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Plasma surface processor plasma cleaning photoresist

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09 Jan,2021

Plasma surface processor plasma cleaning photoresist:

Residue on the surface of the chip, metal ions, organic matter and residual air pollutant produces in the process of semiconductor components, in order to prevent the air pollutants do serious harm to the production and processing chip, in the process of chip manufacturing, chip production need more cleaning procedures, plasma surface treatment machine plasma cleaning equipment is chip photoresist removal efficiency of pollutants such as ideal cleaning equipment.

Photoresist plays a very important role in the whole production and manufacturing process, its cost accounts for about 25% of the whole production and manufacturing process, and poor removal effect will affect productivity. Choose in addition to traditional photoresist is high cost and low efficiency of wet degumming, and at the same time with the processing technology of continuous iterative update, more and more manufacturers begin to choose plasma cleaning dry remove photoresist, and such as to clean dry degumming is different from traditional process, it does not need to immerse organic chemistry, organic solvents, also do not need to handle with dry, stripping process easier to control, to avoid too many defective products, improve the yield of the product.

Dry degumming method, also known as plasma surface treatment plasma degumming method, its basic principle is similar to the plasma cleaning method, is to remove the colloid through the reaction of oxygen atomic nucleus, because the basic composition of photoresist is hydrocarbon, the reaction produces carbon monoxide, carbon dioxide, water and other substances, and then suction to complete the removal.

Plasma surface treatment technology applications include treatment, ash, modification, etching and other processes. The choice of plasma cleaning equipment, not only can completely remove photoresist and other organic matter, but also can activate the wafer surface, improve the wettability of the wafer surface. Polymers, including small holes of different shapes and long and narrow holes, can be easily cleaned using plasma. It is known that if the holes become sharp, the metal liquid can be difficult to inject. This is because the sharp corners increase the surface tension, which affects the flow of the metal liquid. Plasma cleaning can remove residue such as deep holes or other deep photoresists.

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