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Activation of plasma cleaning machine

Activation of plasma cleaning machine

In the production process, many materials due to low surface energy, it is difficult to bond, spraying, printing, welding and other processing. Chemical primers, liquid binders, flame treatments, and plasma treatments are all activation methods that increase surface energy. Among them, chemical primer and liquid adhesive often have high corrosive and environmental hazards, flame treatment instability, high risk coefficient. And the plasma cleaning machine treatment of no damage, no pollution, no waste water, in line with environmental requirements, process stability and safety, is a safe and stable surface activation treatment technology. The following is mainly about the activation of plasma cleaning machine 1. Activation principle of plasma cleaning machine: Activated in an air or oxygen plasma, the nonpolar hydrogen bonds of the plastic polymers are replaced by oxygen bonds, providing free valence electrons on the surface to bond with liquid molecules, thus improving the adhesiveness and sprayability of the "unbonded" plastics. In a vacuum plasma, gases other than air and oxygen can be used, and these gases can adsorb nitrogen, amine or carbonyl groups as reactive groups in the position of oxygen. The activity of the surface treated by the plasma cleaning machine remains effective 2-24 hours later. However, follow-up processing should be carried out as soon as possible, because with continuous aging, new dirt will be absorbed and activity will be lost. 2. Use of plasma cleaning machine: (1) Plasma surface activation/cleaning; (2) Bonding after plasma treatment; (3) Plasma etching/activation; (4) Plasma degumming; (5) Plasma plating (hydrophilic and hydrophobic); (6) Enhancing the state character; (7) Plasma coating; (8) Plasma-ashing and surface modification. Through its treatment, can improve the material surface wetting ability, so that a variety of materials can coating, plating and other operations, enhance the adhesion, bonding strength, while removing organic pollutants, oil or grease. 3. Products processed by plasma cleaning function: Metal, PE, PP, PVF2, PVC, PT, LDPE, teflon and other materials, connectors, wires, glass lenses, car blinds and neon, halogen sky lamp reflector processing, etc 4. Plasma cleaning machine Application Field: Metal - remove grease, grease and other organic matter and oxide layer on the metal surface; Automobile manufacturing - used for plastics and spray painting in automobile manufacturing process; Textile production - for hydrophilic, hydrophobic and surface modification of textiles, strainers and films; Biomedicine -- Culture dishes to improve the activity, blood vessel stents, syringes, catheters and various materials to moisten, intersex coating pretreatment; Aerospace - surface coating treatment of insulating materials, electronic components, etc. Electronics - cleaning and etching of circuit boards. Film, PP and other materials without oxidation and activation treatment, improve the weldability; Semiconductor industry - wafer processing and processing removal of photoresist, pre-treatment before packaging; Pretreatment before CLEANING and packaging of LED-support; Plastic rubber - improves the surface activity of PS, PE, PTFE, TPE, POM, AS and PP to facilitate bonding and printing.

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Plasma equipment to deal with surface modification, activation, grafting, coating and other issues

Plasma equipment to deal with surface modification, activation, grafting, coating and other issues

The surface modification of plasma cleaning machine is mainly aimed at modifying the surface of polymer materials and metals. The polymer has the molecular designability, through the plasma surface action can introduce different groups on the surface to improve its performance, such as hydrophilicity, hydrophobicity, wettability, cohesiveness; Introduce the bioactive molecule or enzyme to improve its biocompatibility. The surface modification of polymer materials by plasma cleaning technology not only improves the applicable properties of polymer materials under specific environment, but also broadens the applicable scope of conventional polymer materials. Surface activation is the object through the plasma cleaning machine after the surface can enhance, improve the adhesion, adhesion; Surface etching of plasma equipment means that the surface of material is selectively etched by reacting gas. The etched material is converted into gas phase and discharged by vacuum pump. After treatment, the microscopic specific surface area of the treated material increases and has good hydrophilicity. The plasma device nanocoating is to react gases such as HMDSO, hexamethyldisilane (HMDSN), tetanoethylene dimethyl ether, hexafluoroethane (C2F6). The introduction of plasma reaction Chambers, through the effect of plasma polymerization on the surface of the formation of nano coatings, this technology can be used in a variety of fields. A vacuum plasma cleaning machine, can complete the surface modification of the object, improve adhesion, activation, grafting, etching, coating. Really help you to solve the problem of the material surface, prevent adhesive bonding, printing adhesion is not enough, paint stripping, welding is not firm, sealed air leakage and other problems.

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Analysis of advantages and disadvantages of vacuum plasma cleaning machine

Analysis of advantages and disadvantages of vacuum plasma cleaning machine

Plasma is the material produced by gas molecules in vacuum, discharge and other special occasions. Plasma cleaning/etching to produce plasma vacuum plasma cleaning machine is set in an airtight container two electrodes form the electromagnetic field, using vacuum pump to achieve a certain degree of vacuum, with gas is more and more thin, the distance between molecules and the free movement of distance between molecules or ions is getting longer and longer, the magnetic field effect, collision and plasma formation, glow will happen at the same time. The plasma moves spatially in the electromagnetic field and bombards the surface of the treated object, thus achieving the effect of surface treatment, cleaning and etching. Cleaning technology advantages of vacuum plasma cleaning machine: The cleaning object of the vacuum plasma cleaning machine is dry after plasma cleaning, and it can be sent to the next process without further drying treatment. It can improve the processing efficiency of the whole process line. 2. The cleaning technology of the vacuum plasma cleaning machine enables users to keep away from the harm caused by harmful solvents to human body, and at the same time avoid the problem that the cleaning objects are easy to be damaged in wet cleaning; Three, vacuum plasma cleaning machine cleaning to avoid the use of trichloroethane and other harmful ODS solvent, so after cleaning will not produce harmful pollutants, so this cleaning method belongs to the environmental protection of the green cleaning method. This becomes more and more important in the context of global concern for environmental protection; The plasma generated by the high frequency of radio wave range is different from the direct light such as laser. The plasma is not very directional, which allows it to go deep into the tiny holes and pits of the object to complete the cleaning task, so there is no need to worry too much about the shape of the object to be cleaned. And the cleaning effect on these hard-to-clean areas was even better than that of freon cleaning; Five, the use of vacuum plasma cleaning machine cleaning technology, to avoid the cleaning solution of transportation, storage, discharge and other treatment measures, so it is easy to keep the production site clean and sanitary; Six, the advantages of vacuum plasma cleaning technology can both handle object, it can handle all kinds of material, metal, semiconductor and oxides, or polymer materials (such as polypropylene, PVC, ptfe, polyimide, polyester, epoxy resins and other polymer) plasma can be used to deal with. Therefore, it is especially suitable for materials that are not resistant to heat and solvent. And can also selectively clean the whole, part or complex structure of the material; Seven, in the vacuum plasma cleaning machine cleaning technology to complete cleaning decontamination at the same time, but also can improve the surface performance of the material itself. For example, improving the surface wettability and film adhesion is very important in many plasma applications.

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Classification of Plasma Plasma devices

Classification of Plasma Plasma devices

Classification of plasma equipment: 1. Jet AP plasma processor series 2. Automatic X/Y axis AP plasma processing system 3. Vacuum plasma equipment series 4. AP wide width plasma processor series 5.Atmospheric glow plasma cleaning machine series Vacuum plasma equipment/atmospheric plasma processor has several terms, also known as low temperature plasma processor, plasma processor, plasma processor, low temperature plasma surface processor, small, medium and large plasma surface treatment equipment widely used in laboratory and industrial production and other occasions. The working principle is to improve the wetting ability of the material surface through its plasma treatment technology, and the plasma cleaning machine enables the material to be coated, coated and coated, ashing and other operations to enhance the bonding force and bonding force, while removing organic pollutants, oil or grease. Plasma cleaning - plasma treatment - Plasma etch - Plasma rubber removal - plasma activation - plasma surface treatment plasma equipment, plasma processor applications include: > semiconductor integrated circuit and microelectronics industry; > LCD /LED packaging,PCB circuit board manufacturing; > plasma cleaning machine biomedical material surface modification; > precision instrument, machinery and electrical manufacturing; > plasma processor polymer film, textile fiber modification treatment; > APR atmospheric plasma cleaning machine, mobile phone touch screen, tablet PC glass cover plate cleaning and activation; > plasma surface processor used in automobile manufacturing, rubber and plastic industry; Plasma-surface activation/cleaning, plasma-coating plasma-bonding after plasma-treatment, enhanced Bunting, plasma-etching/activation, plasma-coating, plasma-gluing, plasma-ashing and surface modification.

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CRF plasma cleaning machine use skills

CRF plasma cleaning machine use skills

CRF plasma cleaning machine is an advanced high-tech equipment, is the use of plasma cleaning device, in use, must be in accordance with the requirements of the instructions to operate, which for some of the use of technical knowledge also need to understand, today I will give you a detailed introduction. 1. During the vacuum pumping operation, the three-way valve must be pointed to the closed state, that is, let the arrow down, and then turn on the power and turn on the vacuum pump to see whether the rotation direction of the vacuum pump is clockwise or counterclockwise. If it is clockwise, it is normal. 2. Before starting the vacuum pump, make sure that the plasma cleaning machine is connected with the vacuum pump. First, make the vacuum pump rotate for five minutes, at this time, the plasma cleaning agent is in the closed state, after five minutes, the plasma cabin will produce glow. 3. when pumping, to open the three-way valve, let it and indoor air, and then open the needle valve, pay attention to be opened gently, let the air slowly into the chamber of the plasma cleaning machine, in order to form plasma, and then turn on the power of the control panel in front of it. 4. During plasma processing, samples should be processed in accordance with the required time. After the processing is completed, RF should be turned off, and finally the plasma cleaning mechanism should be properly turned off. In the use of plasma cleaning machine, you can refer to the above content, only the correct operation, will not fail, in addition, after turn off the power supply, also check the plasma cleaning machine behind the insurance pipe in the fuse box on the side of the power supply is normal, for any signs of burned off, if damaged, be sure to replace the new matching insurance tube.

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What is the discharge principle and characteristics of inductively coupled plasma cleaning machine

What is the discharge principle and characteristics of inductively coupled plasma cleaning machine

Inductively coupled vacuum (low pressure) plasma cleaning machine is developed with the process requirements of the semiconductor industry, the main use is in wafer manufacturing photoresist removal and etching. Strictly speaking, plasma etching has been another category of process equipment, today we will discuss the induction coupling plasma cleaning machine discharge principle, model and characteristics. When a spiral coil is fed with a high-frequency current, two kinds of electric fields exist simultaneously in its space. The first is the axial electric field E1 established by the high-frequency potential difference between the two ends of the coil, which is the electric field of e-type discharge. The second is the vortex electric field E0 generated by the magnetic field changing in the discharge space, that is, the H-type electric field. The ratio of these two fields varies according to the way the coil is wound. We will see an interesting phenomenon, when the plasma density is low, discharge is capacitive mode; At high density, the discharge shifts to perceptual mode. An induced electric field is used to accelerate electrons to maintain the plasma. The plasma produced in this way is called the induction-coupled plasma ICP, whose neutral gas pressure is generally lower than one atmosphere, 102~104Pa, and sometimes even reaches atmospheric pressure. Inductive discharge plasmas are generated by applying rf power to a non-resonant coil. There are two common structures which are more suitable for low aspect ratio discharge systems. The first common structure of inductively coupled plasma sources is a cylindric helical coil type (helical type for short). The second common type of inductively coupled plasma source structure is the planar coil type (disc-type for short). Drive the output of the rf source inductance coil impedance of 50 Ω, its frequency is 13.56 MHz or lower. There is a capacitive matching network between the RF source and the inductor coil. The obtained plasma density is 1017~1018m-3, the electron temperature is 2~4eV, and the diameter is up to 30cm. ICP has been widely used in semiconductor plasma processing in recent years because it is easy to obtain large-diameter and high-density plasma over a wide pressure range (1~40Pa). By c=,13.56MHz electromagnetic wave wavelength is 22m, greater than the length of the antenna, so you can ignore the displacement current, the use of quasi-static method to deal with the core do field. The electrons in the plasma are accelerated by this electric field, thus creating eddy currents in the plasma in the direction that neutralizes the antenna's current magnetic field. Although electrons are sometimes accelerated and sometimes slowed by an induced electric field, if this effect is averaged over time, the net energy expenditure in the non-collision condition is zero, and power cannot enter the plasma. Nu e for electrons and neutral particles, ion collision frequency, can calculate the conductor "plasma" DC conductivity. In general, when an alternating magnetic field is applied to a conductive plate of conductivity, a vortex current flows through the conductor causing joule heating. In this case, the magnetic field decays exponentially from the surface to the inside of the conductor, so the depth into the conductor is limited (skin effect). In the low pressure (argument e/omega < < 1), high plasma density (omega p > > omega), skin depth is expressed as the delta = c/p omega. In the physical sense omega p is a measure of how fast electrons respond to collective motion. Less than omega p, the electrons' motion prevents the wave's electric field from entering the plasma, which is called plasma shielding. The wave will travel along the surface of the plasma, and the surface wave can also be used to generate a high-density plasma. Once entered into a state of depression, the resistance of the plasma will be small variations, skin depth will drop, so the joule heating effect cannot make plasma power input, therefore under pressure to maintain high density such as Yu daughter must be another mechanism, the mechanism of thermal motion of electrons is this: local electric field caused by an abnormal skin effect. Consider the collision free process: the electrons, moving at the thermal speed, return to the plasma no matter how far they go into the edgedepth delta region of the induced electric field. When the electron through this electric field area of time/nu is roughly equal to or slightly less than the high frequency voltage cycle 2 / nu, electron acceleration, deceleration is random, after the statistical average electron can obtain energy efficiently, this is the abnormal skin effect. Through the above principle analysis, we can understand some basic principles and characteristics of inductively coupled plasma, but in the design of plasma cleaning machin

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