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What is a plasma cleaner machine

What is a plasma cleaner machine

Plasma cleaning machine, also known as plasma surface treatment machine, is a high-tech technology, the use of plasma to achieve conventional cleaning methods cannot achieve the results. Plasma cleaning is a dry cleaning method, which use gas phase chemical method to remove surface pollutants. The gas phase chemical method mainly includes thermal oxidation method and plasma cleaning method, etc. The cleaning process is to introduce the thermochemical gas or plasma reaction gas into the reaction chamber, and the reaction gas reacts with the wafer surface to generate volatile reaction products that are vacuum-pumped out.

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Plasma cleaner machine in microelectronic package of application

Plasma cleaner machine in microelectronic package of application

In the production process of microelectronic packaging, a variety of fingerprints, flux, cross contamination, natural oxidation, devices and materials will form a variety of surface contamination, including organic matter, epoxy resin, photoresist and solder, metal salts, etc. These stains can have a significant impact on the packaging production process and quality. The use of plasma cleaning machine can be easily removed through the formation of contaminated molecular production process, to ensure the atoms and atoms between the close contact surface adhesion of the workpiece, so as to effectively improve the bonding strength, improve the quality of wafer bonding, reduce the leakage rate, improve packaging performance, output and component reliability. The choice of plasma cleaning process in microelectronic packaging depends on the requirements of subsequent processes on the material surface, the chemical composition of the original characteristics of the material surface and the properties of the pollutants. Plasma cleaning gases are commonly used for argon, oxygen, hydrogen, carbon tetrafluoride and their mixed gases. Small silver adhesive substrate: contaminants can cause colloidal silver to be spherical, which is not conducive to chip adhesion and easy to chip damage. The use of rf plasma cleaning can greatly improve surface roughness and hydrophilicity, which is conducive to silver colloidal and ceramic tile chip adhesion. At the same time, the usage can save silver adhesive and reduce cost. Lead bonding: Before the chip joins the substrate and after curing at high temperature, existing pollutants may contain microparticles and oxides. Physical and chemical reactions of these pollutants lead and welding between the chip and the substrate are incomplete with poor bond strength and poor adhesion. Rf plasma cleaning can significantly improve the surface activity, bonding strength and tensile strength of the bonding wire before wire bonding. The pressure on the joint can be low (when there are contaminants, the head penetrates the contaminants, the need for greater pressure), and in some cases the bonding temperature can also be lowered, thereby increasing production and reducing costs. Sealant: In the epoxy resin process, pollutants will lead to high foaming rate of foam, resulting in low product quality and service life, so in order to avoid the formation of sealing foam also pay attention to. After rf plasma cleaning, the bonding of the chip and substrate will be closer to the colloid, which will greatly reduce the foam formation, and also significantly improve the heat dissipation rate and light emissivity.

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What is the difference between atmospheric plasma cleaning machine and vacuum plasma cleaning machine

What is the difference between atmospheric plasma cleaning machine and vacuum plasma cleaning machine

Atmospheric plasma cleaning equipment, now most of the application is the mobile phone industry: mobile phone glass surface activation treatment, bottom glue before treatment, packaging front-end treatment, mobile phone shell surface activation treatment before painting. General mobile phone factory daily thousands to tens of thousands of capacity, it is necessary to have a fast and efficient activation process, atmospheric plasma cleaning machine is born for this. Whether fitted on a three-axis platform, transmission machine or installed on the whole line, the atmospheric plasma cleaning machine can quickly make one of the surface of the material to be processed to achieve a good activation effect. And vacuum plasma equipment it is its high performance, high quality, and high quality, and safety of product features, treatment effect comparison precision comprehensive, a lot of the material of the product itself, so cannot be used as the temperature of the atmospheric plasma equipment is relatively higher plasma device, this time can choose vacuum plasma equipment. The differences are as follows: 1, because the atmospheric plasma nozzle is directly ejected the ion, this situation by the nozzle structure indirectly changed the direction of ion movement (directly facing the material being processed). Thus atmospheric plasma can only process one surface on the pipeline, which is also one of the differences with vacuum plasma cleaning. Vacuum plasma cleaning machine in the work, the ions inside the cavity is not directional, as long as the material in the cavity exposed part, no matter which side and which corner can be cleaned. Second, in the use of gas, atmospheric plasma only need to access compressed air, of course, to better effect of direct access to nitrogen. The vacuum plasma cleaning machine will have more choices in gas, and can choose a variety of gases for matching material surface oxide, nanometer microorganism removal has a strong improvement. It should be emphasized here that the main purpose of the atmospheric type of gas is to activate and enhance the permeability. The purpose of vacuum gas is to enhance the etching effect, remove pollutants, remove organic matter, and enhance the erosion property. Obviously, the selection range of gas is wider and the vacuum plasma cleaning process will be more widely used. 3. Temperature. Although the temperature of the atmospheric plasma cleaning machine is about 60°-75° after several seconds of material processing, this data is measured according to the distance of the spray gun to the material is 15mm, the power is 500W, and the triaxial speed is 120mm/s. Of course, power, time of contact, and height of treatment all affect the temperature. Special attention is: atmospheric plasma cleaning machine spray gun work of the "flame" is divided into the internal flame and the external flame, when we clean are to take the external flame to wash, the internal flame in the nozzle inside, from outside is not visible. But it is easy to burn the surface if you do not move at a point for a long time in the presence of a "flame". Therefore, the temperature of atmospheric plasma can only be measured under the actual conditions. The vacuum plasma cleaning machine is not so complex, according to the power frequency division, 40KHz and 13.56MHz for example: usually the material into the body to work, the frequency of 40KHz general temperature is below 65°, and the machine is equipped with a strong air cooler, the treatment time is not long, the surface temperature of the material will be the same as room temperature. Frequencies at 13.56MHz are lower, usually below 30°. Therefore, it is suitable to deal with some materials that are easily deformed by heat. 4. Ion generation conditions. It can be seen intuitively that the atmospheric type depends on the access gas, and the gas pressure needs to reach about 0.2mpa to produce ions. The vacuum type relies on the vacuum pump. Before ion production, the vacuum degree inside the cavity must be pumped below 25pA to produce ions, even if no external gas is connected.

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Plasma equipment discharge processing and plastic removal machine application

Plasma equipment discharge processing and plastic removal machine application

With the continuous development of science and technology, new technology is applied in the production and processing of machinery and equipment, making the form of production and processing more perfect. Today we are going to introduce the plasma surface treatment equipment under the discharge processing points, and to see the plasma to glue machine application points. I'm sure you're curious about this, so let's go down here. The main advantages of corona discharge treatment are that a vacuum system is not required and the equipment investment is much lower than that of conventional low-temperature plasma devices, so corona treatment was used early on to improve the wetting and printing performance of polymer surfaces. Corona discharge treatment is mainly used for polyolefin surface treatment, such as improving PE self-adhesive, in addition, in the corona treatment of oxygen or oxygen gas found that the change of the form, the surface roughness and the size of the branch with the increase of processing time, before the adhesive wood surface after corona treatment with polyethylene or polystyrene thermal bonding performance improved. It is very simple and efficient to use plasma gluing machine for gluing operation. The surface after gluing is clean and smooth without any scratch, low cost and environmental protection. Dielectric plasma stripping machine at the time of etching, will generally be used on the parallel plate capacitance coupling plasma reactor, in the parallel plate reactor, reaction ion etching chamber is adopted by the cathode area is small, the asymmetrical design of anode area is large, and need by etching the objects are placed to the smaller electrode.

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Plasma cleaning machine has nine advantages

Plasma cleaning machine has nine advantages

Compared with traditional wet cleaning using organic solvent, plasma cleaning machine has the following nine advantages: 1. The cleaning object is dry after plasma cleaning, and can be sent to the next process without further drying treatment. Can process the efficiency of the whole process line; 2. Plasma cleaning can keep users away from harmful solvents to human body, and avoid the problem that cleaning objects are easy to be damaged in wet cleaning; 3, avoid the use of trichloroethane and other harmful ODS solvents, so that the cleaning will not produce harmful pollutants, so this cleaning method belongs to the environmental protection of the green cleaning method. This becomes more and more important in the context of global concern for environmental protection; 4, plasma cleaning machine using radio frequency range of the plasma produced by the laser and other direct light is different. The plasma is not very directional, which allows it to go deep into the tiny holes and pits of the object to complete the cleaning task, so there is no need to worry too much about the shape of the object to be cleaned. And the cleaning effect on these hard-to-clean areas was even better than that of freon cleaning; 5, the use of plasma cleaning, cleaning efficiency can be greatly improved. The whole cleaning process can be completed in a few minutes, so it has the characteristics of high yield; 6, the plasma cleaning machine cleaning needs to control the vacuum of about 100Pa, this cleaning condition is easy to achieve. Therefore, the equipment cost of this device is not high. In addition, the cleaning process does not require the use of expensive organic solvents, which makes the overall cost lower than the traditional wet cleaning process. 7. Plasma cleaning is used to avoid transportation, storage, discharge and other treatment measures of cleaning fluid, so it is easy to keep the production site clean and hygienic; 8, plasma cleaning can not be separated from the treatment of objects, it can handle a variety of materials, whether it is metal, semiconductor, oxide, or polymer materials (such as polypropylene, polyvinyl chloride, polytetrafluoroethylene, polyimide, polyester, epoxy resin and other high polymer) can be used to treat the plasma. Therefore, it is especially suitable for materials that are not resistant to heat and solvent. And can also selectively clean the whole, part or complex structure of the material; 9. At the same time of cleaning and decontamination, it can also improve the surface performance of the material itself. For example, improving the surface wettability and film adhesion is very important in many applications. Plasma cleaning machine has been used in the manufacture of various electronic components, we can be sure that, without the plasma cleaning machine and its cleaning technology, there would be no today so developed electronics, information and communication industries. In addition, the plasma cleaning machine and cleaning technology and application in the optical industry, machinery and aviation industry, polymer industry, industrial pollution prevention, control and measurement, and it is the key technology of product promotion, such as optical components of the coating, extend the life of the mold or machining tool abrasion resistance of the layer, the middle layer of composite material, the surface of the fabric or recessive lens processing, the manufacture of micro sensor, advanced mechanical processing technology, artificial joints, bones, or heart valve antifriction depletion are plasma technology progress, to complete the development.

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Plasma sterilization technology

Plasma sterilization technology

Plasma sterilization technology is a new generation of high-tech sterilization technology, which can overcome some limitations and shortcomings of existing sterilization methods and improve the disinfection and sterilization effect. For example by high temperature steam method and infrared method is not suitable for sterilization processing of plastics, fiber, artificial crystals and optical glass materials and microwave method processing metal objects, weak and not easy to achieve disinfection effect of the place such as corner crack, using this technology, can very well under low temperature to eliminate bacteria sterilization processing without damages to the processed goods. The plasma working material used in this technology is non-toxic and harmless. The technology can also be used in the production line to sterilize and sterilize the products. Mechanism of plasma sterilization: 1, the role of active groups: the plasma contains a large number of reactive oxygen ions, high-energy free groups and other components, easy to bacteria, mold and spores, viruses in the protein and nucleic acid material oxidation reaction and degeneration, so that all kinds of microorganisms die. 2. High-speed particle breakdown: After the sterilization experiment, the images of bacteria and virus particles subjected to plasma were observed by electron microscopy. They were riddled with holes, which was caused by the breakdown and etching effect produced by electrons and ions with high kinetic energy. 3, the role of uv: in the process of excitation hydrogen peroxide to form plasma, accompanied by part of the uv generation, this high-energy uv photons are absorbed by microorganisms or proteins in the virus, resulting in its molecular denaturation and inactivation. Application of plasma sterilization: The plasma sterilization technology applied in the medical field started from the United States in the 1980s. Menashi et al. first proposed that halogen gas plasma has a strong bactericidal effect and can be used for rapid sterilization of non-heat-resistant medical devices. The low-temperature plasma sterilization technology was patented in 1987. Starrad 100S hydrogen peroxide plasma sterilizer developed by Johnson & Johnson was approved by FDA in 1997. Minimally invasive surgery has been widely used in medical institutions in Europe, America, Japan and other developed countries. Since 2004, it has been popularized in China, and dozens of large medical units have begun to use it. Therefore, the use of low temperature plasma sterilization technology in China's medical field has been widely recognized. Characteristics of plasma sterilization: Environmental protection: Taking hydrogen peroxide, a common clinical medium, as the medium, it is stimulated by radio frequency electromagnetic field to form low-temperature plasma and complete sterilization. The product is a small amount of water vapor and oxygen, with no toxic residue and discharge, no damage to medical personnel and no pollution to the environment. Security: Automatic control contact plate, easy to operate, no need of high temperature and high pressure, and simple installation and debugging, safe to use. Room temperature: Sterilization temperature is 35℃ ~ 45℃, dry sterilization, no damage to instruments and articles, can prolong the service life of precious instruments. To save time: Sterilization cycle is short, it can be finished in 30 ~ 50 minutes time simple instrument sterilization, 50 ~ 70 minutes in complex sterilization equipment, after the completion of the operation can be used directly, without like to natural cooling placed after high temperature sterilization, also don't like epoxy ethane need 6 ~ 48 hours after low temperature sterilization ventilation diffusion, in order to reduce the residual ethylene oxide concentration. Wide scope of application: Low temperature sterilization is suitable for a variety of materials and instruments, especially for non-heat-resistant electronic instruments such as endoscope, electronic instrument, battery, wire, photographic camera and other articles sterilization treatment, has unique advantages.

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