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Plasma activation and modification

Plasma activation and modification

1. Many industrial plastic surfaces such as PE, PP, ABS, PET, PS, EPDM, PTFE, etc. usually have low surface energy and cannot be fully infiltrated, which makes it very difficult to paint, print and bond on their surfaces; Even some organic materials, metals, silicone rubber, glass and ceramics, such as coating, bonding effect is often more difficult, or to pay a high price with the help of professional polymer products to solve. 2. Use a different atmosphere produced by the activity of plasma can form different groups, such as oxygen groups such as - OH groups such as the NH2 (hydroxyl groups) or nitrogen (amino functional groups) and so on, these reactive group can focus on the material surface, this makes the implementation of two different material of joint very easily, it is one of the traditional method of surface treatment technology can't compare with. 3. With the help of low temperature plasma technology, activation or chemical modification can be obtained simply and effectively on the surface of materials. The application of plasma treatment has appeared in many modern industrial processes. This process has been proved to be advantageous in improving the processing properties of materials, such as bonding, printing, coating, etc., and is widely used in various high-tech fields all over the world.

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Plasma surface coating

Plasma surface coating

Plasma surface coating is a process by which active groups are deposited on the surface of a material, allowing ordinary coatings to be applied to a wide variety of special materials. In addition according to the need to achieve the purpose of the selection of hydrophobic coating, hydrophilic coating, diffusion resistant coating, biocompatible coating, primer coating and so on, get a variety of wonderful results. Selective corrosion protection of electronic components and components against climate impacts is critical to the reliability of a wide range of products. Almost half of all defects in modern cars are caused by weather-related aging and corrosion damage to electronic components. Even at extreme temperatures, protection against moisture, chemicals and harmful gases is an essential prerequisite for avoiding such system failures. Currently, these requirements are met primarily through paint, resin, or gel (silicon) coatings. However, the application of these processes is laborious and time-consuming, and shows limitations in economic and environmental protection. Solvent-based coating systems commonly used are relatively thick and difficult to select coating areas. Depending on the specific type of protective coating, defects such as poor heat dissipation, moisture absorption, coating peeling off or sensor signal attenuation may also occur. High tolerance to environmental conditions: the new quality standards for components are coated in the required areas without affecting other sensitive areas to bring long-term stability to the adhesives. The plasma system has a small space footprint and can be integrated into the product's processing flow to maintain a process pattern that requires small processing cycles and short environmental protection when recycling materials.

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Plasma surface etching

Plasma surface etching

1. Almost all kinds of organic materials can be etched by plasma. The etching effect is based on the same chemical reaction as the cleaning effect. Through the correct selection of plasma equipment gas composition and proportion, using the appropriate excitation frequency, adjusting different power, vacuum degree, treatment time, etc. Can achieve a powerful treatment effect. 2. Carbon tetrafluoride can be used in most cases in addition to oxygen to increase the etching rate. In this process, the free radicals produced by the tetrafluorocarbons exceed the activity of the oxygen plasma. However, the proportion of tetrafluorocarbons reaches a critical point where their activity gradually decreases and their reaction gases must be controlled with appropriate filters. 3. The combination of wet chemical etching and low-temperature plasma dry etching can be adopted for the workpiece with large etching amount to make the treatment more effective. Advantages of plasma etching: Aperture permeability is good, very suitable for microporous; Has almost all dielectric etch; The process is controllable and the consistency is good. Support downstream drying processes; Low cost of use and waste disposal; Environmental protection technology, no harm to the operator's body. Application Industry: Semiconductor, microelectronics, printed circuit board, biochip, solar silicon wafer etch, etc.

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Low temperature plasma treatment improves the surface adhesion of plastics

Low temperature plasma treatment improves the surface adhesion of plastics

Difficult to stick plastic mainly refers to polyethylene (PE), polypropylene (PP) and other polyolefin and polytetrafluoroethylene (PTFE), perfluoroethylene propylene (FEP) and other fluorinated plastics. This kind of plastic usually has the advantages that other polymer materials do not have, such as PE polyolefin plastic low cost, good performance, easy to process into various profiles, so it is widely used in daily life; PTFE, commonly known as plastic King, is a plastic with excellent comprehensive performance, excellent heat resistance, cold resistance and chemical corrosion resistance. It is widely used in the electronics industry and some cutting-edge fields. However, due to the difficult plastic surface is chemically inert, without special surface treatment, it is difficult to use general adhesive for bonding. Reasons for difficult adhesion: 1.difficult to adhere to the plastic treatment  molecular chain structure, high crystallinity, good chemical stability, their swelling and dissolution than the non-crystalline polymer is difficult, when the solvent adhesive bonding, it is difficult to occur polymer molecular chain diffusion and entanglement, can not form a strong adhesion. 2. PE molecular chain is non-polar polymer without any polar groups; There is -CH3 in the molecular structure unit of PP, but -CH3 is a very weak polar group, so PP basically belongs to non-polar polymer; Fluorinated plastics, such as PTFE, are also non-polar polymers due to their highly symmetrical structure. Adhesive adsorption in these difficult plastic surface can only form a weak dispersion force, but the lack of orientation force and induction force, so the adhesion property is poor. 3.difficult to stick plastics in addition to the structural reasons; There is also a weak boundary layer on the material surface. The weak boundary layer comes from the low molecular components of the polymer itself, the various additives added in the polymerization process, and the impurities brought by the processing, storage and transportation. This kind of small molecule material is very easy to precipitate and collect on the plastic surface, forming a weak interface layer with very low strength. The existence of this weak boundary layer greatly reduces the bonding strength of plastics. Methods for surface treatment of hard-to-stick plastics: At present, the improvement of adhesive properties of refractory plastics is mainly achieved by surface treatment and research and development of new adhesives. Among them, there are mainly the following several ways to treat the difficult plastic surface: (1) lead the human polar group on the molecular chain of the difficult plastic surface; (2) Improve the surface energy of the material; (3) Improve the surface roughness of products; (4) Reduce or eliminate the product surface of the weak interface layer. The surface treatment methods of refractory plastics include chemical treatment method, high temperature melting method, gas thermal oxidation method, radiation grafting method, ArF laser method and low temperature plasma method, among which low temperature plasma method has developed rapidly in recent years. Low-temperature plasma cleaning machine: A low-temperature plasma is an ionized gas produced by a low-pressure discharge (glow, corona, high frequency, microwave, etc). Under the action of an electric field, free electrons in the gas gain energy from the electric field and become high-energy electrons. These high-energy electrons collide with gas molecules, atoms, if the electronic energy is greater than the atoms or molecules of the excitation energy can produce trigger molecules or atoms excited free radicals, ion and with different energy radiation, low temperature plasma in the active particles can be chemical reactive gas, inert gas (gas) or metal elements are usually close to or more than with the energy of a C - C key or other C key key can inject polymer surface by ion bombardment or, produce off key or the introduction of functional groups, the surface activity to achieve the purpose of modification, plasma cleaning machine can well solve the problem of low plastic surface adhesion.

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The difference of cleaning method of plasma cleaning machine

The difference of cleaning method of plasma cleaning machine

Low temperature plasma equipment is also a dry cleaning method, and compared with the wet cleaning method, it has a simple process, controllable, and the product can achieve a clean, no residue purpose. And the wet cleaning method, its disadvantage is likely to be a one-off wash not clean, will there be any residue, using plasma equipment for dry cleaning its reaction is in need of gas, the gas and we use most is non-toxic, and wet cleaning method many is to use a large amount of solvent, which also contains a lot of chemical composition, are harmful to human body, also can have influence on the environment. In the process of plasma processing using plasma cleaning machine, it includes two cleaning processes, one is chemical reaction, the other is physical reaction. Among them, the plasma cleaning machine based on chemical reaction has a very fast cleaning speed, good performance, high selectivity, in the removal of organic matters, oxides, and do surface activation have a very good effect.

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Plasma cleaning machine features

Plasma cleaning machine features

Due to the low cost and flexible operation of plasma cleaning machine, it has been widely used in various high-tech industries, especially in semiconductor, microelectronics industry, integrated circuit electronics industry and vacuum electronics industry, can be said to be a very important equipment. In addition, plasma cleaning machine in textile, automotive, aerospace, biological engineering, medical treatment, plastic rubber, archaeology and other industries also have a very wide range of applications. In these industries, the role played by the plasma cleaning machine is mainly cleaning, etching, activation and surface preparation. When in use, the three rf generators of 40KHz, 13.56MHz and 2.45GHz can be selected to meet the requirements of different cleaning efficiency and effects. Through the application of plasma cleaning machine in these industries, we can find that it has the following characteristics: 1. flexible operation, can simply change the type of processing gas and processing procedures; 2. It will not cause any harm to the operator's body during use; 3. for the plasma treatment, the cost of plasma cleaning machine is very low, has a high cost performance. Precisely because it has these characteristics, making the plasma cleaning machine equipment in plasma cleaning, etching, icp, plating coating, surface modification and plasma ashing has very extensive application in the occasion, and through its processing, can effectively improve the surface wetting ability, so that a variety of material to be able to conduct coating and plating operations, such as enhanced adhesion ability and the bonding force, at the same time can also be organic pollutants, oil or grease to clear clean, very much.

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