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The plasma processor has been used for many years. Do you understand the cleaning of the plasma processor

The plasma processor has been used for many years. Do you understand the cleaning of the plasma processor

Plasma is a state of being of matter, usually in three states: solid, liquid, and gas, but in some special cases, it may also exist in a fourth state, for example, material from the surface of the sun, and material from the ionosphere of the earth's atmosphere. This kind of material in the state is called the plasma state, which is the fourth state of matter, said so much do not know whether to have a general understanding of the plasma in the plasma processor cleaning. The technology of plasma processor, which originated in the early 20th century, has been used more and more widely with the rapid development of high and new technology. The cleaning of plasma processor mainly relies on the "activation effect" of active particles in plasma to achieve the purpose of removing stains on the surface of objects. In terms of mechanism, plasma cleaning generally includes the following processes: inorganic gases are excited in plasma state; Gas phase material adsorbed on solid surface; Adsorptive groups react with solid surface molecules to form product molecules; The gas phase is formed by molecular resolution of the product. Reaction residue off the surface. Plasma processor cleaning technology is characterized by both process base material type of object, all can handle, for metal, semiconductor and oxides and most of the polymer materials, such as polypropylene, polyester, polyimide, poly (ethyl chloride, epoxy, ptfe, even can handle very well, and can be comprehensive, localized, and cleaning of complex structure. With the development of science and technology, the more sophisticated the better the various equipment, the higher the requirements for cleaning, especially in the chip manufacturing, image and display and other fields, such as mobile phone camera, chip, capacitor screen, flexible screen, etc., the higher the requirements for the cleaning of trace pollutants on the surface, even can not remain nanometer particles. Because the volume of pollutants is small and the composition is complex, the general surface requirements will not have organic residues, which can better reflect the role of the plasma processor cleaning machine. The plasma generated by the plasma processor cleaning machine can break the molecular chain of organic pollutants, so that the elements in the molecular structure are separated from the matrix, the separated elements react with the free radicals in the plasma, and the molecules are reorganized to form harmless gas emissions, so as to realize the surface cleaning.

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Risk control methods required in the application of vacuum low-temperature plasma processor

Risk control methods required in the application of vacuum low-temperature plasma processor

Vacuum cryogenic plasma processor is a new high-tech technology. By injecting enough energy into the gas, the gas can be separated into plasma state. The "activation" of the active ions in the plasma is used to remove the stains on the surface of the object. The vacuum low-temperature plasma processor is connected to a vacuum pump. During the cleaning process, the plasma in the cleaning room is cleaned to clean the surface of the object. Short-time cleaning can completely clean organic matter, pollutants can be removed by vacuum pump, cleaning degree can reach the molecular level. It can effectively avoid the secondary pollution of the liquid cleaning medium to the object to be cleaned. In the process of application, there should be a certain sense of risk control. 1. The following are the risks of vacuum low-temperature plasma processor: (1) Leakage risk of cleaning medium: The cleaning medium is usually gas, and a gas cylinder is often used and delivered to equipment that passes through a pipe. Leakage of pipes and gas equipment may cause accidents if cylinders or gas charges leak. If hydrogen, methane and other flammable and explosive gases are used, fire and explosion accidents may occur in the room with open fire and static electricity. If argon gas is used, it may cause poor ventilation in the room and cause asphyxiation accidents. Accident: If oxygen is used, oxygen is an oxidizing gas that can increase combustible material. If there is too much oxygen in the room, a fire may occur. (2) Risk of electric shock: Electrical insulation failure due to failure, aging, corrosion, mechanical damage, etc. The leakage protection device is not installed or the leakage protection device fails. 2. Control methods of vacuum low-temperature plasma processor: (1) Fire, explosion and asphyxiation measures: standardize the use of gas cylinders, gas cylinder accessories should be complete, and there are measures to prevent dumping. Cylinders should be tested periodically to ensure that they are within their validity period. The air supply pipeline is firmly connected with the air supply equipment. If oxygen is used, cylinders, joints, pressure reducers, hoses and equipment must be isolated from oil, grease and other flammable and explosive substances. Do not touch oxygen cylinders or oxygen devices with oily hands or gloves. If hydrogen is used, it is recommended to install a hydrogen leak alarm device near the equipment being used. (2) maintain indoor air circulation. If ventilation is poor, install a mechanical exhaust device. (3) Anti-electric shock measures, equipment must be grounded, power cord must be free from damage, no aging phenomenon.

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What is the white smoke caused by domestic plasma surface treatment machine

What is the white smoke caused by domestic plasma surface treatment machine

In the aviation, aerospace and electronics industry, domestic plasma surface processor has a wide range of applications, such as the bonding of high polymer materials or metal, plastic components electroplating, metal or non-metal materials potting pretreatment, etc.. It can replace the traditional process, improve the treatment effect and accelerate the production speed. What is the cause of the white smoke from the domestic plasma surface treatment machine? Plasma surface treatment machine in line with the electrical work standard, according to the needs of the actual use of users, silicone resin, epoxy plastics and other polymers and metal materials for a reasonable ratio of parameters, so that it can meet the requirements of users. Some users said that after 40 minutes of cleaning of about 20nm thick polymer by domestic ion surface treatment machine, a stream of white smoke came out of the reaction chamber. Fumes are irritating and toxic. It was first confirmed that the white fumes were coming out of the reaction chamber and not from the ion surface treatment itself. Whether there is white oxygen in the ion surface treatment case, if so, make sure that when the ion surface treatment case is in the boot state, the vacuum pump is off, the reaction chamber is open, and there is no sample, if so, there is an electronic fault, and there may be electronic components burned out. Otherwise, other problems may arise. Assuming the electronics are intact, if the washer and vacuum pump are turned on and the sample is not placed in the engine room there is white smoke? If white smoke is still coming out, it may be due to dirt on the reaction compartment and door walls that needs to be removed with isopropyl alcohol or a similar detergent. If the domestic ion surface treatment machine runs under the vacuum state and produces plasma, then any gas or dirt will sweep the reaction chamber; Vacuum tubes, vacuum vents have flue gas, which is produced by pumping air rather than by the plasma cleaner itself. If you see white flue gas in the exhaust port of the vacuum pump, it may be the oil mist discharged from the pump, which has nothing to do with the ion surface treatment machine itself. This problem can be solved by replacing the appropriate oil mist filter. The actual processing process is complex and changeable, non-professionals do not operate easily, more plasma equipment detailed information solutions are welcome to inquire.

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Advantages and applications of vacuum plasma equipment

Advantages and applications of vacuum plasma equipment

PLC touch screen is used to control vacuum plasma equipment, which can accurately control the operation of the equipment. Low maintenance and repair costs, convenient for customers to save costs. High precision, fast response, good control, compatibility, perfect function and professional technical support. Vacuum plasma equipment is mainly used in biomedicine, printed circuit boards, semiconductor IC, silica gel, plastics, polymers, automotive electronics, aviation and other industries. In addition to the cleaning function, the vacuum plasma equipment can also change the surface properties of some materials according to the needs. During the cleaning process, the glow discharge of the vacuum plasma equipment can enhance the adhesion, compatibility and wettability of these materials. It is a kind of non-destructive cleaning equipment, using low-pressure excited plasma as the cleaning medium, effectively avoiding the secondary pollution of the liquid cleaning medium to be cleaned. The equipment can remove grease, grease and other organic substances and oxide layer on metal surface, and can also be used for plastic and paint pretreatment in automobile production process. It can also be used in hydrophilic, hydrophobic and surface modification of textile, filter screen and membrane. It can also be used in hydrophilic, copulation and coating pretreatment of biomedical petri dishes, vascular scaffolds, syringes, catheters and various materials. Vacuum plasma equipment can be used for surface coating pretreatment of aerospace insulating materials, electronic components, as well as cleaning and etching of circuit boards. The non-oxidation and activation treatment of film, polypropylene and other materials improves the welding performance. In the semiconductor industry, it can be used for wafer processing and processing, removal of lithographic film, pretreatment before packaging, and pretreatment before cleaning and packaging of LED bracket. Precision cleaning in semiconductor, microelectronics, COG, LCD, LCM and LED process, device packaging, vacuum electronics, connectors, relays, solar photovoltaic and other industries, as well as plastic, rubber, metal and ceramic surface cleaning, etching, ash, activation and life science experiments and other fields. The above introduction is the advantages and applications of vacuum plasma equipment, hope to help you, if you want to know more information about vacuum plasma equipment, welcome to consult online or call our company service, we will wholeheartedly provide you with quality service.

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Performance introduction and practical application of vacuum plasma cleaning machine

Performance introduction and practical application of vacuum plasma cleaning machine

The new type of vacuum plasma cleaning machine has the characteristics of stable performance, high cost performance, simple operation, very low use cost, easy maintenance and so on. Super-lapping modifies metal, ceramic, glass, silicon wafer, plastic and other surfaces with various geometric shapes and different surface roughness, completely removing all organic contaminants on the sample surface. Vacuum plasma cleaning function to clean semiconductor components: optical components, electronic components, semiconductor components, laser devices, coating substrates, terminal devices, etc. At the same time, it can also clean optical lenses: clean various lenses and glass slides, such as optical lenses and electron microscope slides. At the same time, the vacuum plasma cleaning machine can also remove oxides: the removal of optical components, semiconductor components and other surface photoresists, the removal of metal material surface oxides. Microchips: biochips, microfluidic chips, and gel deposition substrates can also be cleaned using a vacuum plasma cleaner. The use of vacuum plasma cleaning machine can improve the bonding properties of adhesives: improve the bonding properties of optical components, optical fibers, biomedical materials, aerospace materials, etc. At the same time, in the aspect of coating can also be applied to: the modification and activation of the surface of glass, plastics, ceramics, polymers and other materials, enhance the surface adhesion, wettability and compatibility, significantly improve the quality of coating. The device can also be used in the dental field to pretreat the surface of titanium dental implants and to treat the surface of silicon molded materials to improve wettability and compatibility. In the medical field, vacuum plasma cleaners can also be used to pretreat the surfaces of plant and biomaterials during surgery to improve their wettability, adhesion and compatibility. Using plasma bombardment technology, the vacuum plasma cleaner etches, activates and cleaves surfaces. The welding strength can be improved obviously by bonding the surface. At present, vacuum plasma cleaning machine system has been widely used in liquid crystal display, LED, integrated circuit, printed circuit board, surface mount, BGA, lead frame, flat panel display and other fields. Vacuum plasma cleaning of integrated circuits can obviously improve the strength of welding wires and reduce the possibility of circuit failure. After contacting the plasma, the photoresist, resin, solvent residue and other organic pollutants can be removed in a short time. Printed board manufacturers use vacuum plasma cleaning machines to decontaminate and etch to remove insulating layers from boreholes. For many products, whether they are used in industry or not, reliability in electronics, aviation, health care and other industries depends on the strength of the bond between the surfaces. Whether it is metal, ceramic, polymer, plastic or their composite surface, plasma has the ability to improve the adhesion and improve the quality of products.

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Cause analysis of poor vacuum plasma cleaning equipment effect

Cause analysis of poor vacuum plasma cleaning equipment effect

The vacuum plasma cleaning equipment relies on the high-energy particle flow of specific substances in the plasma to wash the surface of the object, and produces physical washing (such as argon plasma) or chemical reaction (oxygen plasma) to achieve the function of removing dirt on the surface of the object. Currently, plasma cleaning systems are designed to produce plasma by lowering the pressure in the reaction chamber and then introducing a suitable gas and starting power at a certain rate. Therefore, what is the reason for the poor effect of vacuum plasma cleaning equipment? Let's analyze it together. 1. Influence of electrode on cleaning effect of vacuum plasma cleaning equipment: The design of the electrode directly affects the cleaning effect of the vacuum plasma cleaning equipment, mainly including the material, layout and size of the electrode. For the internal electrode plasma cleaning system, because the electrode is in contact with the plasma, the electrode of some materials will be corroded or sputtered by some plasma, causing unnecessary pollution, changing the electrode size, and affecting the stability of the plasma cleaning system. The arrangement of electrodes has an important effect on the cleaning speed and homogeneity of plasma. A smaller electrode spacing confines the plasma to a narrower area, resulting in a higher density and faster cleaning. With the increase of interval, the cleaning rate decreases gradually, but the uniformity increases gradually. The size of the electrode in the plasma system determines the total capacity of the system. In plasma cleaning systems, the electrodes are distributed in parallel and are usually used as pallets. Larger electrodes can clean more parts at one time, improving the efficiency of equipment operation.   2. Influence of working pressure on cleaning effect of vacuum plasma cleaning equipment: The working pressure is an important parameter of vacuum plasma cleaning equipment. Pressurization means that the density of the plasma increases and the average energy level of the particles decreases. The increase of density can significantly improve the cleaning speed of plasma system for chemical-based plasmas, while the effect is not obvious for physical-based plasmas. In addition, the change of pressure will also lead to the change of the plasma cleaning reaction mechanism. For example, CF4/O2 plasma is used in silicon wafer etching process, which plays a leading role under low pressure. With the increase of pressure, chemical etching gradually strengthens and gradually occupies the dominant position.   3. Influence of power supply power and frequency on cleaning effect of vacuum plasma cleaning equipment: The power supply will affect a variety of plasma parameters, such as electrode temperature, generated self-bias and cleaning efficiency. The plasma cleaning speed increases with the increase of the output power and reaches the peak gradually, while the self-bias voltage increases with the increase of the output power. In the process of plasma self-biasing, frequency is an important parameter, and the power range is basically unchanged. With the increase of frequency, the effect of self-biasing is gradually weakened. Moreover, with the increase of frequency, the electron density in the plasma increases gradually, and the mean energy level decreases gradually.   4. The influence of the choice of working gas on the cleaning effect of vacuum plasma cleaning equipment: In the process design of vacuum plasma cleaning equipment, the choice of process gas is the key. Although most gases or mixtures of gases can remove contaminants in many cases, the rate of purification can vary and can be tens of times higher. For example, different proportions of sulfur fluoride (SF6) are added to oxygen (O2) as a process gas to clean the plexiglass. Reasonable selection of process gas can greatly improve the cleaning speed.

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