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What is a cryogenic plasma

What is a cryogenic plasma

99.9% of the matter in the universe is in a plasma state. Our planet is the exception to the rule. In addition, for plasma in nature, we can also list the sun, ionosphere, auroras, lightning, and so on. In the artificial plasma generation methods, gas discharge method is more simple and efficient than heating method, such as fluorescent lamp, neon lamp, arc welding, corona discharge and so on. The density and temperature values of the various major types of plasma generated naturally and artificially span nearly 20 orders of magnitude from a density of 106 (units/m3) of rarefied interstellar plasma to a density of 1025 of arc discharge plasma. Its temperature distribution ranges from 100K low temperature to 108-109K (100-1 billion degrees) of ultra-high temperature fusion plasma. The electron Volt (ELECTRON Volt) of the temperature axis is a common temperature unit in the plasma field, 1eV=11600K. Plasmas usually contain three kinds of particles: electrons, positive ions and neutral particles (including uncharged particles such as atoms or molecules and atomic groups). Let their densities be ne, Ni,nn respectively. Since the gas is quasi-neutral, the molecular density before ionization is NE ≈ NN. Therefore, we define the ionization degree =ne/(ne+nn) to measure the ionization degree of the plasma. Both the corona and the hot plasma in fusion are 100% ionized, and a plasma like this =1 is called a fully ionized plasma. Ionization degrees greater than 1%(≥10-2) are called strongly ionized plasma, like the flame plasma is mostly neutral particles (<10-3), called weak ionization plasma. If the discharge is carried out under the condition of high pressure close to atmospheric pressure, then electrons, ions and neutral particles will exchange kinetic energy fully through intense collision, so that the plasma reaches the thermal equilibrium state. If the temperature of the electron, ion and neutral particles respectively to Te, Ti, Tn, we put the three particle temperature approximately equal (Te material Ti material Tn) thermal equilibrium plasma called hot plasma, in the actual thermal plasma generator, arc discharge between cathode and anode effect makes the work flow of gas ionization occurs, it is the output of the plasma jet, can be used as a plasma jet, plasma spray flame, etc. On the other hand, low-pressure plasmas below a few hundred palas are often in non-thermal equilibrium. Now, electrons lose almost no energy when they collide with ions or neutral particles, so they have Te, >, >, Ti, Te, >, >, Tn. We call such plasmas cold plasmas. Of course, even at high pressure, the low-temperature plasma can be generated by short pulse discharge modes with no thermal effect, namely corona discharge or arc sliding jet discharge. At present, the glow discharge technology under atmospheric pressure has become a research hotspot in the world. The mechanism of producing non-equilibrium plasma at atmospheric pressure is not clear, and the research on the transport characteristics of plasma at high pressure has just begun, which has formed a new research hotspot.

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Vacuum plasma equipment cavity size and intake mode effects on uniformity

Vacuum plasma equipment cavity size and intake mode effects on uniformity

There are many factors that affect the uniformity of vacuum plasma cleaning machine, including the size of the cavity, the intake mode, the electrode structure, the power frequency, the gas flow rate, the power size, and so on. Today, the influence of the size of the cavity and the intake mode on the uniformity is discussed, for reference only: 1. the larger the volume of the vacuum plasma cleaning machine chamber, the more difficult to control the uniformity, especially the choice of power to be careful. Sing Fung Intelligent  Manufacturing can be customized according to customer product specifications and output vacuum plasma cleaning machine cavity, can be personalized design. However, if only 13.56mhz RF power is used for the plasma generator, it is recommended to control the RF power within 600L as far as possible. The larger the cavity, the greater the RF power required. Especially if 3000W or above power is used, it is recommended to use American AE, MKS or other imported RF power, which costs relatively high but is stable and reliable. It is recommended to use an intermediate frequency power supply of 40KHz or to control the vacuum chamber within 100L if the product is processed with high uniformity requirements. 2. Sing Fung Intelligent  Manufacturing vacuum plasma cleaning machine intake and exhaust, after testing the uniformity is relatively good. The air inlet pipe inside the cavity is usually made of aluminum tubes, which are bent and welded into a similar square structure, and holes are cut in the middle of two layers of electric plates to ensure that each layer of treatment space has an independent air inlet. The inlet structure of the large-cavity equipment will change, and the specific structure depends on the size of the cavity. What does the above description of the effect of cavity size and intake mode on plasma uniformity inspire you? You have any views or ideas, welcome to leave a message and share with us.

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Plasma technology has many applications

Plasma technology has many applications

Plasma is a universal state in the boundless universe. Most of the glowing stars in the universe have very high internal temperatures and pressures, and most of the matter inside these stars is in plasma. Solid, liquid and gaseous materials are found only in dim planets and scattered interstellar matter.      Right around us, we see plasma all the time. It can be found in the tubes of fluorescent and neon lights, and in the blinding electric arcs. In addition, wonderful plasma can be found in the ionosphere around the Earth, in beautiful auroras, flash discharges in the atmosphere, and in the tails of shooting stars.    What is plasma useful for? Oh! It's very versatile. From our daily life to industry medicine, agriculture, environmental protection, military, space, energy, celestial bodies and other aspects, it has a very important application value.      An important study is the reaction between a hot plasma and a controlled thermonuclear fusion: if the lightest element of a substance, such as the isotope deuterium of hydrogen, is used to form a hot plasma at tens of millions of degrees Celsius, then these nuclei will react. The result is a burst of energy that scientists call thermonuclear fusion. The hydrogen bomb is such an explosive thermonuclear fusion reaction. But the hope is that a thermonuclear fusion reaction, which slowly releases energy and generates electricity, will create an "artificial little sun", a goal that has yet to be achieved.      Another important application is that some special chemical elements form a low-temperature plasma with a macroscopic temperature that is not high, but the electron temperature can reach tens of thousands of degrees Celsius. In this case, special chemical reactions take place between substances, so new materials can be developed. For example, a thin layer of titanium nitride is applied to tools such as drills to enhance their strength, solar cells are made, and the surface of an aircraft is coated with a material specially designed to absorb radar waves to avoid radar tracking (i.e. stealth aircraft)... These are called plasma thin film technologies.    In addition, plasma can also be used to remove the sulfur in smoke, use plasma to irradiate seeds to improve the output of crops, the development of large screen plasma TV, the development of plasma rocket engine to Mars and other distant space travel... The applications of plasmas are endless.    Plasma has also received considerable attention in medical procedures, such as the recent popular use of plasma cryoablation for rhinitis, pharyngitis, and snoring. Plasma low temperature melting operation principle is to make the plasma thin layer is formed between the electrodes and the organization, the layer of ions are electric field acceleration, and transfer energy to the organization, at low temperatures (40 oc - 70 oc) open the intercellular molecules combined with the key, in the target tissue cells into carbohydrates and diseased tissue caused by oxide liquefaction ablation, known as the plasma (not heat effect), so as to achieve the effect of target tissue volume reduction, let.

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Plasma cleaner application and effect analysis

Plasma cleaner application and effect analysis

1. Printing and packaging industry Specially for UV, coating, glazing, polymer and other materials surface treatment; Put an end to all kinds of packaging box glue problem (such as toothpaste box, cosmetics box, cigarette box, wine box, electronic toy product box). Improve work efficiency, reduce grinding pollution, eliminate paper powder pollution of box pasting machine, save consumables, save glue cost (just use common water-based environmental glue). 2. Digital industry The shell of mobile phone, notebook and other digital products shall be bonded by spraying, LOGO and decorative strips, and the display screen shall be bonded for durability. Increase the adhesion of the surface treatment, prevent the digital product shell paint and keyboard text fade. 3. Automobile manufacturing industry For all kinds of car doors and Windows rubber seals, interior decoration, car lights, air conditioning outlet device of local spraying; At the same time, it is used to increase the adhesion seal of brake block, wiper, oil seal, instrument panel and engine, which has a great improvement in the process of waterproof, sound insulation and anti-shedding. 4. Hardware industry All kinds of metal steel before spraying, the surface through plasma treatment, enhance the surface adhesion. The sprayed metal extends its service life and is 20 times more resistant to wear than the untreated metal. 5. Plastics Mainly used for spraying and adhesive pretreatment, the surface of the treated product will not lose the paint, the text will not fall off and fade.

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Working principle of plasma generator

Working principle of plasma generator

Plasma generator is used to produce high temperature plasma arc device, mainly composed of anode, cathode and coil components. The anode and cathode components include two electrodes, anode and cathode, which are used to form an arc. A stable large current (280 ~ 350A) is added between the two electrodes. When the cathode advances and contacts the anode, the cathode moves away from the anode to pull arc discharge, and the compressed air between the electrodes is ionized to form a high-temperature plasma. Tubular type plasma spray gun (parallel flow type plasma spray gun) is spun with tangential air into the heater chamber, air heater in high speed rotation, with the radial pressure gradient forward flow of air, the air flow to control the arc heater near the central axis, and stretched, forward movement of the airflow direction consistent with the axis of the arc, and basic parallel to each other, therefore, airflow by electric arc heating time is longer, due to the increase of arc length and arc voltage also increased significantly, under the condition of the same power, arc current reduced accordingly, so as to improve the service life of the electrode.

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Plasma cleaning is widely used in microelectronic packaging

Plasma cleaning is widely used in microelectronic packaging

Abstract: With the development of microelectronic technology, wet cleaning is more and more limited, while dry cleaning can avoid the environmental pollution caused by wet cleaning, and the production rate is also greatly improved. Plasma cleaning has obvious advantages in dry cleaning. This paper mainly introduces the mechanism, type, process characteristics of plasma cleaning and its application in microelectronic packaging process. 1. the introduction Cleaning in the microelectronics industry is a very broad concept that includes any process associated with the removal of contaminants. It usually refers to effectively remove the residual dust, metal ions and organic impurities on the premise of not destroying the material surface characteristics and electrical characteristics. At present, physical and chemical cleaning methods have been widely used, which can be roughly divided into two categories: wet cleaning and dry cleaning. Wet cleaning is still dominant in the current microelectronic cleaning technology. However, from the perspective of environmental impact, raw material consumption and future development, dry cleaning is obviously superior to wet cleaning. Plasma cleaning has been widely used in semiconductor manufacturing, microelectronic packaging, precision machinery and other industries. 2. Plasma cleaning mechanism Plasma is a partially ionized gas, which is the fourth state of matter other than solid, liquid and gas. A plasma consists of electrons, ions, free radicals, photons, and other neutral particles. Because of the existence of active ions such as electrons, ions and free radicals in plasma, it is easy to react with the solid surface. Plasma cleaning technology is characterized by both process base material type of object, can be processing, metal, semiconductor, oxides and most of the polymer materials, such as polypropylene, polyester, polyimide, poly (ethyl chloride, epoxy, and even can well with teflon etc, and can realize the overall and partial cleaning and complex structure. Plasma cleaning also has the following characteristics: easy to adopt numerical control technology, high degree of automation; With high precision control device, the time control precision is very high; Correct plasma cleaning will not produce damage layer on the surface, and the surface quality is guaranteed. As it is carried out in a vacuum, it does not pollute the environment and ensures that the cleaning surface is not contaminated by secondary pollution. 3. Application in packaging process In the production process of microelectronic packaging, due to fingerprinting, flux, various cross contamination, natural oxidation, etc., the surface of devices and materials will form a variety of stains, including organic matter, epoxy resin, photoresist, solder, metal salts, etc. These stains will obviously affect the quality of the packaging process. Using plasma cleaning can easily remove pollution produced in the process of production of the molecular level, ensure the workpiece surface atoms and the attachment materials close contact between atoms, thereby effectively improve the bonding strength, lead to improve chip bonding quality, reduce packaging leak rate, improve the performance of components, yield, and performance. The yield of aluminum wire was increased by 10% and the consistency of the bonding strength was also improved after the plasma cleaning was used in a domestic unit before the bonding. In microelectronic packaging, the choice of plasma cleaning process depends on the subsequent process requirements on the material surface, the original characteristics of the material surface, chemical composition and the nature of pollutants. Gases commonly used in plasma cleaning include argon, oxygen, hydrogen, carbon tetrafluoride and their mixtures. At present, it is widely used in: (1) plasma cleaning of aluminum bonding area (2) plasma cleaning of the substrate welding plate (3) plasma cleaning of copper lead frame (4) plasma cleaning of ceramic packaging before electroplating 4. the conclusion Although wet cleaning plays a dominant role in the current microelectronic packaging production, the environmental and material consumption problems brought by wet cleaning cannot be ignored. As a dry cleaning plasma cleaning has the potential to develop, it can be cleaned regardless of the material type, the cleaning quality is good, and the environmental pollution is small. Plasma cleaning technology has a wide range of applications in microelectronic packaging, mainly used to remove surface pollutants and surface etching, etc. The choice of process depends on the requirements of subsequent process on the surface of the material, the original characteristics of the material surface, chemical composition and surface pollution properties. Introducing plasma cleaning into microelectronic packaging can significantly improve the packaging

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