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How is the plasma cleaning machine surface treatment technology efficient surface cleaning

How is the plasma cleaning machine surface treatment technology efficient surface cleaning

Plasma pretreatment and cleaning creates ideal surface conditions for subsequent coating of plastics, aluminum and even glass. How is the plasma cleaning machine surface treatment technology efficient surface cleaning? As plasma cleaning is a "dry" cleaning process, the material can immediately enter the next processing process after the treatment, therefore, plasma cleaning is a stable and efficient process. Due to the high energy of plasma, the chemical substances or organic pollutants on the surface of the material can be decomposed, and the impurities that may interfere with adhesion can be effectively removed, so that the surface of the material can meet the requirements of the subsequent coating process. The use of plasma cleaning machine plasma technology according to the requirements of the process for surface cleaning, no mechanical damage to the surface, no chemical solvent green environmental protection process, mold release agent, additives, plasticizer or other hydrocarbon composed of surface pollution can be removed. Surface cleaning by plasma cleaning machine removes fine dust particles that are tightly attached to the plastic surface. Through a series of reactions and interactions, the plasma is able to remove these dust particles from the surface of the object. This can significantly reduce the rejection rate for high quality coating operations such as those in the automotive industry. Through a series of physical and chemical actions at the microscopic level, plasma surface cleaning can obtain fine and high-quality surfaces. Advantages of plasma cleaning: 1. Compared with plasma cleaning, water washing is usually just a dilution process. Compared with CO2 cleaning technology, plasma cleaning does not need to consume other materials. 2. Plasma cleaning can deal with the complete surface structure of the material, not just the protruding part of the surface layer. 3. Online integration without extra space; Low operating cost, environmentally friendly pretreatment process. 4. Pretreatment: Plasma surface activation treatment for different applications. Plasma surface treatment technology can be used for surface activation of a variety of materials, including plastics, metals, glass, textiles, etc. Whether coating or bonding is required on the treated surface, effective activation treatment of the material surface is a necessary process step. By measuring the surface with a surface test ink: Before treatment, the surface tension is low, the test ink can not wet the surface, after plasma treatment, the surface tension is increased, the test ink can wet the surface, the activation effect of plasma treatment on the surface. Plasma surface treatment can effectively activate the surface of the material. For plastics, non-polar surface is often difficult to be bonded and coated, and the activation of the surface is to modify the structure of the polymer molecular chains that constitute the plastic, making the surface of the material easy to be processed and treated Advantages of CRFPLASMA activation: The process is fast and reliable; Uniform plasma beam ensures uniform and stable surface treatment, low-cost, environmentally friendly pretreatment process; Pretreatment process without corona effect; The material is treated without contact with high voltage.    Pretreatment: plasma technology and plasma coating technology, a surface coating technology of unlimited application potentials for using plasma technology or plasma coating technology, can satisfy the demands of subsequent process various features can make the surface with the aid of this novel plasma technology, using low cost of material, can produce a new type of high quality materials, high functional. Plasma coating technology is very suitable for selective coating treatment, which greatly expands the application field of this technology. PET film, aluminum foil, textiles, glass, various plastics, metals and precious metals can be used to finish the surface coating treatment. Using this technique, it is also possible to harden the material, for example in tool manufacturing, or to produce plastic products with sticky or self-adhesive surfaces. Sing Fung Intelligent  Manufacturing: plasma cleaning machine plasma processing to ensure reliable coating adhesion. In practical production, the manipulator is often used to control the plasma spray gun for surface treatment of products. Typical applications of plasma pretreatment technologies include automobile and aviation industries, manufacturing of electronic and electrical appliances, daily necessities and packaging industries. Plasma cleaning machine pretreatment can ensure the adhesion of surface coating on metal materials such as aluminum, plastic materials such as PP or EPDM, or other materials. Process: plasma processing technology is used to achieve reliable and durable bonding qua

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CRF Sing Fung Intelligent Manufacturing launched a new device -4D intelligent integrated plasma processing system

CRF Sing Fung Intelligent Manufacturing launched a new device -4D intelligent integrated plasma processing system

Plasma is an ionized gaseous substance composed of atoms deprived of some electrons and positive and negative ions generated after the ionization of atomic groups. It exists widely in the universe and is often regarded as the fourth state of matter in addition to solid, liquid and gas. Man-made high density, high temperature superconducting tokamak plasma equipment - all nuclear fusion experimental device, its operation principle is vacuum chamber of the device to join a small amount of hydrogen isotopes deuterium or tritium, producing plasma by similar to the principle of transformer, and then improve the density, temperature, make its fusion reaction, reaction process will produce a great energy.Low density, low temperature plasma equipment is also widely used in industrial production. Depending on the "five actions" of the active particles in the plasma, the bonding, bonding, welding, coating, bonding and removing adhesive effects can be enhanced. The pollutants may be organic matter, epoxy resin, photoresist, oxide, particulate pollutants, etc. Different cleaning processes should be adopted for different pollutants, and different process gases should be selected. What fields can the plasma cleaner be used in? Consumer electronics manufacturing (such as fingerprint module, camera module, headphones diaphragm, mobile phone box, ITO glass, plastic accessories and other mobile phone accessories plasma cleaning in addition to electrostatic printing ink, glass cover modification, ITO glass cleaning, glass cover before spraying AF membrane cleaning), optical instrument, IC, semiconductor, semiconductor packaging (Wire Bonding Surface cleaning of the front welding plate, plasma cleaning before integrated circuit bonding, LED pre-adhesive treatment, LED lead bonding treatment, LED to improve the electroplating effect of the support, LED surface activation before LED packaging and cleaning the processes of COB, COG, COF and ACF before ceramic packaging and electroplating. Used for wire-drawing and pre-welding cleaning), FPC/PCB (PLASMA cleaning of FPC PCB cell phone, removal of glue residue in holes, pre-electroplating activation of Teflon, removal of carbides, removal of board residue, etc.), LCD field, new energy battery field, silicone plastic polymer field, biomedical, automobile manufacturing field, shoe making field. 4D intelligent integrated plasma processing system: Product Overview: A single processing system can carry 2-4 plasma spray guns of various types, full network matching, intelligent integration; With more space saving and more types of applications; With RS485/RS232, start-stop I/O control mode, convenient and fast, reduce cost; It can be used in different situations to meet different products and treatment environment. Product features: In-line can be installed In the production Line of customer equipment to reduce customer input costs; Long service life, low maintenance cost. Application: Mainly used in the electronic industry of mobile phone case printing, coating, dispensing and other pre-treatment, mobile phone screen surface treatment; Surface cleaning of aerospace electrical connectors in the defense industry; General industry screen printing, transfer pre - printing treatment, etc.

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Plasma cleaning technology

Plasma cleaning technology

Abstract: Environmental pollution control, personnel labor protection, technology application, in the high-density electronic assembly, precision machinery manufacturing, wet cleaning process is increasingly limited, dry cleaning mechanism and application research is increasingly urgent, plasma cleaning technology in dry cleaning obvious advantages. The main content of this paper is the mechanism of plasma cleaning and the process of low-temperature plasma cleaning. 1. An overview of the Electronic industry cleaning is a very broad concept, including any process related to the removal of contaminants, but the method of cleaning varies greatly from object to object. At present, physical and chemical cleaning methods which have been widely used in the electronic industry can be roughly divided into two types: wet cleaning and dry cleaning. Wet washing has been widely used in electronic industry. Cleaning mainly depends on physical and chemical (solvent) actions. Such as in the chemical active agent adsorption, immersion, dissolution, discrete action supplemented by ultrasonic, spray, rotation, boiling, steam, shaking and other physical action to remove stains, these methods of cleaning function and application range are different, cleaning effect is also different. With the further development of electronic assembly technology and precision machinery manufacturing, higher and higher requirements are put forward for cleaning technology. The cost of wet cleaning is increasing due to the great environmental pollution. Comparatively speaking, dry cleaning has great advantages, especially the cleaning technology based on plasma technology has been gradually applied in semiconductor, electronic assembly, compact machinery and other industries. Therefore, it is necessary to understand the mechanism of plasma cleaning and its application process. 2. Plasma cleaning mechanism Plasma technology, beginning in the 1960 s application in the chemical synthesis, membrane preparation, surface treatment and fine chemical industry and other fields, in large or very large scale integrated circuit technology dry, low temperature, is also developing in recent years the application of plasma polymerization, plasma etching and plasma ashing and dry process technology such as plasma anodic oxidation. Plasma cleaning technology is also one of the progress of drying process. Different from wet cleaning, the mechanism of plasma cleaning relies on the "activation action" of the material in the "plasma state" to remove the object surface stains. From the point of view of various cleaning methods, plasma cleaning is one of the top cleaning methods. Plasma cleaning technology is characterized by both process base material type of object, can be processed, such as metal, semiconductor and oxides and most of the polymer materials (such as polypropylene, polyester, polyimide, poly (ethyl chloride, epoxy, teflon), such as the original base material can handle very well and can realize the overall and partial cleaning and complex structure. One of the important roles of cleaning is to improve the adhesion of the film. For example, Au film was deposited on the Si lining low, and the surface hydrocarbons and other pollution were treated by Ar plasma, which significantly improved the adhesion of Au. After plasma treatment, the matrix surface will leave a layer of gray material containing fluoride, which can be removed with solution. At the same time, it is beneficial to improve surface adhesion and wettability. Free radicals formed by plasma surface activation in the cleaning process can further form specific functional groups, and the introduction of such specific functional groups, especially oxygen-containing functional groups, plays an obvious role in improving the adhesion and wettability of materials. Conventional chemical cleaning in plasma processes has several advantages. Plasmas provide a low temperature environment because they use electrical energy to catalyze chemical reactions rather than heat. Plasma eliminates the danger from wet chemical cleaning and has the advantage over other cleaning methods that there is no waste liquid after cleaning. In short, the plasma process is a simple cleaning process that requires almost no management.

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Plasma technology has many applications

Plasma technology has many applications

Plasma is a universal state in the boundless universe. Most of the glowing stars in the universe have very high internal temperatures and pressures, and most of the matter inside these stars is in plasma. Solid, liquid and gaseous materials are found only in dim planets and scattered interstellar matter.      Right around us, we see plasma all the time. It can be found in the tubes of fluorescent and neon lights, and in the blinding electric arcs. In addition, wonderful plasma can be found in the ionosphere around the Earth, in beautiful auroras, flash discharges in the atmosphere, and in the tails of shooting stars.    What is plasma useful for? Oh! It's very versatile. From our daily life to industry medicine, agriculture, environmental protection, military, space, energy, celestial bodies and other aspects, it has a very important application value.      An important study is the reaction between a hot plasma and a controlled thermonuclear fusion: if the lightest element of a substance, such as the isotope deuterium of hydrogen, is used to form a hot plasma at tens of millions of degrees Celsius, then these nuclei will react. The result is a burst of energy that scientists call thermonuclear fusion. The hydrogen bomb is such an explosive thermonuclear fusion reaction. But the hope is that a thermonuclear fusion reaction, which slowly releases energy and generates electricity, will create an "artificial little sun", a goal that has yet to be achieved.      Another important application is that some special chemical elements form a low-temperature plasma with a macroscopic temperature that is not high, but the electron temperature can reach tens of thousands of degrees Celsius. In this case, special chemical reactions take place between substances, so new materials can be developed. For example, a thin layer of titanium nitride is applied to tools such as drills to enhance their strength, solar cells are made, and the surface of an aircraft is coated with a material specially designed to absorb radar waves to avoid radar tracking (i.e. stealth aircraft)... These are called plasma thin film technologies.    In addition, plasma can also be used to remove the sulfur in smoke, use plasma to irradiate seeds to improve the output of crops, the development of large screen plasma TV, the development of plasma rocket engine to Mars and other distant space travel... The applications of plasmas are endless.    Plasma has also received considerable attention in medical procedures, such as the recent popular use of plasma cryoablation for rhinitis, pharyngitis, and snoring. Plasma low temperature melting operation principle is to make the plasma thin layer is formed between the electrodes and the organization, the layer of ions are electric field acceleration, and transfer energy to the organization, at low temperatures (40 oc - 70 oc) open the intercellular molecules combined with the key, in the target tissue cells into carbohydrates and diseased tissue caused by oxide liquefaction ablation, known as the plasma (not heat effect), so as to achieve the effect of target tissue volume reduction, let.

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Plasma cleaning is widely used in microelectronic packaging

Plasma cleaning is widely used in microelectronic packaging

Abstract: With the development of microelectronic technology, wet cleaning is more and more limited, while dry cleaning can avoid the environmental pollution caused by wet cleaning, and the production rate is also greatly improved. Plasma cleaning has obvious advantages in dry cleaning. This paper mainly introduces the mechanism, type, process characteristics of plasma cleaning and its application in microelectronic packaging process. 1. the introduction Cleaning in the microelectronics industry is a very broad concept that includes any process associated with the removal of contaminants. It usually refers to effectively remove the residual dust, metal ions and organic impurities on the premise of not destroying the material surface characteristics and electrical characteristics. At present, physical and chemical cleaning methods have been widely used, which can be roughly divided into two categories: wet cleaning and dry cleaning. Wet cleaning is still dominant in the current microelectronic cleaning technology. However, from the perspective of environmental impact, raw material consumption and future development, dry cleaning is obviously superior to wet cleaning. Plasma cleaning has been widely used in semiconductor manufacturing, microelectronic packaging, precision machinery and other industries. 2. Plasma cleaning mechanism Plasma is a partially ionized gas, which is the fourth state of matter other than solid, liquid and gas. A plasma consists of electrons, ions, free radicals, photons, and other neutral particles. Because of the existence of active ions such as electrons, ions and free radicals in plasma, it is easy to react with the solid surface. Plasma cleaning technology is characterized by both process base material type of object, can be processing, metal, semiconductor, oxides and most of the polymer materials, such as polypropylene, polyester, polyimide, poly (ethyl chloride, epoxy, and even can well with teflon etc, and can realize the overall and partial cleaning and complex structure. Plasma cleaning also has the following characteristics: easy to adopt numerical control technology, high degree of automation; With high precision control device, the time control precision is very high; Correct plasma cleaning will not produce damage layer on the surface, and the surface quality is guaranteed. As it is carried out in a vacuum, it does not pollute the environment and ensures that the cleaning surface is not contaminated by secondary pollution. 3. Application in packaging process In the production process of microelectronic packaging, due to fingerprinting, flux, various cross contamination, natural oxidation, etc., the surface of devices and materials will form a variety of stains, including organic matter, epoxy resin, photoresist, solder, metal salts, etc. These stains will obviously affect the quality of the packaging process. Using plasma cleaning can easily remove pollution produced in the process of production of the molecular level, ensure the workpiece surface atoms and the attachment materials close contact between atoms, thereby effectively improve the bonding strength, lead to improve chip bonding quality, reduce packaging leak rate, improve the performance of components, yield, and performance. The yield of aluminum wire was increased by 10% and the consistency of the bonding strength was also improved after the plasma cleaning was used in a domestic unit before the bonding. In microelectronic packaging, the choice of plasma cleaning process depends on the subsequent process requirements on the material surface, the original characteristics of the material surface, chemical composition and the nature of pollutants. Gases commonly used in plasma cleaning include argon, oxygen, hydrogen, carbon tetrafluoride and their mixtures. At present, it is widely used in: (1) plasma cleaning of aluminum bonding area (2) plasma cleaning of the substrate welding plate (3) plasma cleaning of copper lead frame (4) plasma cleaning of ceramic packaging before electroplating 4. the conclusion Although wet cleaning plays a dominant role in the current microelectronic packaging production, the environmental and material consumption problems brought by wet cleaning cannot be ignored. As a dry cleaning plasma cleaning has the potential to develop, it can be cleaned regardless of the material type, the cleaning quality is good, and the environmental pollution is small. Plasma cleaning technology has a wide range of applications in microelectronic packaging, mainly used to remove surface pollutants and surface etching, etc. The choice of process depends on the requirements of subsequent process on the surface of the material, the original characteristics of the material surface, chemical composition and surface pollution properties. Introducing plasma cleaning into microelectronic packaging can significantly improve the packaging

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Plasma cleaning machine working with the use of gas

Plasma cleaning machine working with the use of gas

Plasma cleaning machine due to its own characteristics in the process of production of many products have a place for use. In the cleaning process of plasma cleaning machine, it is necessary to cooperate with different gases to achieve the ideal cleaning effect of plasma cleaning machine. Divided by gas: One of the gases used is argon (Ar), an inert gas. In the vacuum chamber cleaning process, argon (Ar) is often used to effectively remove surface nanometer pollutants. It is often used in lead bonding, chip bonding copper lead frame, PBGA and other processes. If you want to increase the corrosion effect, please feed oxygen (O2). By cleaning the vacuum chamber with oxygen (O2), organic pollutants, such as photoresist, can be effectively removed. Oxygen (O2) is more used for high-precision chip bonding, light source cleaning and other processes. Some oxides that are difficult to remove can be cleaned with hydrogen (H2), provided that they are used in a very tight vacuum. There are also special gases similar to carbon tetrafluoride (CF4), sulfur hexafluoride (SF6), etc., which are more effective in etching and removing organic compounds. But the use premise of these gases is to have absolutely corrosion resistant gas path and cavity structure, in addition to their own to wear a good protective cover and gloves to work. Another common gas to talk about is nitrogen. This gas is mainly used in combination with on-line plasma for surface activation and modification of materials. It can also be used in a vacuum. Nitrogen (N2) is the best choice to improve the surface permeability of materials. Now the plasma cleaning machine is usually a 2-way gas, sometimes we will try to mix the gas proportion with cleaning, to achieve different effects.

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