图片名称

NEWS

Popular Articles

Contact Us

图片名称
图片名称

Service Hotline

13632675935

CRF

TEL：13632675935

E-mail：shaobo@sfi-crf.com

Address: 1303, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.

Application of plasma Cleaning Machine process in PBGA

Application of plasma Cleaning Machine process in PBGA

The key preconditions for the bonding process of microelectronic packaging technology are small surface roughness and small contact Angle. In particular, the complex package structure, such as plastic sealed welded ball array (PBGA) package and laminated package structure. PBGA packaging and extension technology is widely used due to its high installation and fixed efficiency and good thermoelectric properties. In the application of PBGA, one of the main problems of plasma cleaning machine is the interface stripping, such as the interface between the chip/plastic sealant and the substrate/plastic sealant. The PBGA package structure is more complex than traditional peripheral lead frame packages, such as the plastic quadrangle flat package (PQFP). In order to avoid peeling, the multilayer interface should have high adhesion strength. Usually the stripping occurs first at the edge of the chip, and within a short period of time, under stress, it expands inward. When the adhesion between the two surfaces disappears, the wafer welding point is directly controlled by the thermal mismatch stress between the chip and the organic substrate. The electrical failure is caused by solder fatigue and cracks after peeling. Plasma cleaning machine is used for cleaning, argon, oxygen plasma gas, more widely used is containing argon oxygen CF4 gas, cleaning effect is better. Plasma cleaning of the substrate improves the peel resistance prior to the adhesion and molding processes in the PBGA. After plasma cleaning, pressure welding reliability is greatly improved.

MORE +
Mold plasma cleaning machine

Mold plasma cleaning machine

Plasma cleaning machine is a new type of cleaning machine, it can use plasma arc to clean mold surface dirt, to achieve the purpose of cleaning mold. In the process of use, the mould is polluted due to the comprehensive action of rubber, coordination agent and vulcanization release agent, so the scale forming mould needs to be cleaned regularly. Chemical cleaning method is easy to corrode mold surface and cause environmental pollution, mechanical cleaning method is contact cleaning, easy to damage the mold surface and generate residual stress. Although the new cleaning technologies, dry ice cleaning and laser cleaning, overcome the shortcomings of traditional cleaning methods, they also have their own defects. The disadvantages of traditional cleaning methods compared with other cleaning methods are overcome by plasma cleaning machine. With the increase of plasma output power, the surface temperature of the mold sample increases, decreases with the acceleration of plasma motion speed, and decreases slightly with the increase of matrix thickness. When cleaning strength is greater than the bond or cleaning force per unit area is larger than the stick relay on the per unit area, the adsorption on the surface of the substrate, contaminant particles can overcome the constraints of cohesive force and loss, in order to prevent the substrate surface, the plasma arc burns in cleaning ability than pollutants and the cohesive force between the substrate surface, interface temperature should be below the liquidus temperature of substrate. At present, due to the appearance of plasma cleaning machine technology, it has been widely used in many fields such as optics, electronics, materials, life science, polymer science, biomedicine and so on.

MORE +
Semiconductor principle of vacuum plasma cleaning machine

Semiconductor principle of vacuum plasma cleaning machine

With the development of modern electronics technology, Flip - ChipBond semiconductor packaging technology has been widely applied, but as a result of the front-end technology requirements, the machining process will inevitably some residual organic matter or other contaminants on the base material, in the baking process, originally under the pad of gold plating Ni element will be moved to the surface layer, without removal of pollutants, leads to bump on the semiconductor chip in Flip - ChipBond technology with the whole process of pad bonding effect is poor, adverse consequences. Traditional cleaning processing technology such as CFC cleaning, ODS cleaning, due to environmental pollution, high cost, limited the further development of modern electronic equipment technology, especially precision mechanical equipment manufacturing semiconductor chips, so the plasma cleaning machine dry cleaning, especially plasma cleaning technology is the current development trend. There are two cleaning methods of vacuum plasma cleaning machine. One is the reaction of plasma on the material surface, common gases, such as argon (AR), nitrogen (N2), etc. The other is that the oxygen radical has undergone chemical changes. The common gases are hydrogen, oxygen, and so on. Vacuum plasma cleaning machine plasma through impact to destroy the ionic bond of organic matter, so as to remove surface pollutants. When the working pressure is low, the higher the ion energy, the greater the kinetic energy and the greater the impact force. If the physical reaction is used for cleaning, it reflects the lower working pressure and the stronger the actual cleaning effect. Selecting argon gas as the advantages of vacuum plasma gas cleaning, cleaning principle of argon plasma technique is to use particle mechanical cleaning, argon gas is inert gas, in the process of cleaning will not cause chemical reaction products and gas, avoid secondary pollution, as the front-end processing residual residue can be reasonably clear, in the process of making a semiconductor can be fused in the bonding process. Compared with the traditional wet cleaning process, the plasma technology of vacuum plasma cleaning machine is environmentally friendly and cheap.

MORE +
Low-temperature plasma etching for plasma cleaning machine

Low-temperature plasma etching for plasma cleaning machine

In the past few decades, semiconductor technology, represented by very large scale integrated circuits (ULSI), has been following Moore's Law with rapid development at technological nodes approximately every two years. Jack Kilby's 1958 INTEGRATED circuit had just five components, while Intel's mass-produced 10nm logic chip contained 100.8 million transistors on a 1mm2 chip. The development of semiconductor technology and the reduction of cost are inseparable from the increase of product circle size. The size of wafers has grown from 50mm to 300mm over the past 50 years, and may grow further to 450mm. The process of forming a chip from a single cut silicon wafer is complex. Lithography, Plasma Etch, thin film deposition (PVD, CV), chemical machinery research (CMP), ion implantation (1MP), etc. Plasma etching in plasma cleaning machine is one of the important processes in semiconductor production. Its importance and challenge have become increasingly prominent with the development of semiconductor technology. A prominent feature of low-temperature plasma etching is that the span of space scale and time scale is quite large, which requires micro machining operation in angstrom (A) on A piece of product circle with A diameter of 300mm. The timescale also ranges from nanoseconds in electronic response time to the macroscopic minutes needed for the entire wafer to be etched. This span of time and space can well reflect the challenges faced by vLSI manufacturing and plasma etching technology of plasma cleaning machine. The low temperature plasma technology of plasma cleaning machine has also been widely used in photoresist modification, material surface treatment, photoresist friendly, ion implantation and plasma enhanced chemical meteorological deposition technology.

MORE +
Plasma cleaning machine Assembly line plasma processor

Plasma cleaning machine Assembly line plasma processor

Plasma cleaning machine line plasma processor, the selection of plasma surface treatment equipment, which is what we call plasma machine, plasma cleaning machine. Principle said: plasma cleaning machine in the cleaning of the object is the role of gas, under the stimulation of the magnetic field and the surface of the object physical or chemical reaction, so as to achieve the purpose of cleaning. Cleaning surface is closely related to plasma and surface treatment equipment. In short, cleaning surface layer is in the surface layer of the material being processed to produce a new film, the hole on this film is invisible to the naked eye, this can greatly increase the area of the material, the indirect property can improve the adhesion performance, diffusion, and so on. Plasma processor is used to modify surface film, UV coating or plastic film, so as to improve its adhesion property, making it as easy as paper adhesion. The basic water-soluble gellan solution can make the coated board or light coated board obtain reliable adhesive force in the carton sticking machine, no need to use local covering, glazing and other processes, and no need to change different glue for different cardboard. By means of plasma surface treatment, not only its adhesion can be improved, but also high quality adhesion can be achieved. At the same time, it also improves the characteristics of surface diffusion and avoids the generation of bubbles, so that carton manufacturers can obtain more stable product quality with lower cost and higher efficiency. Plasma surface treatment is an effective method to clean and activate the surface of coatings, which can solve various problems in materials, including semiconductor wafers, plastics and metal materials. This technology can remove substances such as film remover and surface layer pollutants, and the activation process can ensure the quality of subsequent bonding process. This technology can be used to quickly and effectively pretreatment the material according to the actual process requirements. The plasma cleaning machine assembly line plasma processor is composed of generator, spray gun, main machine, etc., can work continuously for 24 hours, and can be used with multiple spray guns according to the actual production needs.

MORE +
The difference between corona treatment and plasma cleaning machine treatment

The difference between corona treatment and plasma cleaning machine treatment

Corona treatment is a click treatment method, it can make the substrate surface has a high bond strength. Because most of the plastic film nonpolar polymer, low interfacial tension, not a fixed printing ink and adhesive, so should choose corona discharge method to deal with this kind of surface layer of plastic film, discharge of reactive oxygen species is a kind of strong oxidation, it can change the molecular structure of the plastic film, make its formation in air oxidation carbonyl, peroxide and other groups, to improve the surface performance.   Plasma cleaning machine surface treatment is based on high energy particles and organic material surface layer produced by physical or chemical change, can be used to solve the raw material surface activity, etching process, the problem such as decontamination, unlike corona treatment, corona discharge treatment can only solve very frivolous products, such as plastic film products, such as the material specifications can't be too big in the process of production.   The common points of surface treatment and corona treatment of plasma cleaning machine are: 1. High frequency and high voltage discharge is adopted for plasma equipment and electric airsickness treatment. Plasma is selected to modify the surface of materials. 2. Both methods can improve the surface adhesion of raw materials and are conducive to the adhesion, painting and printing of materials. 3. All are online production processing, production and manufacturing.   Differences between plasma treatment and corona surface treatment: 1. Plasma cleaning machine surface treatment in addition to glow discharge, also contains electric volt charge and discharge, can generate a lot of kinetic energy, to reach the adhesive force of 50 or more, and electric motion sickness generally can only reach the adhesive force of about 30 degrees. 2. Corona discharge has a wide range of action, suitable for products with low bonding strength requirements, such as cloth, plastic film, plastic and so on. The plasma surface treatment area is relatively narrow, sometimes several nozzles need to cooperate to complete the total width treatment, the production cost is higher, but the effect is better than corona.

MORE +
< 1...141516...46 > proceed page
图片名称

CRF

National Service Hotline

136 3267 5935

Contact Email

shaobo@sfi-crf.com

Address:1303, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.

图片名称

Add WeChat
Get related information

Links

Apply to exchange friend links

Copyright © Shenzhen Chengfeng Smart Co.

京ICP备10002622号-38

粤公网安备 44030602005200号

图片名称

Cheng Feng Zhi Zuang a focus on plasma research and development for 20 years

We

The services of

Inquire for free sample testing

1-to-1 program customization

24-hour online after-sales service

Source manufacturer

Get the program
%{tishi_zhanwei}%
图片名称

Scan the code for information

诚峰智造