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Research on Plasma Cleaning of Multilayer Ceramic Cases of Ceramic Plasma Treatment Watch Cases

Research on Plasma Cleaning of Multilayer Ceramic Cases of Ceramic Plasma Treatment Watch Cases

Research on Plasma Cleaning of Multilayer Ceramic Case of Watch Case by Ceramic Plasma Treatment:         The multilayer ceramic shell is made of multilayer metalized ceramics, base and metal parts brazed with Ag72Cu28 solder. Before the plating process, various contaminations will inevitably form on the surface of the shell, including fine dust, solid particles, organic matter, etc. At the same time, due to natural oxidation, there is also an oxide layer. The surface of the plated parts must be cleaned before plating, otherwise it will affect the bonding force of the plating layer and the substrate, causing the plating layer to peel and blisters. Ceramic plasma treatment case         In order to remove such contaminants, organic solvents such as toluene, acetone, alcohol, etc. are used for ultrasonic cleaning, but this method does not clean thoroughly on the one hand, which may easily cause coating defects. On the other hand, it increases manufacturing costs and causes environmental problems. Because of its good uniformity, repeatability, controllability, energy saving and environmental protection, plasma cleaning has been popularized and applied in the packaging field. Plasma cleaning using O2 as the cleaning gas can effectively remove organic matter and particle contamination on the surface of the multilayer ceramic shell.         Plasma cleaning of Ag72Cu28 solder with O2 as cleaning gas has remarkable operability. Before using Ag72Cu28 solder to braze the surface of the shell with Ni and Au, use O2 as a cleaning gas for plasma cleaning, which can remove organic pollutants and improve the quality of the coating.         This is extremely important for improving packaging quality and parts reliability, and at the same time, it also plays a very good demonstration effect on energy saving and reduction. After treatment under different conditions, the change of the solder on the multilayer ceramic shell, and the surface of the sample after plasma cleaning was plated with nickel and gold to test the bonding force between the plating and the solder. Get good process parameters for plasma cleaning. It provides an experimental basis and theoretical basis for the improvement and simplification of similar product processes, and the reduction of costs. At the same time, it also has a great positive effect on saving and reducing emissions.

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Plastic surface plasma treatment machine plastic pretreatment improves surface dyne value

Plastic surface plasma treatment machine plastic pretreatment improves surface dyne value

      Plastic surface plasma treatment machine is a modular cleaning system for processing panel plastics and other materials. More and more university users and manufacturers see that when processing large areas of materials, when the surface energy is insufficient, new materials need to be cleaned. Surface treatment improves dyne value. Plasma treatment machine for plastic surface         Plasma treatment machines for plastic surfaces provide a lot of possibilities for plastic pretreatment. External use: solvent-free ink and adhesive, fast and reliable printing. Inside: Set partitions before feeding, and sterilize food packaging and seal. With the continuous maturation of technology and successful application, plasma processing machine has become the dry processing method of choice of many packaging manufacturers.         Practice has proved that it is particularly important to ensure the safe processing of products and equipment. Highly engineered polymers such as PS (polystyrene), PEEK (polyether ketone) or PC (polycarbonate) are usually processed during the manufacturing process. Plasma treatment of large panels, low pressure technology provides an effective solution for the pretreatment of various materials, especially plastics. Plastic surface plasma treatment machine can be used to clean and activate the surface of plastic. This plasma cleaner is used to process plastic and can be assembled to any width required.         Features and advantages of plastic plasma treatment machine:         1. Extensive surface treatment of raw materials to enhance adhesion.         2. No need for primer to reduce costs and better process control.         3. Good surface paint or high-quality finished products with ink flow.         4. The drying process has no emissions and the processing speed is fast.         The lightweight PP material with modern honeycomb structure is suitable for a variety of automobile structures. The plastic surface plasma treatment machine has a unified treatment on the polypropylene fiber-reinforced bonding. At the same time, its great advantage is that it has higher stability than the traditional one.

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Technical advantages of atmospheric plasma surface treatment machine and plasma surface application

Technical advantages of atmospheric plasma surface treatment machine and plasma surface application

        The advantages and uses of the atmospheric plasma surface treatment machine: change the microstructure of the material, the hydrophobicity becomes hydrophilic, enhance the surface wettability, form an activated surface, enhance the surface adhesion ability, and improve the reliability and durability of the surface. Since atmospheric plasma is potentialless, plasma treatment can be combined in conductive, semiconductor, and non-conductive applications. Atmospheric plasma surface treatment machine technology         1. Change the microstructure of the material to make the hydrophobic become hydrophilic;         2. Enhance the surface wetting function to make it an activated surface;         3. Improve surface bonding ability, improve surface reliability and durability;         4. A contact angle tester can be used to quantitatively determine the effect of the treatment.         Plasma cleaning machine, also known as plasma surface treatment instrument, is a brand new high-tech, which uses plasma to achieve effects that cannot be achieved by conventional cleaning methods. Plasma is a state of matter, also known as the fourth state of matter, and does not belong to the so-called three states of solid gas. Add enough energy to the gas to make it ionize and become a plasma state. The "active" components in plasma include: ions, electrons, atoms, activated groups, excited states (metastable states) and photons. Use the properties of these active components to treat the surface of the sample to achieve the purpose of cleaning and coating, improve the surface adhesion of the product, and facilitate the adhesion, spraying, printing and sealing of the product.         Atmospheric plasma surface treatment machine plasma cleaning can effectively clean the surface, remove impurities, pollutants, residues and organic matter. Sometimes, this process is called micro-cleaning or etching, it provides another important role in improving adhesion, and plasma treatment has fast surface activation speed, high efficiency, economical and environmental protection.

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Hydrogen plasma surface treatment process plasma cleaning BAG to improve the solderability of BGA

Hydrogen plasma surface treatment process plasma cleaning BAG to improve the solderability of BGA

        The solder balls of BGA devices are often very easy to oxidize, and the soldered BGA solder joints are not only inferior in appearance, but their electrical and thermal properties are also greatly reduced. The plasma surface treatment process can effectively remove the oxide on the surface of the BGA solder ball. The method has simple process, significant effect and high efficiency, and is an effective method for removing oxides of BGA components and other surface-mounted components. Plasma surface treatment process         To achieve good reliability in the soldering of BGA devices, the solderability of the BGA solder balls is very important. However, due to various reasons, such as long storage period, exposure to the atmosphere, high baking temperature, and some corrosive industrial waste gas in the atmosphere, it is easy to cause oxidation and corrosion of BGA solder balls.         The oxidative corrosion of the solder ball makes the solder ball look dull, gray, dark and black, making it impossible for the vision system of the automated placement machine to recognize it, making it impossible to carry out large-scale automated production. More importantly, the poor solderability of the solder balls will bring about a series of problems, such as welding voids, false soldering, and desoldering. These soldering defects will cause the reliability and long-term working life of the BGA. Serious impact.         Methods to improve the solderability of BGA solder balls Once the BGA solder balls are oxidized and corroded, appropriate treatment measures must be taken to restore their solderability. Common methods are:         (1) Coat active flux on the solder balls, and then re-melt them. In this way, the BGA has to undergo a high temperature melting, which may cause thermal damage to the BGA. In addition, an additional cleaning process must be added, because active flux is used, and all flux residues must be completely removed, which increases the complexity of the process.         (2) Remove the solder balls of the BGA and replant the balls. The ball planting process is complicated, difficult, time-consuming, and needs to heat the BGA twice. Two times of heating may cause adverse effects on the internal circuit of the BGA. And the work efficiency is low, not suitable for mass production. In addition, the success rate of planting the ball is not very high.         (3) Use high-temperature hydrogen for reduction. Hydrogen has a strong reducing ability and can effectively remove the oxide corrosion layer on the surface of the solder ball. But high temperature is likely to damage BGA devices.         (4) Use reducing acid gas for reduction, but it also requires a high temperature of about 220 degrees Celsius, and formic acid is corrosive to a certain extent.         (5) The method of pickling is adopted. Using a relatively dilute acid, such as dilute hydrochloric acid and citric acid with a volume fraction of about 10%, can remove the oxide on the BGA solder ball, but the acid solution is likely to corrode the BGA device.         (6) Of course, it can be discarded. But many BGA devices are very expensive, and discarding them will cause huge losses.         None of the above methods are very good. Now we introduce a novel method to treat BGA devices with hydrogen plasma in the plasma surface treatment process, which can greatly improve the reliability of BGA devices, and the process is simple, effective and efficient. high.         Advantages of using hydrogen plasma to remove BGA oxide:         The hydrogen plasma is used to reduce the oxide on the BGA solder ball, the process is simple, no high temperature is required, the device is less damaged, no cleaning and drying are required, and the removal effect is good, and the production efficiency is also high.         The application of BGA solder ball oxide layer can draw the following conclusions:         (1) The activity of hydrogen plasma is much stronger than that of molecular hydrogen, and it has good reducing activity at low temperatures;         (2) Proper heating of the hydrogen plasma can greatly improve the reducing activity of the hydrogen plasma;         (3) Hydrogen plasma treatment can improve the appearance of BGA solder joints, making the solder joints appear full, round and bright;         (4) Hydrogen plasma treatment of oxides on BGA solder balls has simple process, good effect and high efficiency;         (5) The method of hydrogen plasma to remove the oxide layer can be extended to the removal of oxides of all surface mount components.

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The importance of PCB plasma equipment surface plasma treatment technology in PCB applications

The importance of PCB plasma equipment surface plasma treatment technology in PCB applications

        A variety of dedicated surface PCB circuit boards can be used in plasma products. Plasma equipment applications include improving adhesion and surface activation. In the pre-processing of the PCB board, the PCB plasma equipment can change the dyne value and contact angle to achieve the desired effect. Surface treatment technology of PCB plasma equipment         The vacuum plasma equipment uses a vacuum chamber, so that there is no conductive channel between the tape and the PCB circuit board skeleton area, and there is a free conductive channel in the PCB circuit board skeleton area. The ring material is made of insulating non-conductive material, and the conductive path between aluminum plasma and aluminum is limited to the PCB circuit board area. There is a gap of 2mm between the toroidal tape and the frame piece. Since there is no plasma generation or at the bottom of the wafer and tape, undercuts and delamination are minimized, and there will be no sputtering or tape deposition on the wafer surface. According to our method, the gap between the ring edge and the lower electrode is reduced to obtain an extended area of ​​2mm or less, so that you can get a secondary plasma like other systems instead of a primary plasma.         The retention coating improves the adhesion of the retention coating, and it is usually difficult to provide adequate protection to certain materials that meet strict environmental requirements (such as TPU). Plasma treatment technology improves the wettability of the surface and improves the adhesion of the conformal coating to high-performance solder mask materials and other difficult-to-attach substrates. In addition, the use of plasma equipment to process the PCB improves the flow properties of the conformal coating material. Other challenges for conformal layer adhesion include contaminants such as mold release compounds and flux residues. Plasma treatment is an effective way to clean circuit boards. Plasma treatment can remove contaminants without damaging the substrate. It can provide a single-stage plasma treatment plasma processing system-including etch back and cleaning-up to 30 panels per cycle (panel size is 500x813mm/20x32 inches), which can be used in the manufacturing process of flexible electronic PCBs and substrates Achieve a speed of 200 units/hour.         Plasma equipment is used for PCB circuit board processing and is ideal for wafer-level and 3D packaging. Applications of plasma include dust removal, ashing/photoresist/polymer stripping, dielectric etching, wafer bumping, organic contaminant removal, and wafer demolding.         Plasma systems are ideal for typical back-end packaging steps before wafer processing, as well as wafer fan-out, wafer-level packaging, 3D packaging, flip-chip and traditional packaging. The cavity design and control structure can achieve a short plasma cycle time and low overhead, which can ensure the throughput of your production process and reduce costs. The plasma cleaner supports automatic processing and handling of round or square wafer/substrate sizes from 75mm to 300mm in diameter. In addition, depending on the thickness of the wafer, it can be processed with or without a carrier sheet. The plasma chamber design provides excellent etching uniformity and process repeatability. The main plasma surface treatment technology applications include various etching, ashing and dust removal steps. Other plasma processes include decontamination, surface roughening, improved wettability, and enhanced bonding and adhesion strength, photoresist/polymer peeling, dielectric corrosion, wafer bumping, organic contaminant removal, and wafer demolding. Wafer cleaning-before the wafer collides, the plasma equipment will remove pollutants, organic pollutants, fluorides and other halogen pollutants, as well as metals and metal oxides. Plasma also improves the adhesion of the film and cleans the metal bonding pads.         The plasma system of the circuit board plasma equipment removes silicon wafers, is used to redistribute, strip/etch the pattern dielectric layer of the photoresist, enhance the adhesion of the wafer application material, remove the mold/epoxy resin applied to the excess wafer, and enhance the gold The adhesion of the solder bumps reduces the damage to the chip, improves the adhesion of the spin-coated film, and cleans the aluminum bonding pad.

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Vacuum plasma processing machine vacuum plasma processing to solve bonding problems

Vacuum plasma processing machine vacuum plasma processing to solve bonding problems

        The vacuum plasma processor can help you solve the adhesion problem, improve the surface energy of the material, and ensure good adhesion. Then, how the vacuum plasma processor solves this problem will be discussed below. Vacuum plasma processor         Vacuum plasma treatment provides innovative surface modification technology and solves adhesion and wetting problems for many industries. The use of plasma processing is an important step in the printing, bonding, painting, painting and finishing processes. Vacuum plasma surface modification provides an economical solution for surface cleaning and activation of parts before further processing.         How does vacuum plasma treatment contribute to the solution of bonding?         To obtain good surface adhesion with low-polar materials such as PP, PE, HDPE, etc., the surface must be improved, that is, to increase its polarity. Placing components in the plasma chamber is a very effective way to increase the polarity of the material. During high-activity plasma discharge, free radicals and other particles are generated. These particles will adhere to the surface of the material, thereby generating additional polar groups on the surface of the material. These have a strong chemical attraction for inks, paints, coatings, adhesives, etc. Strength can enhance surface energy and thus adhesion.         Introduction to the internal structure of the vacuum plasma processor:         Separate rack-for large parts; multi-layer rack-for flat parts; laboratory-for testing equipment.         Tray structure: special tray; movable tray; large tray.         The company also develops and owns multiple laboratory-type vacuum plasma processors, which are light and compact, and can be placed on the workbench. They are an economical and effective solution to the problem of surface wetting. This device is very simple to install and can be processed in just a few minutes. The equipment only needs 220V power supply, and is equipped with an independent vacuum pump, and does not need to be connected to any separate vacuum power supply.         Vacuum plasma cleaning is a "dry cleaning" process that can replace chemicals that are harmful to the environment. Plasma is an ideal choice for cleaning and removing organic residues on ceramic surfaces.

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