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In 2021, the plasma cleaning machine will sort out 8 questions and answers for customers. Don't miss it

In 2021, the plasma cleaning machine will sort out 8 questions and answers for customers. Don't miss it

In 2021, the plasma cleaning machine will sort out 8 questions and answers for customers. Don't miss it: Many customers do not know what the functions of the plasma cleaning machine are, and what can be handled. Next, I will answer your questions about the plasma cleaning machine. Is the atmospheric pressure or vacuum plasma cleaner processing time as long as possible? Not necessarily. The cross-linking, chemical modification, corrosion and other effects produced by plasma treatment on the polymer surface are mainly due to the action of plasma, which causes a large number of free radicals to be generated on the surface of the polymer. The results show that with the extension of the plasma treatment time, the discharge power increases, and the intensity of the generated free radicals increases. After reaching a large value, it enters a dynamic equilibrium state; when the discharge pressure reaches a certain value, the free radical intensity will appear a large value That is, under certain conditions, the low-temperature plasma has a deep reaction to the polymer surface. Does the plasma cleaner have a chance to generate ozone? A small amount will be produced. Plasma surface treatment is a "clean" treatment process. Due to the existence of ionized air (O3), an exhaust system can be configured to discharge ozone when needed. Can the plasma cleaner replace the primer? Adopting plasma surface treatment technology, it can completely replace the primer and frosting processes in bonding, coating, flocking, pad printing or coding. The application of this technology not only reduces the scrap rate to a low level, but also achieves continuous environmental protection through the use of solvents. At the same time, it greatly improves the production capacity of the production line, reduces production costs, and meets environmental protection requirements. How long can the activity of the material surface remain after plasma treatment? It is difficult to answer this question, because it is difficult to determine the time that the surface can be retained after treatment, because of the nature of the material itself, secondary pollution after treatment, recurrence of chemical reactions, and so on. In theory, vacuum packaging can delay the plasma treatment time. Generally speaking, we recommend that customers proceed to the next step immediately after the low-temperature plasma treatment reaches high surface energy to avoid the impact of surface energy attenuation. Can the plasma cleaner be used online? The answer is yes, whether it is the bonding of mobile phones, the coating of the casing, the flocking of the sealing strip, the spraying of the sealing strip, or other, the online use of plasma surface treatment systems has become a reality. And according to the specific requirements of the production line of the user unit, the system can be matched with the production line, which can meet the needs of the new line and the transformation of the old line. If the user has general product requirements, the atmospheric online plasma processing system can be integrated into the production line. If the user has higher product requirements or special processing materials, it can also be made into an online vacuum plasma processing system. Meet the various requirements of customers. What special gas is needed for plasma cleaning machine processing? Except for compressed air, on-line processing does not require other special gases. However, if you are using a sub-atmospheric glow discharge device, you can fill it with inert gas such as argon and helium, and perform surface treatment under the condition that the atmosphere is different from air. The reaction gas can produce different treatment effects on the surface of the material, which belong to the process formula.

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The 6 major treatment effects of surface plasma treatment equipment can be applied to 100+ industries to improve product performance

The 6 major treatment effects of surface plasma treatment equipment can be applied to 100+ industries to improve product performance

The 6 major treatment effects of surface plasma treatment equipment can be applied to 100+ industries to improve product performance: There are often greases, oils and other organic matter and oxide layers on the metal surface, sputtering, paint, adhesive, bonding, welding, brazing, coating, plasma that needs to be treated, and surface cleaning is green and environmentally friendly. Surface plasma treatment equipment plasma treatment has the following effects. 1. Organic matter surface ashing 2. A chemical reaction occurred on the surface 3. Under the high-temperature vacuum state, some pollutants evaporate. 4. Pollution causes high-energy ions to break under vacuum. 5. Since the plasma can only penetrate a thickness of a few nanometers per second, the pollution layer cannot be too thick, and fingerprints are also applicable. 6. Oxidation removal after metal oxide reaction. The flux of printed circuit boards is usually chemically treated. Chemical reagents need to be removed by plasma after welding, otherwise it will cause corrosion problems. A better combination is easy to weaken the plating, bonding, and welding operations, and the plasma of the surface plasma treatment equipment can be selectively removed. In addition, the bonding quality of the oxide layer is not good. Metal manufacturing application of surface plasma treatment equipment: Plasmaization is an environmentally friendly treatment method, which replaces the traditional chloroform. Automotive manufacturing applications: Applicable to the pre-treatment of plastic and painting for automobile production. Application of surface plasma treatment equipment in textile industry: It is suitable for hydrophilic, hydrophobic and surface modification of fabrics, filter membranes and membranes. Medical applications: It is suitable for the pre-treatment of bonding of glass tubes, syringes, urinary catheters and various valves. Application of surface plasma treatment equipment in the electronics industry: Clean and etch circuit boards, and perform non-oxidation activation treatment on materials such as films and polypropylene. Pre-treat the surface coating of insulating materials (foam plastic) and electronic components.

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The test principle of the water drop angle tester for the effect evaluation of the atmospheric plasma cleaner

The test principle of the water drop angle tester for the effect evaluation of the atmospheric plasma cleaner

The test principle of the water drop angle tester for the effect evaluation of the atmospheric plasma cleaner: The water drop angle tester can effectively evaluate the effect of the surface treatment before and after the plasma cleaning of the atmospheric plasma cleaner. The water drop angle tester is a professional analytical instrument that uses distilled water as the detection liquid and uses the high sensitivity of water surface tension to evaluate the surface free energy of solid materials or the wetting angle of solid materials with water. In the semiconductor chip industry, especially in the wafer manufacturing process, the requirements for cleanliness are very high, and only the wafer meets the requirements can it be considered qualified. The water drop angle tester, as a test tool for evaluating the plasma cleaning effect of atmospheric plasma cleaners, is an effective tool for evaluating the quality of wafers. In recent years, China's wafer industry has developed rapidly. Therefore, there are higher requirements for the detection of wafer drop angles. According to the basic principle of the water drop angle test: the solid sample surface due to its own surface roughness, chemical diversity, heterogeneity and other factors, the contact angle value or water drop angle of the solid surface of the plasma cleaner shows left and right, front and back, and front and back. Inconsistent; therefore, the algorithm of the water drop angle measuring instrument must adopt the basic principle that conforms to the interface chemistry principle, and can realize one-key quick measurement. The technical requirements of the application for the test chip semiconductor: Since chip nanoscale processes, such as 12 or 7 nanometer processes, have various structures and directions, heterogeneity is particularly prominent in chip or wafer processes. At the same time, the water drop angle tester is also required to have functions such as shooting, screenshots, and optical cameras. The applicable physical properties of the water drop angle measuring instrument require that it can sensitively capture the small changes in the angle between the left and right, front and back of the droplet (try to be less than 1 ml, use an ultra-fine needle) in a small range due to poor cleaning effect. The size of the angle is obviously offset from the left and right angles, indicating that the surface of the sample has not been cleaned by an atmospheric plasma cleaning machine. On the whole, for wafer or wafer processing, in addition to testing the effect of the atmospheric plasma cleaner (Plasma), it is more important to evaluate the adhesion or surface free energy of the wafer under what conditions (especially Is the latter).

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Application of plasma plasma cleaning machine low temperature plasma activation technology in surface treatment of materials

Application of plasma plasma cleaning machine low temperature plasma activation technology in surface treatment of materials

Application of plasma plasma cleaning machine low temperature plasma activation technology in surface treatment of materials: In recent years, in order to improve the surface viscosity of organic materials, such as the treatment of rubber surfaces, the plasma plasma cleaner technology has been reduced and miniaturized, and the "hot arc" has been changed to "cold arc" and developed into a jet low temperature Plasma plasma cleaning machine. At present, the outlet temperature (instant temperature) of the spray gun researched by Chengfeng Zhizhi is only 50-80 degrees, and it has begun to be promoted and applied in the home appliance and automobile industries. In industry, such as argon arc welding, air plasma cutting and plasma spraying, plasma plasma cleaner low temperature plasma has been widely used. The core component of this type of device is usually called a plasma torch. Its plasma center temperature is as high as several thousand degrees, which is a thermal plasma. In recent years, in order to improve the adhesion performance to organic materials, such as rubber surface treatment, the plasma torch process has been lowered and miniaturized, and the hot arc has been transformed into a cold arc, and a low-temperature plasma jet plasma cleaning machine has been developed. 1. Atmospheric jet low-temperature plasma surface treatment principle: The air flow of the cold arc plasma jet gun can produce oxygen-based active substances containing a large number of oxygen atoms. These oxygen atoms process the surface of the material and can be separated and attached to the surface of the material. The organic pollutant C, which is converted into carbon dioxide, is removed; at the same time, it can improve the contact performance, thereby increasing the strength and reliability of the connection. Industrial application of low-temperature plasma activation technology in the atmosphere. (a) Pre-welding treatment Stainless steel sheet butt welding is widely used in industry. For example, the inner barrel of a solar water heater is made of 0.4mm stainless steel sheet rolled into a cylindrical shape and welded. In order to meet the welding requirements, the welding part must be cleaned. The current cleaning method is a wet method, which uses a chemical cleaning agent to manually scrub. The cleaning cost is high, the pollution is large, and it is difficult to realize automation. Atmospheric jet low-temperature plasma cleaning activation technology is a dry cleaning technology, applied to the pre-treatment of butt welding of thin plates, which can replace traditional manual chemical cleaning agents, reduce cleaning costs, improve welding quality, and reduce environmental pollution. Automation of welding area cleaning. (B) Surface treatment of plastic sheets, such as wood plastic, is a new type of material that can replace wood, but surface coating is very difficult, which greatly limits its scope of application. If chemical treatment is used, the cost is high and the pollution is large. Therefore, with low temperature plasma cleaning machine, the surface of the material will have obvious changes: the color is slightly lighter, the reflectance is reduced, and the surface is in a matte state; the surface is slightly rough when touched by hand; the adhesion performance of the spray paint is greatly improved . The bonding force before and after plasma treatment can be tested. Test method: Use a scraper to make a scratch on the surface of the part to be tested, and use a soft brush to scrape off the debris on the surface. Use scotch tape to stick the line on the line. There should be no air bubbles between the tape and the sample. Keep it for 1 to 2 minutes, and tear off the tape at a constant speed of 60 degrees. Judge the bond strength by observing the integrity of the scribe line and the square. In our daily life, such as door seals on cars, we often use rubber-processed products. The surface should be painted or woven. If there is no low-temperature plasma treatment, adhesion is not easy. If chemical cleaning is used, it will be offline and pollute the environment. The ideal solution is to use online plasma treatment. (C) The air plasma jet used for glass and metal plates can treat glass and metal surfaces, which can not only effectively remove organic pollutants from floating dust in the atmosphere, but also change the surface performance to make it last long enough. Thereby improving the joint strength of the product. In addition, atmospheric pressure plasma cleaning can be applied to the surface of organic and metal materials.

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After the IP glue is processed by the plasma cleaner, its contact angle to DIW is extremely significantly reduced

After the IP glue is processed by the plasma cleaner, its contact angle to DIW is extremely significantly reduced

After the IP glue is processed by the plasma cleaner, its contact angle to DIW is extremely significantly reduced: IP glue is a kind of photoresist widely used in 0.25μm photomask design rules and below. IP3600 is a photoresist commonly used for 0.25DR Hline photomasks. Even in the secondary mask processing of the 130nm process phase shift mask technology, IP glue is still used. IP glue is a kind of photoresist based on phenolic resin. The main difference between it and poly-type glue is that the surface of the glue has obvious anti-decomposition phenomenon, that is, it has poor hydrophilicity. For IP glue, its poor hydrophilicity will make it difficult for the developer to evenly act on the glue surface during development, resulting in defects or incomplete development. Therefore, in the development of IP glue, one of the technological difficulties is how to improve the hydrophilicity of the IP glue before development. Plasma cleaner is a pre-cleaning method commonly used in semiconductor manufacturing and packaging. Plasma pretreatment (bombardment) can physically remove some pollution on the surface of silicon wafers or chips (such as natural oxide layers, ash particles, and organic pollutants). Wait). The plasma surface pretreatment method is used to act on the surface of the IP glue to increase the roughness of the glue surface, thereby improving the uniformity of the deionized water wetting the glue surface, and avoiding the development defects caused by the hydrophilicity of the IP glue. During the surface treatment of the plasma cleaner, the thickness of the IP glue will be lost due to the bombardment of the plasma. In order to facilitate the control of subsequent development time and development uniformity, the thickness loss of the IP glue caused by plasma bombardment must be considered. After the surface treatment of the reticle by the plasma cleaning machine, due to the loss of plasma bombardment, the thickness of the IP glue decreased from 564.4nm before the treatment to 561.2nm after the treatment, and the thickness loss was about 3.2nm, which is far before the thickness of the IP glue before development. The deviation can be controlled within (565 +10) nm. This shows that although the surface bombardment effect will cause a certain loss of the thickness of the IP glue, the plasma energy for the treatment is lower and the time is shorter, so the thickness loss caused by it is smaller. . On the whole, this plasma surface treatment will not have a significant impact on the thickness of the IP glue. After the IP glue is processed by the plasma cleaning machine, its contact angle to DIW is extremely significantly reduced, that is, the static contact angle is reduced to 45° from the untreated 77°, and the forward contact angle is reduced to 51° from the untreated 88°. It also reduces the receding contact angle from the untreated 33° to less than 10°. This shows that due to the bombardment of the surface of the IP glue by plasma, the micro-roughness of the surface is increased, thereby increasing the adsorption and wetting ability of the IP glue to water, and improving the hydrophilicity of the surface of the IP glue. In the water rinsing step before development, it is obvious that the surface water drops on the plasma-treated reticle become smaller and are densely and uniformly distributed on the surface of the glue, which also shows its hydrophilicity and development The uniformity has been significantly improved.

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Comparison of the advantages and disadvantages of the wet and dry etching methods

Comparison of the advantages and disadvantages of the wet and dry etching methods

Comparison of the advantages and disadvantages of the wet and dry etching methods: The wet cleaning system is suitable for advanced non-destructive megasonic cleaning. It can be used to make easily damaged substrates with or without patterns, including templates with protective films. In order to achieve a good cleaning effect while ensuring that the substrate is not damaged, the megasonic energy density must be kept slightly below the damage threshold at any position on the sample. The wet etching technology makes the surface acoustic energy of the substrate evenly distributed, increases the distributed energy to support ideal cleaning, and ensures that it is within the damage threshold of the sample. The system has high repeatability, good uniformity, Z-level advanced megasonic cleaning function, and megasonic assisted photoresist stripping and wet etching functions. The product can be subjected to non-destructive testing, chemical reagent cleaning, brush cleaning, drying, etc. according to the process steps. Comparison of the advantages and disadvantages of the two wet and dry etching methods: The wet etching system is an etching method in which the chemical reaction between a chemical etching solution and the object to be etched makes it peel off. Wet etching is mostly isotropic etching, which is not easy to control. Features: Strong adaptability, uniform surface, little damage to silicon wafers, suitable for almost all metals, glass, plastics and other materials. Disadvantages: The drawing quality is not ideal, and the small lines in the drawing are difficult to grasp. The etching medium of the dry etching system is plasma, which uses plasma to react with the surface film to generate volatile substances, or directly bombard the surface of the film to etch it. Characteristic: It can realize anisotropic etching to ensure the fidelity of the image after the detail conversion. Disadvantages: the cost is average, and the preparation of microfluidic chips is less. The dry etching system includes: a cavity for accommodating plasma; a quartz disk above the cavity; a plurality of magnets above the quartz disk; A magnetic field where the magnets rotate together. By further increasing the collision frequency of the particles, a better plasma uniformity can be obtained and the plasma concentration can be increased.

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