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The effect of carbon nanotube filler on the failure of varnish coating by surface treatment of atmospheric plasma machin

The effect of carbon nanotube filler on the failure of varnish coating by surface treatment of atmospheric plasma machin

The effect of carbon nanotube filler on the failure of varnish coating by surface treatment of atmospheric plasma machine: In the natural environment, materials will undergo chemical or electrochemical effects due to environmental influences, which will cause corrosion failure, lose their original mechanical properties and structural effects, and cause potential safety hazards and economic losses. Corrosion in the atmospheric environment, soil environment and marine environment is highlighted by marine corrosion. In terms of marine corrosion protection, paint protection occupies a high proportion, which makes the research of coatings in seawater environments a hot spot. Through the modification of the coating itself and the coating attachment matrix, the effect of improving the service life of the coating and improving the quality of the protection of the coating is achieved. Compared with the traditional modification technology, the plasma treatment of atmospheric plasma machine has the characteristics of environmental protection, no pollution, no damage to the overall nature of the body surface, wide application range, and safety. In terms of surface modification of the substrate, plasma treatment is applied to the substrate. After plasma treatment, functional groups for connectivity are added to the surface of the substrate, such as hydroxyl (-OH), carbonyl (-CO) and other functional groups. These functional groups can react with the unsaturated double bond (-C=C-), carboxyl (R-OOH), hydroxyl R-OH, aliphatic (R-OOR) and other functional groups in the alkyd resin to form chemical bonds to improve the coating Bonding force with the substrate. In addition, plasma treatment with atmospheric plasma machine can also increase the surface roughness and increase the bonding force from the physical aspect. Electrochemical impedance (EIS) and scanning Kelvin probe test (SKP) results have proved that plasma treatment can enhance the protective performance of the coating and delay the failure of the coating. In order to improve the water seepage and corrosion resistance of the coating itself, nano-scale multi-walled carbon nanotubes are added to the varnish to act as pigments and fillers. The addition of carbon nanotubes increases the compactness of the film-forming coating, fills the channels for water molecules to penetrate, significantly prolongs the time it takes for water to penetrate from the coating surface to the substrate surface, delays the coating failure, and increases the service life of the coating. Analyze from the perspective of molecular mechanics. By simulating the plasma treatment on the surface of the iron substrate, the changes in the adsorption energy of the alkyd resin on the surface of the untreated iron substrate and the surface of the iron substrate treated by an atmospheric plasma machine are compared. The results prove that plasma treatment on the surface of the iron substrate can promote the adsorption of alkyd resin on the surface of the substrate. The effect of plasma surface treatment and carbon nanotube filler on the failure of the varnish coating can improve the protective effect of the coating and increase the life of the coating.

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How to choose the equipment suitable for the products of the enterprise for the quality of the top ten brands of plasma cleaning machine

How to choose the equipment suitable for the products of the enterprise for the quality of the top ten brands of plasma cleaning machine

How to choose the equipment suitable for the products of the enterprise for the quality of the top ten brands of plasma cleaning machine: Plasma cleaning machine is a kind of process equipment. Choosing the right brand is very important to the overall quality of the equipment. There are differences in mechanical design, electrical configuration, programming ability, etc., so there are more than ten brands of plasma cleaning machines. There are many kinds, which brand should the enterprise choose for product processing? Is it reliable? For plasma cleaning machine brands, Chengfeng Zhizhi knows a lot, but it is really difficult to list the top ten brands and list the order, because most of the non-standard equipment in the equipment is based on actual conditions. Use needs to be customized. Any information of various industries, processing materials, processing purposes, product shapes, etc. may affect the special requirements of plasma cleaners. For this reason, choosing a reliable equipment brand and manufacturer is actually a test of its production R&D capabilities and industry process experience. At present, there is no uniform industry standard for the product quality of plasma cleaners. Directly listing the top ten brands of plasma cleaners is not credible and authoritative. Cheng Fengzhi has created some brands that are currently more concerned and influenced in the market. When choosing these brands, you can choose Plasmatreat, TePla, Diener, March, APP, Vision, and of course, including Chengfeng Zhizhi. Chengfeng Zhizao has focused on the research and development of plasma for 20 years. If you want to know more product details or have questions about the use of the equipment, please click on the Chengfeng Zhizao online customer service consultation. Chengfeng Zhizao is waiting for your call!

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Precautions when selecting oxygen, hydrogen, and nitrogen for vacuum plasma processor

Precautions when selecting oxygen, hydrogen, and nitrogen for vacuum plasma processor

Precautions when selecting oxygen, hydrogen, and nitrogen for vacuum plasma processor: There are many materials processed by the surface treatment technology of the vacuum plasma processor. They have different processing requirements and uses. At this time, the process gas we choose will be different. The process gas used in the surface treatment of the plasma processor is oxygen, Argon, nitrogen, compressed air hydrogen, carbon tetrafluoride, etc., are commonly used in oxygen, hydrogen, and nitrogen. The gases selected by the plasma processor technology are these three process gases. What should be paid attention to? How to choose? 1. The gas selected is oxygen: Oxygen is mainly used for surface activation of polymer materials and removal of organic pollutants, but it cannot be used for easy oxidation of metal surfaces. In the vacuum plasma state of the vacuum plasma processor, the oxygen plasma is light blue, and part of the discharge is white; the light in the environment is bright, and the discharge in the vacuum chamber may not be seen when observed with the naked eye. 2. The selected gas is hydrogen: As a process gas, hydrogen is widely used in industries such as microelectronics, semiconductors, and circuit board manufacturing. When using hydrogen, pay attention: because hydrogen is a dangerous gas, it will self-detonate when combined with oxygen without ionization. Therefore, it is generally not allowed to mix the two gases in the vacuum plasma processor equipment. In the vacuum plasma state, hydrogen plasma is red, similar to argon plasma, and slightly deeper than argon plasma under the same discharge environment. 3. The gas is selected as nitrogen: Nitrogen particles are heavier. It is a gas between activated gas and inert gas. It can achieve bombardment and etching, and it can also prevent oxidation of part of the metal surface. Plasma, which is a mixture of nitrogen and other gases, is usually used to process some special materials. In the vacuum plasma state, nitrogen plasma appears red, and under the same discharge environment, nitrogen plasma is brighter than argon plasma and hydrogen plasma. The above are the precautions when choosing oxygen, hydrogen, and nitrogen for the vacuum plasma processor. If you want to know more product details or have questions about the use of the equipment, please click on the online customer service consultation of Chengfeng Zhizao, and Chengfeng Zhizao is waiting for you Call!

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Explanation of vacuum surface plasma treatment equipment using vacuum pump set

Explanation of vacuum surface plasma treatment equipment using vacuum pump set

Explanation of vacuum surface plasma treatment equipment using vacuum pump set: In general, the vacuum pump set of surface plasma treatment equipment is used on a vacuum plasma surface treatment machine. The pumping speed of the vacuum pump set is one of the important factors that determine the working efficiency of the vacuum surface plasma processing equipment. The pumping speed mainly depends on the vacuum pump. The pumping speed, when the processed product size is large, the pumping pump group cannot be selected arbitrarily. In the case of a large-scale product to be processed, it is inevitable to use vacuum surface plasma processing equipment with a large cavity (above 80L) for product processing. At this time, if only one vacuum pump is used, the vacuuming speed will be slower. , The vacuuming time will be prolonged, which will affect the processing efficiency. Therefore, we are generally equipped with vacuum pumps for large-cavity vacuum plasma surface treatment machines to increase the vacuuming speed. The use of two or more vacuum pumps combined into a series of vacuum pumps can greatly increase the vacuuming speed. Generally speaking, the vacuum pump components used in vacuum surface plasma treatment equipment are divided into three categories, one is the rotary vane vacuum pump plus Roots pump oil pump group; the other is the dry vacuum pump + Roots pump dry type Pump set; there is also a mechanical pump set consisting of molecular pumps and molecular pumps. Large-cavity vacuum surface plasma treatment equipment needs to use vacuum pumps, and the choice of vacuum pumps is also very particular. If you want to know the details of the product or have any questions about the use of the equipment, please click on Chengfeng Zhizhi Online Customer Service Consultation , Chengfeng Zhizao is waiting for your call!

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How does the atmospheric rotary plasma cleaning machine distinguish between independent and online equipment

How does the atmospheric rotary plasma cleaning machine distinguish between independent and online equipment

How does the atmospheric rotary plasma cleaning machine distinguish between independent and online equipment: There are three ways to distinguish atmospheric jet plasma cleaning machines in the industry. Previously, Chengfeng Zhizao introduced to you that it can be divided into direct injection and atmospheric rotary plasma cleaning machines according to whether the spray gun rotates or not. There are small partners for independent and online There are doubts about the method of distinction, so let’s introduce it today. Atmospheric rotary plasma cleaning machine has the characteristics of simple structure and convenient installation. It can perform surface treatment on plastic, rubber, metal, glass, ceramics, paper and other materials. It has been widely used in printing, packaging, electronics, automotive and other industries. So, what we call an independent online type, how are multiple spray guns and single spray guns classified? Have you ever been confused when choosing? I believe this article will help you. Independent atmospheric rotary plasma cleaners and online atmospheric jet plasma cleaners are distinguished according to whether they are connected to the assembly line or automatically. Atmospheric rotating plasma cleaning machine, namely a set of plasma generator and plasma spray gun. The upper part of the ordinary spray gun will have a device hole, and the user can process the device jig according to the need, and arbitrarily match it on the assembly line. Atmospheric jet plasma cleaning machine (in-line type), which is designed according to the processing purpose, production capacity, production line and process characteristics of the customer's products, and can be directly installed on the assembly line. In most cases, it is customized according to customer requirements. In addition, according to the number of spray guns supported by the plasma generator, the atmospheric plasma equipment can also be divided into a single spray gun atmospheric jet plasma cleaning machine and a multi spray gun atmospheric jet plasma cleaning machine. The single-jet atmospheric jet plasma cleaning machine is a plasma generator (host) with a nozzle. The power adjustment is directly on the host, and the operation is relatively simple. The power adjustment range of each manufacturer is different, and the general rated power is 600~1000W. The multi-nozzle atmospheric rotary plasma cleaning machine is actually composed of multiple plasma generators (hosts), each plasma generator corresponds to a spray gun, and the power and flow adjustments are concentrated on a control panel. Supply equipment according to user requirements, which can be operated manually or through man-machine interface. Warm reminder from Chengfeng Intelligent Manufacturing: The multi-gun atmospheric rotating plasma cleaning machine can have multiple sets of plasma generators working together. The heat dissipation, discharge safety and anti-interference factors of the host need to be optimized to meet the user’s requirements for equipment stability and safety. Require. If you are interested in plasma equipment or have any questions when purchasing, please click Chengfeng Zhizhi online customer service, Chengfeng Zhizhi welcomes your inquiries!

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Chengfeng Zhizhi plasma cleaning technology has been widely used in many fields

Chengfeng Zhizhi plasma cleaning technology has been widely used in many fields

Chengfeng Zhizhi plasma cleaning technology has been widely used in many fields: Among IC packaging types, Quad Flat Package (QFPS) and Thin Small Outline Package (TSOP) are two types of packaging required by the current packaging density trend. In the past few years, Ball Grid Array Package (BGAS) has been recognized as a standard package type, especially the Plastic Ball Grid Array Package (PBGAS), which provides millions of them each year. Plasma cleaning technology is widely used in PBGAS and flip chip processes and other polymer-based substrates to facilitate bonding and reduce delamination. Plasma cleaning technology is usually introduced in the following steps in IC packaging: before chip bonding and wire bonding, and before chip packaging. Before epoxy conductive adhesive sheet, if the front surface of the carrier is cleaned with plasma equipment, it can improve the adhesion of epoxy resin, remove oxides to facilitate solder reflow, improve the connection between the chip and the carrier, reduce the peeling phenomenon, and improve Heat dissipation performance. When eutectic sintering the chip onto the carrier with alloy solder, if the quality of solder reflow and sintering is affected due to contamination or old surface on the carrier, cleaning the carrier with plasma before sintering is also effective to ensure the sintering quality. Before wire bonding, plasma cleaning the pad and substrate will significantly improve the bonding strength and the uniformity of the bond wire tension. Cleaning the bonding points means removing the thin, contaminated surface. When the IC is plasticized, it is required that the plastic packaging material and various materials such as chips, carriers, and metal bonding feet have good adhesion. If there is contamination or poor surface activity, it will cause the surface layer of the plastic package to peel off. Packaging after plasma cleaning can effectively improve surface activity, improve adhesion, and improve packaging reliability. After the substrate and chip are cleaned by plasma, one of the indicators for detecting whether there is a cleaning effect is the wettability of the surface. The contact angle of the pad packaging tape before and after plasma treatment is measured, and the contact angle of the sample before and after plasma cleaning is: 70° to 80° before cleaning on the solder fill paint, 15° to 20° after cleaning; contaminated gold plating The contact angle of the solder joints before cleaning is 60° to 70°, and after cleaning, it is less than 20° or lower. Of course, the contact angle measurement can only be used as an indication method to obtain the expected results. That is to say, there are also two factors: wire bond thickness and good mold adhesion. Moreover, the cleaning effects of different manufacturers, different products and different cleaning processes are different, which shows that the improvement of wetting characteristics. It is very beneficial for plasma cleaning technology to be used before the packaging process. Plasma cleaning technology has been widely used in many fields and has become an essential equipment in many precision manufacturing industries. Plasma technology combines plasma physics, chemistry, and chemical reactions at the gas-solid interface. It spans a variety of fields, including chemical engineering, materials, and energy. Therefore, it will be extremely challenging and full of opportunities. With the rapid growth of semiconductors and optoelectronic materials in the future, the application demand in this area will also increase.

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