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Plasma processor green environmental protection process, improve the surface adhesion effect

Plasma processor green environmental protection process, improve the surface adhesion effect

Plasma processor green environmental protection process, improve the surface adhesion effect of surface activation treatment device, the role of surface hydrophilic improvement, surface activation and surface modification tools. Plasma treatment can be applied to a wide variety of materials, including metals, ceramics, composites, glass, connectors, plastics, polymers and biomaterials, as well as surfaces of various geometric shapes. Plasma cleaning machine can be widely used in surface engineering applications, including surface cleaning, surface sterilization, surface activation, surface alteration, surface wettability improvement, surface preparation for adhesion and adhesion, surface chemical modification and surface treatment. Polymers and biomaterials are surface etched and surface activated by activation, grafting and surface coating. Conventional cleaning methods do not remove the film from the surface of the material, leaving a very thin layer of impurities, and solvent cleaning is a typical example of this. The plasma cleaning machine is used to gently and cleanly scrub the surface of a material by bombarding it with plasma. Plasma cleaning will remove invisible oil film, tiny rusts and other contaminants that form on the surface as a result of user contact with outdoor exposure, etc. Moreover, plasma cleaning will leave no residue on the surface. The advantage of plasma cleaning machine is that it can not only clean the dirt on the surface, but also enhance the adhesion of the material surface. For example, the following Polymer cleaning: 1. Surface cleaning of polymer Plasma ablation mechanically removes contaminants by bombarding the surface with high-energy electrons and ions. Plasma surface cleaning removes contaminants that may be present in some processed polymers, unwanted polymer surface coatings, and weak boundary layers. 2. Surface recombination of polymers Inert gases used in plasma ablation break the chemical bonds on the polymer surface leading to the formation of free functional groups on the polymer surface. Free functional groups on the polymer surface rebond to form the original polymer structure, and can also bond to adjacent free functional groups on the same polymer chain, or chain to nearby free functional groups on different polymer chains. Polymer surface structure recombination can improve surface hardness and chemical resistance. 3. Surface modification of polymers Plasma ablation destroys the chemical bonds on the polymer surface, which leads to the formation of free functional groups on the polymer surface. Based on the chemical properties of plasma process gases, these surface free functional groups are connected with atoms or chemical groups in the plasma to form new polymer functional groups, replacing the old surface polymer functional groups. Polymer surface modification can change the chemical properties of the material surface, but the overall properties of the material do not change. 4. Surface coating of polymer Plasma coating is a thin layer of plasma coating formed on the surface of the substrate by the process of gas polymerization. If the production gases used are composed of complex molecules, such as methane, tetraffluorides, and carbon, they will break apart in the plasma to form free functional monomers, which will bond and recombine on the polymer surface to coat the film. The polymer surface coating can significantly change the surface permeability and friction. Ii. Biomaterials 1. Disinfection and sterilization: Plasma disinfection has gained a lot of recognition in the disinfection and sterilization of medical equipment. Plasma treatment has great potential in synchronous cleaning and disinfection of medical devices. Plasma disinfection sterilization is especially suitable for high temperature, chemicals, irradiation, allergic medical appliances or dental implants and equipment cleaning. 2. Improvement of adhesion force Many biomaterials have low surface energy, which makes it difficult to adhere and coat them effectively. Plasma surface activation leads to the formation of surface functional groups that will enhance the surface energy of biomaterials and improve the adhesion of interfaces. 3. Invasive Most untreated biomaterials have very weak wettability (hydrophilicity). Plasma surface treatment can increase or decrease the hydrophilicity of many different biomaterials. Through plasma activation can make the surface hydrophilic, through plasma coating film, can make the surface hydrophobic. 4. Low friction and barrier layers Some materials have high friction coefficients on ester and polymer surfaces, such as polyurethane. Plasma coating has a small friction coefficient, which makes the surface of biomaterial smoother. Plasma coatings can also form a dense barrier layer to reduce the permeability of the liquid or ga

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Basic technical principles of plasma cleaning in semiconductor packaging

Basic technical principles of plasma cleaning in semiconductor packaging

In the production process of semiconductor devices, due to the influence of materials, technology and environment, various particles, organic matters, oxides and residual abrasive particles can not be seen on the surface of wafers. Plasma cleaning is a high-quality process method. On the premise of not damaging the surface properties, thermal properties and electrical properties of the wafer and other materials used, cleaning and removing harmful contaminants from the wafer surface is particularly important for the functionality, reliability and integration of semiconductor devices. Otherwise, they will seriously affect the performance of semiconductor devices, greatly reduce product yield and restrict the further development of semiconductor devices. The basic technical principle of plasma cleaning is as follows: 1, in a sealed vacuum cavity, through constant suction vacuum pump, makes the stress value decreased gradually and vacuum degree enhances unceasingly, the spacing between the molecules is widening, molecular inter-atomic forces, using plasma generator to produce high voltage alternating electric field will Ar, H2 O2, N2, and CF4 gas excitation, the shock formation with high reactivity and high energy of plasma, then react with organic pollutants and micro particle pollution or the formation of volatile substances, by the working gas flow and the vacuum pump will these out volatile substances, so as to achieve the surface cleaning, activation, etching, etc. As shown in the figure below: 2, plasma cleaning will not damage the intrinsic characteristics of materials or products are processed, change only the surface, the thickness of the nano-scale materials or products to be cleaned surface contaminant has been removed, molecular bonds on the extremely small structural changes, forming a certain roughness or is produced on the surface hydrophilicity of functionality, makes the reliability of the metal welding to enhance and improve the bonding force between different material, so as to improve product reliability, stability, prolong the service life of the product. 3. According to the reaction types of semiconductor packaging plasma cleaning, it can be divided into the following three types: A. Physical reaction cleaning: Inert gases such as Ar can be used to easily avoid reaction with other substances, and ions are relatively heavy. Physical bombardment of the material surface can remove pollutants or break the bonds of polymers to form a rough surface of microstructure. Example: Ar+e- →Ar++2e- Ar++ contamination → volatile contamination Ar+ is accelerated to generate kinetic energy under the action of self-bias or external bias, and then bombarded on the surface of the cleaned workpiece placed on the negative electrode. It is generally used to remove oxides, epoxy resin spills or micro-particle pollutants, while carrying out surface activation. B. Cleaning of chemical reaction: Make use of the properties of H2, O2 and other active gases to make them undergo reduction reaction or form active functional groups with multi-bond structure, carry out surface modification and improve hydrophilicity, etc. Example 1: O2+ E - →2O*+ E-O *+ organic matter →CO2+H2O It can be seen from the reaction formula that oxygen plasma can change non-volatile organic compounds into volatile H2O and CO2 through chemical reaction. Example 2: H2+ E - →2H*+ E-h *+ non-volatile metal oxides → metal +H2O It can be seen from the reaction formula that hydrogen plasma can remove the oxide layer on the metal surface through chemical reaction and clean the metal surface. C. Cleaning of physical and chemical reactions: different process gases, such as Ar and H2 mixture, are injected according to needs, with good selectivity, cleanability and uniformity as well as good directivity.

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CRF Sing Fung Intelligent Manufacturing launched a new device -4D intelligent integrated plasma processing system

CRF Sing Fung Intelligent Manufacturing launched a new device -4D intelligent integrated plasma processing system

Plasma is an ionized gaseous substance composed of atoms deprived of some electrons and positive and negative ions generated after the ionization of atomic groups. It exists widely in the universe and is often regarded as the fourth state of matter in addition to solid, liquid and gas. Man-made high density, high temperature superconducting tokamak plasma equipment - all nuclear fusion experimental device, its operation principle is vacuum chamber of the device to join a small amount of hydrogen isotopes deuterium or tritium, producing plasma by similar to the principle of transformer, and then improve the density, temperature, make its fusion reaction, reaction process will produce a great energy.Low density, low temperature plasma equipment is also widely used in industrial production. Depending on the "five actions" of the active particles in the plasma, the bonding, bonding, welding, coating, bonding and removing adhesive effects can be enhanced. The pollutants may be organic matter, epoxy resin, photoresist, oxide, particulate pollutants, etc. Different cleaning processes should be adopted for different pollutants, and different process gases should be selected. What fields can the plasma cleaner be used in? Consumer electronics manufacturing (such as fingerprint module, camera module, headphones diaphragm, mobile phone box, ITO glass, plastic accessories and other mobile phone accessories plasma cleaning in addition to electrostatic printing ink, glass cover modification, ITO glass cleaning, glass cover before spraying AF membrane cleaning), optical instrument, IC, semiconductor, semiconductor packaging (Wire Bonding Surface cleaning of the front welding plate, plasma cleaning before integrated circuit bonding, LED pre-adhesive treatment, LED lead bonding treatment, LED to improve the electroplating effect of the support, LED surface activation before LED packaging and cleaning the processes of COB, COG, COF and ACF before ceramic packaging and electroplating. Used for wire-drawing and pre-welding cleaning), FPC/PCB (PLASMA cleaning of FPC PCB cell phone, removal of glue residue in holes, pre-electroplating activation of Teflon, removal of carbides, removal of board residue, etc.), LCD field, new energy battery field, silicone plastic polymer field, biomedical, automobile manufacturing field, shoe making field. 4D intelligent integrated plasma processing system: Product Overview: A single processing system can carry 2-4 plasma spray guns of various types, full network matching, intelligent integration; With more space saving and more types of applications; With RS485/RS232, start-stop I/O control mode, convenient and fast, reduce cost; It can be used in different situations to meet different products and treatment environment. Product features: In-line can be installed In the production Line of customer equipment to reduce customer input costs; Long service life, low maintenance cost. Application: Mainly used in the electronic industry of mobile phone case printing, coating, dispensing and other pre-treatment, mobile phone screen surface treatment; Surface cleaning of aerospace electrical connectors in the defense industry; General industry screen printing, transfer pre - printing treatment, etc.

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Knowledge of plasma surface treatment technology and plasma oxidation

Knowledge of plasma surface treatment technology and plasma oxidation

Plasma surface treatments that control the appearance of carbon fibers in just a few seconds have been developed. Compared with the existing surface treatment technology of electrolyte and aqueous solution, this new technology greatly simplifies the whole production process and reduces the energy consumption by 50%. Moreover, after plasma treatment, the basic adhesion between fiber and resin was also improved. The use of plasma oxidation technology to produce low-cost, high-quality carbon fiber is already in use in the United States. Compared with the traditional oxidation technology, plasma oxidation technology is three times faster and USES less than one third of the energy. What will happen to the gas if the temperature keeps rising? Scientists tell us that when the atoms that make up the molecule separate and form separate atoms, for example, a nitrogen molecule splits into two nitrogen atoms, a process we call molecular dissociation in a gas. If the temperature is raised further, the electrons in the atom will be stripped away from the atom to form positively charged nuclei and negatively charged electrons, a process known as atomic ionization. The ionization process occurs, and the plasma is formed. Plasma, also known as Plasma, is an ionized gaseous substance composed of positive and negative ions generated by ionized atoms and atomic groups after some electrons have been deprived. It is a macroscopic electroneutral ionized gas whose scale is larger than debby's length. Its motion is mainly controlled by electromagnetic force, and it shows significant collective behavior. Plasma surface treatment technology is widely used in the universe, and is often regarded as the fourth state of matter in addition to solid, liquid and gas, which is called plasma state, or "supergas". Materials in the plasma state have gaseous properties such as good fluidity and diffusivity. However, because the basic components of plasma particles are ions and electrons, it also has many properties different from the gaseous state, such as good electrical conductivity, heat conductivity. In particular, according to scientific calculations, the specific heat capacity of a plasma is proportional to the temperature. At high temperatures, the specific heat capacity of a plasma is often several hundred times that of a gas. The above introduction is chengfeng zhizhi years of plasma technology service experience sharing, if you want to learn about other plasma equipment content, you can call our technical service hotline or online consultation, looking forward to your call.

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Application of plasma cleaning machine in electrical industry

Application of plasma cleaning machine in electrical industry

1. Connectors With the development of science and technology, the use of high frequency, rf connector is also more and more, and the interference and consume my problem of the applied electric field also attract attention more, low dielectric constant materials into people's field of vision, such as material such as rubber, PTFE, FVMQ, PEI, because of its low invasive itself to that of the bonding metal needles is difficult, and plasma processing technology can be not influence matrix under the condition of original features, invasive, increase surface roughness, adhesive performance, etc. 2. bush In front of the powder metallurgy sintering process and subsequent electroplating, melt infiltration, etc before treatment, plasma cleaning can be both object, it can handle all kinds of material, metal, semiconductor and oxides, or polymer materials (such as polypropylene, PVC, ptfe, polyimide, polyester, epoxy resins and other polymer) plasma can be used to deal with. Therefore, it is especially suitable for materials that are not resistant to heat and solvent. It can also selectively clean the whole, part or complex structure of the material. 3. sealing glue The plasma treatment of the ignition coil skeleton can not only remove the volatile oil on the surface, but also greatly improve the surface activity of the skeleton, that is, it can improve the adhesion strength between the skeleton and epoxy resin, avoid the formation of bubbles, and improve the welding strength between the enameled wire and the skeleton contact after winding. In this way, the ignition coil performance in the production process has been significantly improved, and the reliability and service life have been improved. Shenzhen Chengfeng zhizhi professional research and development and production of plasma cleaning machine, atmospheric pressure plasma cleaning machine, vacuum plasma cleaning machine, wide-width plasma cleaning machine, green technology, improve product surface adhesion.

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Plasma cleaning technology

Plasma cleaning technology

Abstract: Environmental pollution control, personnel labor protection, technology application, in the high-density electronic assembly, precision machinery manufacturing, wet cleaning process is increasingly limited, dry cleaning mechanism and application research is increasingly urgent, plasma cleaning technology in dry cleaning obvious advantages. The main content of this paper is the mechanism of plasma cleaning and the process of low-temperature plasma cleaning. 1. An overview of the Electronic industry cleaning is a very broad concept, including any process related to the removal of contaminants, but the method of cleaning varies greatly from object to object. At present, physical and chemical cleaning methods which have been widely used in the electronic industry can be roughly divided into two types: wet cleaning and dry cleaning. Wet washing has been widely used in electronic industry. Cleaning mainly depends on physical and chemical (solvent) actions. Such as in the chemical active agent adsorption, immersion, dissolution, discrete action supplemented by ultrasonic, spray, rotation, boiling, steam, shaking and other physical action to remove stains, these methods of cleaning function and application range are different, cleaning effect is also different. With the further development of electronic assembly technology and precision machinery manufacturing, higher and higher requirements are put forward for cleaning technology. The cost of wet cleaning is increasing due to the great environmental pollution. Comparatively speaking, dry cleaning has great advantages, especially the cleaning technology based on plasma technology has been gradually applied in semiconductor, electronic assembly, compact machinery and other industries. Therefore, it is necessary to understand the mechanism of plasma cleaning and its application process. 2. Plasma cleaning mechanism Plasma technology, beginning in the 1960 s application in the chemical synthesis, membrane preparation, surface treatment and fine chemical industry and other fields, in large or very large scale integrated circuit technology dry, low temperature, is also developing in recent years the application of plasma polymerization, plasma etching and plasma ashing and dry process technology such as plasma anodic oxidation. Plasma cleaning technology is also one of the progress of drying process. Different from wet cleaning, the mechanism of plasma cleaning relies on the "activation action" of the material in the "plasma state" to remove the object surface stains. From the point of view of various cleaning methods, plasma cleaning is one of the top cleaning methods. Plasma cleaning technology is characterized by both process base material type of object, can be processed, such as metal, semiconductor and oxides and most of the polymer materials (such as polypropylene, polyester, polyimide, poly (ethyl chloride, epoxy, teflon), such as the original base material can handle very well and can realize the overall and partial cleaning and complex structure. One of the important roles of cleaning is to improve the adhesion of the film. For example, Au film was deposited on the Si lining low, and the surface hydrocarbons and other pollution were treated by Ar plasma, which significantly improved the adhesion of Au. After plasma treatment, the matrix surface will leave a layer of gray material containing fluoride, which can be removed with solution. At the same time, it is beneficial to improve surface adhesion and wettability. Free radicals formed by plasma surface activation in the cleaning process can further form specific functional groups, and the introduction of such specific functional groups, especially oxygen-containing functional groups, plays an obvious role in improving the adhesion and wettability of materials. Conventional chemical cleaning in plasma processes has several advantages. Plasmas provide a low temperature environment because they use electrical energy to catalyze chemical reactions rather than heat. Plasma eliminates the danger from wet chemical cleaning and has the advantage over other cleaning methods that there is no waste liquid after cleaning. In short, the plasma process is a simple cleaning process that requires almost no management.

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