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The difference of cleaning method of plasma cleaning machine

The difference of cleaning method of plasma cleaning machine

Low temperature plasma equipment is also a dry cleaning method, and compared with the wet cleaning method, it has a simple process, controllable, and the product can achieve a clean, no residue purpose. And the wet cleaning method, its disadvantage is likely to be a one-off wash not clean, will there be any residue, using plasma equipment for dry cleaning its reaction is in need of gas, the gas and we use most is non-toxic, and wet cleaning method many is to use a large amount of solvent, which also contains a lot of chemical composition, are harmful to human body, also can have influence on the environment. In the process of plasma processing using plasma cleaning machine, it includes two cleaning processes, one is chemical reaction, the other is physical reaction. Among them, the plasma cleaning machine based on chemical reaction has a very fast cleaning speed, good performance, high selectivity, in the removal of organic matters, oxides, and do surface activation have a very good effect.

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The key cause of plasma surface area increas

The key cause of plasma surface area increas

(1) Sputtering erosion effect of charged particles on the cleaned material; (2) Chemical erosion effect of chemical active groups. However, what we call surface modification can be interpreted as: the surface roughness of the treated material increases the contact area, while the hydrophilic groups on the surface increase the hydrophilicity. Today, this feature is perfectly used in printing, digital, glass, biology, pharmaceuticals, mobile phones, electronics, cables, optical fibers, machinery, and more. It not only solves the problems in the production process of many industrial products, but also enhances the durability and quality of products.

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Why plasma has an invisible function

Why plasma has an invisible function

This is mainly because of the refraction and absorption of radio waves by plasma. This can quote it related materials are given: plasma is a special kind of filter, when radar frequencies below the plasma frequency radar is total reflection, the plasma energy in the form of electromagnetic wave reflection body electronic jamming to radar, namely, by bending radar wave transmitted back and forth is attacking weapon virtual image that appeared on the radar screen, rather than the real weapons. When the radar frequency is higher than the plasma frequency, the radar wave can enter the plasma and be absorbed, so that the signal of attack weapon received by the radar will be greatly weakened. These functions make plasma become a new electronic interference and stealth material, among which stealth technology is a promising technology. Absorption effect on plasma for radio waves can be experienced from the satellite/ship recycling process of "black area" have a intuitive understanding: when the satellite/spacecraft returned to the atmosphere with fast speed, the surface temperature will because of severe air friction shot up to several thousand, tens of thousands of degrees Celsius, the satellite and the surface of the spacecraft will because of the temperature and air into a plasma and the satellite/ship tightly wrapped. Since plasma has a strong absorption effect on radio, ground tracking radar will lose target because of no echo signal, and wireless communication cannot be carried out due to the wrapping of plasma air mass. At this point, all contact between the satellite/spacecraft and the ground will be broken, forming the so-called "black barrier area". Only when the speed of the satellite/spacecraft drops and the surface air temperature drops can the radar be tracked again after the plasma disappears and the communication can be restored to normal.

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The function of plasma cleaning machine to clean micro holes

The function of plasma cleaning machine to clean micro holes

With the miniaturization of the aperture of THE HDI plate, the traditional chemical cleaning process can no longer meet the requirements of the cleaning of the blind hole structure, and the liquid surface tension makes it difficult for the liquid to penetrate into the hole, especially when treating the laser drilling microblind hole plate, the reliability is not good. At present, the hole cleaning technology applied to the microburied blind hole mainly includes supergenerated wave cleaning and plasma cleaning, while ultrasonic cleaning mainly achieves the purpose of cleaning based on cavitation effect. It belongs to wet treatment, and the cleaning time is long, and it depends on the deconvolution performance of the cleaning liquid, which increases the disposal problem of the waste liquid. At present, the commonly used process is mainly plasma cleaning process. The plasma treatment process is simple, environmentally friendly, and the cleaning effect is obvious, which is very effective for blind hole structure. Plasma cleaning means that highly activated plasma moves in direction under the action of electric field, and has gas-solid chemical reaction with drilling pollution of hole wall, and at the same time, the generated gas products and some non-reactive particles are discharged by air pump. In the first stage, high purity N2 is used to generate the plasma, and the printed board is preheated at the same time, so that the polymer material is in a certain activated state. In the second stage, O2 and CF4 are used as the original gases. After mixing, O and F plasma is generated, which reacts with acrylic acid, PI, FR4 and glass fiber, etc., to achieve the purpose of decontamination. In the third stage, O2 is used as the original gas, and the generated plasma and reaction residue make the hole wall clean. In the process of plasma cleaning, in addition to plasma chemical reaction, the plasma also has physical reaction with the material surface. Plasma particles knock off the atoms on the surface of the material or the atoms attached to the surface of the material, which is conducive to cleaning the etching reaction. With the development of materials and technology, the structure of buried blind hole will become smaller and more refined. In to fill the holes, blind holes on plating using the traditional chemical degumming slag method will be more and more difficult, and plasma processing cleaning method can effectively get rid of disadvantages of wet method in addition to the glue residue, can achieve the blind hole and small hole is better cleaning effect, which can guarantee the blind hole plating when fill hole to achieve good effect.

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The use of plasma cleaning machine should pay attention to what matters

The use of plasma cleaning machine should pay attention to what matters

Plasma treatment equipment is widely used in plasma cleaning, etching, plasma plating, plasma coating, plasma ashing and surface modification. Through its treatment, can improve the material surface wetting ability, so that a variety of materials can coating, plating and other operations, enhance the adhesion, bonding strength, while removing organic pollutants, oil or grease. So plasma cleaning machine in the operation should pay attention to what matters? 1. Set the operating parameters of the plasma equipment correctly and execute the operation instructions on time; 2. Protect the plasma ignition device to ensure that the plasma cleaning machine can start normally; 3. In the preparation of plasma equipment before starting, relevant personnel should be trained, and ensure that the personnel operating the plasma cleaning machine can strictly carry out all the operations as required; 4. When there is no ventilation in the primary air duct, the operating time of the plasma generator should not exceed the time required in the equipment manual, so as to avoid burning the burner and causing unnecessary losses; 5. If it is necessary to maintain the plasma equipment, please power off the plasma generator before the corresponding operation.

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Plasma cleaning machine structure

Plasma cleaning machine structure

The structure of vacuum plasma cleaning machine is mainly composed of three parts: control unit, vacuum chamber and vacuum pump. Make a statement about the following three parts: 1. Control unit: At present, the domestic use of plasma cleaning machine, including foreign imports, the control unit is mainly divided into semi-automatic control, automatic control, PC control, LCD touch screen control four ways. And the control unit is divided into two large parts: Power supply: There are three main power supply frequencies, namely, 40KHz, 13.56mhz and 2.45ghz. 13.56mhz requires a power matcher, while 2.45ghz is also known as microwave plasma. Its main function has been mentioned before, but it will not be introduced here. System control unit: divided into three kinds, button control (semi-automatic, automatic), computer control, PLC control (LCD touch screen control). 2. Vacuum chamber: The vacuum chamber is mainly divided into two materials: stainless steel vacuum chamber and quartz chamber. 3. Vacuum pump: Vacuum pump is divided into two types: dry pump, oil pump.

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