsequent process and material application.

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