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Plasma cleaning machine specific applications of specific properties

Plasma cleaning machine specific applications of specific properties

Plasma cleaning machine/etching machine produce plasma device is set in an airtight container, two electrode form electric field with a vacuum pump to achieve a certain degree of vacuum, with gas more and more thin, the distance between molecules and the free movement of distance between molecules or ions is also becoming more and more long, the electric field, they collide and form plasma, the activity of these ions is very high, the energy enough to destroy almost all of the chemical bonds in any exposed surface caused by chemical reaction, the plasma of different gases with different chemical properties, such as oxygen plasma has the very high oxidation resistance, can resist oxidation reactions generated gas, So as to achieve the cleaning effect; Corrosive gas plasma has good anisotropy, which can meet the needs of etching. Glow is emitted by plasma treatment, so it is called glow discharge treatment. The mechanism of plasma cleaning machine mainly relies on the "activation action" of the active particles in plasma to remove the object surface stains. From the point of view of the reaction mechanism, the plasma cleaning machine usually includes the following processes: inorganic gas is excited to plasma state; The gaseous substance is adsorbed on the solid surface; The adsorbed group reacts with the solid surface molecule to form the product molecule. The molecules of the products were analyzed to form the gas phase. The residue of the reaction escapes from the surface. Plasma cleaning technology is characterized by both process base material type of object, can be processing, metal, semiconductor, oxides and most of the polymer materials, such as polypropylene, polyester, polyimide, poly (ethyl chloride, epoxy, and even can well with teflon etc, and can realize the overall and partial cleaning and complex structure.

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Application of plasma surface processor in pasting box machine

Application of plasma surface processor in pasting box machine

How to reduce pasting cost? How to solve the box pasting process in the phenomenon of glue? The answer is to use plasma surface processor to treat the paste box. Plasma surface treatment machine for pasting box after processing, the removal of organic pollutants on the surface of the joint and surface cleaning, laminating material surface changes a variety of physical, chemical, or produce etching and rough, or form a dense crosslinking layer, or the introduction of oxygen polar group, so that the hydrophilicity, cohesiveness, dyeing, biocompatibility, and electric property is improved. Under appropriate technological conditions after processing material surface, make the material surface morphology changed dramatically, introduced a variety of oxygen-containing groups, the surface from the nonpolar, difficult viscosity to have certain polarity, viscosity and hydrophilic, to improve the surface energy, the joint surface and no surface damage, not cause film coating or coating the surface of the spalling. The application of plasma surface processor in pasting box process has direct benefits as follows: 1. The product quality is more stable and will not be opened; 2. Reduce the cost of pasting box. If possible, ordinary glue can be used directly, saving more than 40% of the cost. 3. Directly eliminate the impact of paper powder and wool on the environment and equipment; Improve work efficiency. Originally in order to package the printed matter in the circulation process is not rubbed against the flower, in order to improve the waterproof function, or to improve the product class, etc., in the printing packaging process, will do a layer of protection on the surface of the printed matter, some on a layer of varnish, some covered with a layer of film, etc. Glazing process UV glazing relatively more complex, there may be more problems. At present, because of the poor affinity between UV oil and paper, resulting in paste box or paste box often appear when the phenomenon of glue. And after laminating, due to the surface tension of the film and surface can have different values under different conditions, the size is suddenly different, plus different brands of glue show different adhesion, also often appear glue phenomenon, and once the product is handed over to the customer when glue, there will be the possibility of being fined. All of these make each manufacturer more worry, some customers in order to reduce the above situation as far as possible, not hesitate to increase the cost of purchasing imported or domestic high-grade paste box glue, but if the improper storage of chemicals, or other reasons, sometimes there will still be open phenomenon. In the traditional process, in order to effectively deal with the phenomenon of glue opening, each box pasting machine factory is equipped with edge grinding machine in their own each box pasting machine, the mouth part of the UV light paste tongue grinding, temporarily deal with the problem of glue opening. And the film coated products can not be polished with a grinding wheel, then use the method of cutting teeth line, or in the film cover to get out of hand position, and then with high quality glue, but this is not an effective solution. Although polishing the life while pasting the box is an effective solution to the bonding problem, the following problems still exist: 1. Part of the paper wool paper powder that is ground during grinding will pollute the surrounding environment of the machine and increase the wear of the machine and equipment; 2. Since the linear velocity direction of grinding wheel movement is opposite to the direction of product operation, it is bound to affect the operation speed of some products and reduce work efficiency; 3. Although the coating to wear, but only UV coating and a small amount of paper surface coating, for high-grade medicine boxes and cosmetics boxes and other products, the general manufacturers do not dare to use ordinary glue to stick the box, so, paste box cost will not be too low.The situation is better than UV products, but the plastic film to make life on the small box products can not be used, the tooth line will also appear process problems, increase the cost of knife version.

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Research and development room details the Plasma cleaner CRF-plasma cleaner

Research and development room details the Plasma cleaner CRF-plasma cleaner

What is a vacuum plasma? Vacuum plasma is formed by ionization in a gas vacuum chamber. Oxygen and argon plasmas are mostly used to clean, etch or activate material surfaces. Plasma treatment has been around since the early 1970s and is often used to clean organic impurities and contaminants on material surfaces. Plasmas perform well in etched circuit boards and other electronic products. What is plasma processing? Plasma treatment is the use of a controlled vacuum plasma to change the surface of a material to improve adhesion, printing, painting, coating or wettability. The process is carried out in a plasma chamber under vacuum pressure. Plasma treatment is often used in the manufacture of electronic equipment, medical equipment, textiles, plastics, rubber, etc. Almost all dry materials can be treated in a plasma chamber. Plasma treatment can change the surface performance of materials to improve the surface energy, bonding performance, printing or wettability. Plasma treatment can also achieve waterproof properties by covering the product. Almost all materials can be treated with plasma technology. We have developed a full line of products for manufacturing, research and development, and academic applications. All surfaces contain organic contaminants, although they are not normally observed. These contaminants affect the interaction between the object and other materials such as glue and ink. By plasma treatment of the surface of the object plasma can remove organic pollutants on the surface of the material. Removal of organic contaminants increases bonding strength in bonding or welding and increases printing reliability. These processes perform well in the production of shiny plastic and rubber products, printing and bonding.   Vacuum plasma cleaning machine more precise overall change the surface of the chemical characteristics, enhance the surface adhesion, adhesion, tension... Features: large processing space, improve processing capacity, using PLC+ touch screen control system, accurate control equipment operation. According to the requirements to customize the equipment cavity capacity and the number of layers, to meet the vast needs. Low maintenance cost, easy to control cost. High precision, fast response, good control and compatibility, perfect function and professional technical support. Application: mainly applicable to biomedical industry, printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc.

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Basic technical principles of plasma cleaning in semiconductor packaging

Basic technical principles of plasma cleaning in semiconductor packaging

In the production process of semiconductor devices, due to the influence of materials, technology and environment, various particles, organic matters, oxides and residual abrasive particles can not be seen on the surface of wafers. Plasma cleaning is a high-quality process method. On the premise of not damaging the surface properties, thermal properties and electrical properties of the wafer and other materials used, cleaning and removing harmful contaminants from the wafer surface is particularly important for the functionality, reliability and integration of semiconductor devices. Otherwise, they will seriously affect the performance of semiconductor devices, greatly reduce product yield and restrict the further development of semiconductor devices. The basic technical principle of plasma cleaning is as follows: 1, in a sealed vacuum cavity, through constant suction vacuum pump, makes the stress value decreased gradually and vacuum degree enhances unceasingly, the spacing between the molecules is widening, molecular inter-atomic forces, using plasma generator to produce high voltage alternating electric field will Ar, H2 O2, N2, and CF4 gas excitation, the shock formation with high reactivity and high energy of plasma, then react with organic pollutants and micro particle pollution or the formation of volatile substances, by the working gas flow and the vacuum pump will these out volatile substances, so as to achieve the surface cleaning, activation, etching, etc. As shown in the figure below: 2, plasma cleaning will not damage the intrinsic characteristics of materials or products are processed, change only the surface, the thickness of the nano-scale materials or products to be cleaned surface contaminant has been removed, molecular bonds on the extremely small structural changes, forming a certain roughness or is produced on the surface hydrophilicity of functionality, makes the reliability of the metal welding to enhance and improve the bonding force between different material, so as to improve product reliability, stability, prolong the service life of the product. 3. According to the reaction types of semiconductor packaging plasma cleaning, it can be divided into the following three types: A. Physical reaction cleaning: Inert gases such as Ar can be used to easily avoid reaction with other substances, and ions are relatively heavy. Physical bombardment of the material surface can remove pollutants or break the bonds of polymers to form a rough surface of microstructure. Example: Ar+e- →Ar++2e- Ar++ contamination → volatile contamination Ar+ is accelerated to generate kinetic energy under the action of self-bias or external bias, and then bombarded on the surface of the cleaned workpiece placed on the negative electrode. It is generally used to remove oxides, epoxy resin spills or micro-particle pollutants, while carrying out surface activation. B. Cleaning of chemical reaction: Make use of the properties of H2, O2 and other active gases to make them undergo reduction reaction or form active functional groups with multi-bond structure, carry out surface modification and improve hydrophilicity, etc. Example 1: O2+ E - →2O*+ E-O *+ organic matter →CO2+H2O It can be seen from the reaction formula that oxygen plasma can change non-volatile organic compounds into volatile H2O and CO2 through chemical reaction. Example 2: H2+ E - →2H*+ E-h *+ non-volatile metal oxides → metal +H2O It can be seen from the reaction formula that hydrogen plasma can remove the oxide layer on the metal surface through chemical reaction and clean the metal surface. C. Cleaning of physical and chemical reactions: different process gases, such as Ar and H2 mixture, are injected according to needs, with good selectivity, cleanability and uniformity as well as good directivity.

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Application of plasma cleaning machine in electrical industry

Application of plasma cleaning machine in electrical industry

1. Connectors With the development of science and technology, the use of high frequency, rf connector is also more and more, and the interference and consume my problem of the applied electric field also attract attention more, low dielectric constant materials into people's field of vision, such as material such as rubber, PTFE, FVMQ, PEI, because of its low invasive itself to that of the bonding metal needles is difficult, and plasma processing technology can be not influence matrix under the condition of original features, invasive, increase surface roughness, adhesive performance, etc. 2. bush In front of the powder metallurgy sintering process and subsequent electroplating, melt infiltration, etc before treatment, plasma cleaning can be both object, it can handle all kinds of material, metal, semiconductor and oxides, or polymer materials (such as polypropylene, PVC, ptfe, polyimide, polyester, epoxy resins and other polymer) plasma can be used to deal with. Therefore, it is especially suitable for materials that are not resistant to heat and solvent. It can also selectively clean the whole, part or complex structure of the material. 3. sealing glue The plasma treatment of the ignition coil skeleton can not only remove the volatile oil on the surface, but also greatly improve the surface activity of the skeleton, that is, it can improve the adhesion strength between the skeleton and epoxy resin, avoid the formation of bubbles, and improve the welding strength between the enameled wire and the skeleton contact after winding. In this way, the ignition coil performance in the production process has been significantly improved, and the reliability and service life have been improved. Shenzhen Chengfeng zhizhi professional research and development and production of plasma cleaning machine, atmospheric pressure plasma cleaning machine, vacuum plasma cleaning machine, wide-width plasma cleaning machine, green technology, improve product surface adhesion.

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Vacuum plasma equipment cavity size and intake mode effects on uniformity

Vacuum plasma equipment cavity size and intake mode effects on uniformity

There are many factors that affect the uniformity of vacuum plasma cleaning machine, including the size of the cavity, the intake mode, the electrode structure, the power frequency, the gas flow rate, the power size, and so on. Today, the influence of the size of the cavity and the intake mode on the uniformity is discussed, for reference only: 1. the larger the volume of the vacuum plasma cleaning machine chamber, the more difficult to control the uniformity, especially the choice of power to be careful. Sing Fung Intelligent  Manufacturing can be customized according to customer product specifications and output vacuum plasma cleaning machine cavity, can be personalized design. However, if only 13.56mhz RF power is used for the plasma generator, it is recommended to control the RF power within 600L as far as possible. The larger the cavity, the greater the RF power required. Especially if 3000W or above power is used, it is recommended to use American AE, MKS or other imported RF power, which costs relatively high but is stable and reliable. It is recommended to use an intermediate frequency power supply of 40KHz or to control the vacuum chamber within 100L if the product is processed with high uniformity requirements. 2. Sing Fung Intelligent  Manufacturing vacuum plasma cleaning machine intake and exhaust, after testing the uniformity is relatively good. The air inlet pipe inside the cavity is usually made of aluminum tubes, which are bent and welded into a similar square structure, and holes are cut in the middle of two layers of electric plates to ensure that each layer of treatment space has an independent air inlet. The inlet structure of the large-cavity equipment will change, and the specific structure depends on the size of the cavity. What does the above description of the effect of cavity size and intake mode on plasma uniformity inspire you? You have any views or ideas, welcome to leave a message and share with us.

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