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Technical advantages of atmospheric plasma surface treatment machine and plasma surface application

Technical advantages of atmospheric plasma surface treatment machine and plasma surface application

        The advantages and uses of the atmospheric plasma surface treatment machine: change the microstructure of the material, the hydrophobicity becomes hydrophilic, enhance the surface wettability, form an activated surface, enhance the surface adhesion ability, and improve the reliability and durability of the surface. Since atmospheric plasma is potentialless, plasma treatment can be combined in conductive, semiconductor, and non-conductive applications. Atmospheric plasma surface treatment machine technology         1. Change the microstructure of the material to make the hydrophobic become hydrophilic;         2. Enhance the surface wetting function to make it an activated surface;         3. Improve surface bonding ability, improve surface reliability and durability;         4. A contact angle tester can be used to quantitatively determine the effect of the treatment.         Plasma cleaning machine, also known as plasma surface treatment instrument, is a brand new high-tech, which uses plasma to achieve effects that cannot be achieved by conventional cleaning methods. Plasma is a state of matter, also known as the fourth state of matter, and does not belong to the so-called three states of solid gas. Add enough energy to the gas to make it ionize and become a plasma state. The "active" components in plasma include: ions, electrons, atoms, activated groups, excited states (metastable states) and photons. Use the properties of these active components to treat the surface of the sample to achieve the purpose of cleaning and coating, improve the surface adhesion of the product, and facilitate the adhesion, spraying, printing and sealing of the product.         Atmospheric plasma surface treatment machine plasma cleaning can effectively clean the surface, remove impurities, pollutants, residues and organic matter. Sometimes, this process is called micro-cleaning or etching, it provides another important role in improving adhesion, and plasma treatment has fast surface activation speed, high efficiency, economical and environmental protection.

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Plasma treatment system equipment improves the adhesion of plastic glass mobile phones and other products

Plasma treatment system equipment improves the adhesion of plastic glass mobile phones and other products

Plasma treatment system equipment can improve the wetting performance of polymer materials, rubber, metal, glass, ceramics, etc. Change the molecules of the hard-to-stick material to make it have better adhesion performance without damaging the surface. Plasma treatment system equipment         Plasma treatment system equipment is very suitable for three-dimensional plastic products, films, rubber profiles, coated cardboard, foam, solid materials and other thick material sheets. It is suitable for medical, automotive, packaging, FPC, mobile phones and polymer films and other industrial fields .         In general, foam, glass, plastic sheets and corrugated materials have poor wettability, and plasma treatment is required:         1. Generally, plastic products can only be used after surface treatment.         2. The hydrophobicity of the glass surface makes it difficult to bond.         3. Many materials need to be micro-processed before coating, printing or coating.         Because of its material composition and uneven surface, anti-corrugation plastic board and wall board post-processing applications. Through mature technology, plasma processing system equipment can achieve high-performance and high-efficiency production, because our plasma system increases the combination of ink, paint, and adhesive with the substrate to improve adhesion. Plasma treatment is suitable for production lines or manual treatment stations. The operation is simple. The equipment can generate a large amount of plasma to increase the effect of surface active treatment, thereby forming a firm bond between the substrate, ink, laminate, paint and adhesive. The plasma processing system can be set before printing or lamination, or it can be used as a separate manual system. Process control interface, surface treatment is uniform, reliable and repeatable.         Chengfengzhi has developed several different types of plasma treatment special plasma treatment system equipment, namely atmospheric pressure plasma treatment system, vacuum plasma treatment system, wide-format plasma treatment, etc., used in flat plates, glass, extruded hollow plates, Surface treatment of foam, honeycomb materials and printed electronics. Linear plasma system processing can prevent damage to fine substrates and embedded circuits. Provide customers with real, economic and efficient plasma surface treatment and other plasma surface treatment system solutions.         Through research, professional knowledge, innovation and experience, we will promote high-quality plasma equipment products to the domestic market. Provide a complete set of standard products and customized products to meet the needs of customers regardless of the size and scope of the project. Cooperate earnestly and establish good and long-term customer relationships with high-quality products and excellent services.

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Hydrogen plasma surface treatment process plasma cleaning BAG to improve the solderability of BGA

Hydrogen plasma surface treatment process plasma cleaning BAG to improve the solderability of BGA

        The solder balls of BGA devices are often very easy to oxidize, and the soldered BGA solder joints are not only inferior in appearance, but their electrical and thermal properties are also greatly reduced. The plasma surface treatment process can effectively remove the oxide on the surface of the BGA solder ball. The method has simple process, significant effect and high efficiency, and is an effective method for removing oxides of BGA components and other surface-mounted components. Plasma surface treatment process         To achieve good reliability in the soldering of BGA devices, the solderability of the BGA solder balls is very important. However, due to various reasons, such as long storage period, exposure to the atmosphere, high baking temperature, and some corrosive industrial waste gas in the atmosphere, it is easy to cause oxidation and corrosion of BGA solder balls.         The oxidative corrosion of the solder ball makes the solder ball look dull, gray, dark and black, making it impossible for the vision system of the automated placement machine to recognize it, making it impossible to carry out large-scale automated production. More importantly, the poor solderability of the solder balls will bring about a series of problems, such as welding voids, false soldering, and desoldering. These soldering defects will cause the reliability and long-term working life of the BGA. Serious impact.         Methods to improve the solderability of BGA solder balls Once the BGA solder balls are oxidized and corroded, appropriate treatment measures must be taken to restore their solderability. Common methods are:         (1) Coat active flux on the solder balls, and then re-melt them. In this way, the BGA has to undergo a high temperature melting, which may cause thermal damage to the BGA. In addition, an additional cleaning process must be added, because active flux is used, and all flux residues must be completely removed, which increases the complexity of the process.         (2) Remove the solder balls of the BGA and replant the balls. The ball planting process is complicated, difficult, time-consuming, and needs to heat the BGA twice. Two times of heating may cause adverse effects on the internal circuit of the BGA. And the work efficiency is low, not suitable for mass production. In addition, the success rate of planting the ball is not very high.         (3) Use high-temperature hydrogen for reduction. Hydrogen has a strong reducing ability and can effectively remove the oxide corrosion layer on the surface of the solder ball. But high temperature is likely to damage BGA devices.         (4) Use reducing acid gas for reduction, but it also requires a high temperature of about 220 degrees Celsius, and formic acid is corrosive to a certain extent.         (5) The method of pickling is adopted. Using a relatively dilute acid, such as dilute hydrochloric acid and citric acid with a volume fraction of about 10%, can remove the oxide on the BGA solder ball, but the acid solution is likely to corrode the BGA device.         (6) Of course, it can be discarded. But many BGA devices are very expensive, and discarding them will cause huge losses.         None of the above methods are very good. Now we introduce a novel method to treat BGA devices with hydrogen plasma in the plasma surface treatment process, which can greatly improve the reliability of BGA devices, and the process is simple, effective and efficient. high.         Advantages of using hydrogen plasma to remove BGA oxide:         The hydrogen plasma is used to reduce the oxide on the BGA solder ball, the process is simple, no high temperature is required, the device is less damaged, no cleaning and drying are required, and the removal effect is good, and the production efficiency is also high.         The application of BGA solder ball oxide layer can draw the following conclusions:         (1) The activity of hydrogen plasma is much stronger than that of molecular hydrogen, and it has good reducing activity at low temperatures;         (2) Proper heating of the hydrogen plasma can greatly improve the reducing activity of the hydrogen plasma;         (3) Hydrogen plasma treatment can improve the appearance of BGA solder joints, making the solder joints appear full, round and bright;         (4) Hydrogen plasma treatment of oxides on BGA solder balls has simple process, good effect and high efficiency;         (5) The method of hydrogen plasma to remove the oxide layer can be extended to the removal of oxides of all surface mount components.

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Application of plasma cleaning of pcb plasma cleaning machine in FPCB assembly

Application of plasma cleaning of pcb plasma cleaning machine in FPCB assembly

Application of plasma cleaning of pcb plasma cleaning machine in FPCB assembly:         The market demand for flexible printed boards and rigid-flex printed boards is increasing. It places high requirements on board requirements such as surface roughness and surface material modification. Plasma cleaners and PI surface modification can be used to achieve The purpose of roughening and surface modification. pcb plasma cleaner cleaning         With the development of electronic products toward miniaturization, lightness and thinness, portability, and multi-function, flexible printed circuit boards (FPCB) and rigid-flex printed circuit boards (R-FPCB) are increasingly used.         Because the material used in FPCB and R-FPCB is polyimide (PI), its hydrophilicity is poor, and its smooth surface results in poor bonding performance. It is necessary to modify the PI surface without changing the overall performance of PI. It can improve the roughness and improve the bonding performance to meet the long-term requirements of terminal electronic products.         Plasma cleaning machine can meet the requirements of PI surface roughening and surface modification. Plasma cleaning is a dry process. Plasma cleaning mechanism and characteristics: The high-frequency generator separates the processing gas under the electric field energy and vacuum conditions to establish plasma. In the plasma state, the electrons are free from the bond of the central atom, and the neutral atoms, neutral molecules and positive and negative ions make irregular movements. It has a very high energy, but overall it is apparently neutral. The gas molecules in the vacuum are excited by electric energy and the accelerated electrons collide with each other to excite the outer electrons of the atoms and molecules, from the ground state to the excited state, and transition to a more stable orbit. The electrons leaving the ground state orbit generate ions or reaction activity. Relatively high free radicals.         The resulting free radicals, positive and negative ions collide with the surface of the material under the continuous acceleration of the electric field and under the collision of high motion, destroying the van der Waals force between the molecules and the original bonding between the molecules at a depth of several microns. A certain depth of surface material on the PI surface is shaved off to form fine unevenness, and the gas generated at the same time becomes a functional group, which will continue to induce physical and chemical changes on the surface of the material. In general, the whole process is the process of continuous gas ionization and continuous recombination reaction, so as to ensure the continuous progress of the entire reaction, and then achieve the purpose of roughening the PI surface and modifying the PI surface.         In the FPCB assembly process, the reinforcement will be assembled on the PI cover film, and it is required to improve the bonding force between the reinforcement and PI. In the case that the reinforcement surface cannot be processed, the PI surface should be roughened and modified to meet the reliability requirements. Sexual requirements.         Treating PI surface with plasma cleaner has the following characteristics:         (1) The PI surface after plasma cleaning is already very dry, and there is no need to go through subsequent drying treatments         (2) The use of gas solvents will not produce harmful pollutants on the PI surface, which is an environmentally friendly green cleaning method;         (3) The plasma generated by the high-voltage electric field has no direction and can penetrate into the tiny holes and depressions on the PI surface;         (4) While cleaning the PI surface, it can also change the surface properties of the PI material itself, improve the wetting performance of the surface, and increase the bonding force.

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The importance of PCB plasma equipment surface plasma treatment technology in PCB applications

The importance of PCB plasma equipment surface plasma treatment technology in PCB applications

        A variety of dedicated surface PCB circuit boards can be used in plasma products. Plasma equipment applications include improving adhesion and surface activation. In the pre-processing of the PCB board, the PCB plasma equipment can change the dyne value and contact angle to achieve the desired effect. Surface treatment technology of PCB plasma equipment         The vacuum plasma equipment uses a vacuum chamber, so that there is no conductive channel between the tape and the PCB circuit board skeleton area, and there is a free conductive channel in the PCB circuit board skeleton area. The ring material is made of insulating non-conductive material, and the conductive path between aluminum plasma and aluminum is limited to the PCB circuit board area. There is a gap of 2mm between the toroidal tape and the frame piece. Since there is no plasma generation or at the bottom of the wafer and tape, undercuts and delamination are minimized, and there will be no sputtering or tape deposition on the wafer surface. According to our method, the gap between the ring edge and the lower electrode is reduced to obtain an extended area of ​​2mm or less, so that you can get a secondary plasma like other systems instead of a primary plasma.         The retention coating improves the adhesion of the retention coating, and it is usually difficult to provide adequate protection to certain materials that meet strict environmental requirements (such as TPU). Plasma treatment technology improves the wettability of the surface and improves the adhesion of the conformal coating to high-performance solder mask materials and other difficult-to-attach substrates. In addition, the use of plasma equipment to process the PCB improves the flow properties of the conformal coating material. Other challenges for conformal layer adhesion include contaminants such as mold release compounds and flux residues. Plasma treatment is an effective way to clean circuit boards. Plasma treatment can remove contaminants without damaging the substrate. It can provide a single-stage plasma treatment plasma processing system-including etch back and cleaning-up to 30 panels per cycle (panel size is 500x813mm/20x32 inches), which can be used in the manufacturing process of flexible electronic PCBs and substrates Achieve a speed of 200 units/hour.         Plasma equipment is used for PCB circuit board processing and is ideal for wafer-level and 3D packaging. Applications of plasma include dust removal, ashing/photoresist/polymer stripping, dielectric etching, wafer bumping, organic contaminant removal, and wafer demolding.         Plasma systems are ideal for typical back-end packaging steps before wafer processing, as well as wafer fan-out, wafer-level packaging, 3D packaging, flip-chip and traditional packaging. The cavity design and control structure can achieve a short plasma cycle time and low overhead, which can ensure the throughput of your production process and reduce costs. The plasma cleaner supports automatic processing and handling of round or square wafer/substrate sizes from 75mm to 300mm in diameter. In addition, depending on the thickness of the wafer, it can be processed with or without a carrier sheet. The plasma chamber design provides excellent etching uniformity and process repeatability. The main plasma surface treatment technology applications include various etching, ashing and dust removal steps. Other plasma processes include decontamination, surface roughening, improved wettability, and enhanced bonding and adhesion strength, photoresist/polymer peeling, dielectric corrosion, wafer bumping, organic contaminant removal, and wafer demolding. Wafer cleaning-before the wafer collides, the plasma equipment will remove pollutants, organic pollutants, fluorides and other halogen pollutants, as well as metals and metal oxides. Plasma also improves the adhesion of the film and cleans the metal bonding pads.         The plasma system of the circuit board plasma equipment removes silicon wafers, is used to redistribute, strip/etch the pattern dielectric layer of the photoresist, enhance the adhesion of the wafer application material, remove the mold/epoxy resin applied to the excess wafer, and enhance the gold The adhesion of the solder bumps reduces the damage to the chip, improves the adhesion of the spin-coated film, and cleans the aluminum bonding pad.

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Automatic surface plasma treatment solution plasma cleaning machine solution

Automatic surface plasma treatment solution plasma cleaning machine solution

        Chengfeng Zhizhi provides atmospheric pressure plasma, wide-width linear vacuum plasma and automatic surface plasma treatment solutions. No matter what kind of plasma surface modification and activation is required for your production, we can find a suitable plasma cleaning machine for you. Program. Automatic surface plasma treatment solution         Chengfeng Zhizhi provides atmospheric plasma and vacuum plasma automatic surface plasma treatment solutions, which can increase the surface energy of rubber components and ensure that printing inks, paints, adhesives, coatings, wool, anti-stick paints, etc. have good adhesion. Plasma surface activation, cleaning, modification and other equipment have been widely used in various industries and are widely used in various substrates.         With years of experience and continuous product development, it has become the preferred supplier of plasma cleaning machine solutions. An increasing number of customers cover the following industries: electronics industry, sheet industry, automation, lithium battery industry, glass manufacturing, semiconductor chip cleaning, aerospace and ceramic automotive industries.         Utilizing our rich plasma treatment and surface measurement technology, automatic surface plasma treatment program engineers have prepared standard training courses for customers at any time, covering the theoretical and practical applications of surface and surface measurement. At the same time, the company has also established a complete after-sales service system, including pre-sales training and after-sales service. Providing training courses to customers and distributors strengthens our commitment not only as a supplier but also as a technical partner in the surface treatment industry. After professional training, improve the overall efficiency of the company, reduce production costs, and increase the enthusiasm of employees.

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