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Photovoltaic plasma equipment Application of photovoltaic cell to produce plasma

Photovoltaic plasma equipment Application of photovoltaic cell to produce plasma

Plasma equipment used in photovoltaic batteries can be ion cleaning, etching, plasma plating, plasma coating, plasma ash, surface activation, modification and other occasions, the material processing, can improve the wetting ability of the material, enhance the bonding force, bonding force, while removing organic matter, oil or grease. In order to ensure the product quality and meet the technical requirements in the production process of photovoltaic cell modules, plasma treatment is carried out on the backboard materials and junction boxes required by photovoltaic cell modules to ensure that the bonding force meets the specification requirements. At present, the manufacturing of photovoltaic module plasma processing is mainly manually operated, which is time-consuming and laborious. Moreover, the distance between the plasma gun head and the back panel cannot be accurately controlled, which is easy to cause damage to the back panel. Photovoltaic back-shelf plasma automation reconstruction refers to the current edge scanning device is installed above the workbench converted into superposed assembly line, the control mode from artificial start to automatic control, and docking with the assembly line implementation component in place after the plasma processor automatically start to plasma processing component adhesive junction box area, drive plasma processor spear in reciprocating feed component junction box area scanning process, after the completion of the automatic stack storage. The specific process is as follows: the flow direction of the line body is from left to right; The product flows from the connection with the upper station and is sent to the lower part of the robot along with the conveying drag chain line. After the product is blocked, the conveying drag chain line stops conveying; The positioning cylinder jacks and positions the product; The transmission line PLC outputs the completed positioning signal to the robot. After the robot receives the positioning signal, it runs to carry out the elliptical plane trajectory of the product and complete the processing of the product surface. After the robot outputs the signal of the completed track to the conveying line PLC, the conveying line runs again and sends the finished surface products to the next station. The bottom plate automatic plasma scanning is carried out by stepping motor of Siemens PLC200 controlling X axis and Y axis, which drives the bottom plate gun in the junction box area of the bottom plate of the plasma processor (the area is 150*150MM) to carry out reciprocating feed scanning. Feed 40MM each time, feed 3 times, reciprocating 4 times, scanning length 150MM. Return to the origin and prepare for the next scan. The main function of the junction box is to connect the electricity generated by the photovoltaic cell to the outside line. The leading wire inside the component is connected with the inner wire in the junction box, and the inner wire is connected with the external cable, so that the component is communicated with the external cable. The connecting box is bonded to the bottom plate of the assembly by silica gel. In order to increase the bonding force between the assembly and the bottom plate, plasma treatment is usually required at the bonding area. The high frequency plasma generator is connected with the plasma generator through a flexible conduit. The high frequency plasma generator is mounted on a smooth rail bar arranged above the worktable, and a longitudinal strip-shaped work piece rail is arranged in the central position of the upper part of the worktable. The PC controller is connected with the hand-controlled switch, the high-frequency plasma generator and the workbench. Based on the single chip microcomputer, the trajectory of X axis and Y axis is set, and the working parts track of the plasma generator and the workbench is synchronously controlled to realize the plasma automatic scanning of the wire box. The results of plasma scanning were effectively improved through automation: the improved plasma treatment was about 59 dynes, compared with about 38 dynes for manual scanning (the dyne value varies with different products). The surface tension of the junction box is increased, so as to improve the binding strength of the junction box and the back plate, so that the bearing tension of the junction box is increased from 110N to 158N. Dry and wet insulation test, protection grade test, freezing test and humidity and heat test were carried out on the modified components, all of which met the test standards. Increase the precision of plasma treatment by mechanical positioning, and reduce the backplate scald. Before the transformation, the number of backboard scald defective products was reduced from the original 5 to 0, which realized the zero manufacturing of backboard scald defective products. After the transformation of

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Plasma surface processor on the circuit board can be used to play what functions

Plasma surface processor on the circuit board can be used to play what functions

Plasma surface treatment machine uses plasma to treat material surface, which achieves the effect that the conventional surface treatment method can not achieve. The "active" components of plasma include ions, electrons, atoms, activated groups, excited states (metastable states), and photons. The plasma surface treatment machine uses the properties of these active components to treat the sample surface, so as to achieve the functional purposes of cleaning and surface activation. At present, the plasma surface processor has also been widely used in the circuit board. The following list of the role of the plasma surface processor in the circuit board: 1. The hole wall is concave after drilling, and the drilling dirt on the hole wall is removed. 2. Carbides produced by laser drilling of blind holes are removed. 3. When fine wire making, remove dry film residue. 4. Activation of pore wall before copper deposition in polytetrafluoroethylene. 5. Surface activation of laminates before lamination. 6. Clean up before sinking gold. 7. Activation of the surface before applying dry film and solder resistance film.

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Plasma surface treatment of polymer Plasma polymer modification method

Plasma surface treatment of polymer Plasma polymer modification method

In the use of plastic film, rubber, fiber fabric and other solid polymer materials, the properties of the material is not only related to its volume performance, the surface performance of the material also accounts for a considerable proportion. For example, it involves adhesion, friction, surface hardness and so on. Therefore, in order to meet the requirements of modern society for multi-functional materials, the surface modification of materials is often carried out. A new dry modification method, plasma-polymer modification, is introduced. Plasma is excited by the high energy received by some gaseous material. It is composed of electrons, ions, atoms, molecules, free radicals and photons. It is generally electrically neutral. Plasma is the state in which all kinds of matter exist, at the same level as solids, liquids, and gases. Some people call plasma the fourth state of matter. So how does plasma-polymer modification interact with the surface of polymer materials? The experiment was carried out with surface hydrophobic polyester film and treated with argon plasma for 5 minutes. The contact Angle of water was 100° after removal and 70° after standing for one day. Why is the film becoming more hydrophilic? This is because the surface of general polymer materials after NH4, O2, H2, N2, Ar will be excited to produce a variety of free radicals. After treatment, free radicals will quickly react with oxygen in the air to generate polar groups such as carboxyl group, hydroxyl group and amino group. Thereby increasing the hydrophilicity of its surface. Among these gases, inert gases such as hydrogen, nitrogen, and argon are non-reactive plasmas, while ammonia and oxygen plasmas are reactive plasmas. The so-called non-reactive type refers to the free radicals and ions in the plasma do not react with the surface of the material, but only play the role of excitation free energy. The material needs to contact with the air, thus causing changes in the surface chemical structure. Reactivity refers to the free radicals or ions in the plasma directly interact with the surface of the material and connect into new functional groups. The adhesion of polymer materials can be improved by the hydrophilic modification of plasma. For example, the surface tension of polyurethane composite adhesive is high, and the surface polarity of PP, PE and other plastic films is low, so the surface polarity of polyurethane adhesive can be improved by surface treatment modification of plastic film, and it can be well spread on the surface of plastic film, thus greatly improving the adhesion. In addition, it is not difficult for us to think that if fluorine gas is used to stimulate plasma surface treatment of materials, will the surface polarity of materials be reduced? Yes, for example, some hydrophilic fiber fabrics, after gasification of carbon tetrafluorocarbon (CF4) and difluoromethane (CH2F2) treatment, hydrophobic obvious. But research has found that this is true, meaning that hydrophobicity disappears after a while. According to the analysis, this is the result of the deposition of fluorine-containing groups on the surface. Fluorine gas is excited into plasma, and then partially adsorbed on the fabric surface, resulting in hydrophobic effect. The longer the treatment time is, the more gas is introduced and the more hydrophobic the surface is. But after a period of use, the modification effect wears off because the fluorine-containing components are not chemically bonded to the surface of the fabric, which is usually the result of physical adsorption. In addition to the hydrophilic and hydrophobic surface modification of plasma surface treatment, there is another basic and obvious function of plasma -- etching. Photoresist is a common example and has been used in practical production. The typical application of etching in polymer materials is to increase the printability of the fabric. Some inert gases, such as argon, helium and high molecular weight gases, are excited into plasmas and bombarded the surface of the fibers, which greatly increases the surface roughness, destroys the crystalline phase, loosens the surface structure, and increases the micro-clearance, thus increasing the accessible area of the dyes. Of course, another convenience is to introduce polar groups on the fiber surface at the same time, which increases the adsorption force with the dye molecules. These plasma-polymer modifications are sufficient to greatly improve the dyeability of the fabric.

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The difference between different frequency excitation plasma of plasma processor

The difference between different frequency excitation plasma of plasma processor

The density and excitation frequency of plasma are as follows: Nc = 1.2425 x 108 v2 Where, Nc is plasma density (cm-3) and V is excitation frequency (Hz). There are three common excitation frequencies of plasma: ultrasonic plasma excitation frequency is 40kHz, RF plasma processor plasma excitation frequency is 13.56MHz, microwave plasma excitation frequency is 2.45GHz. Various plasmas produce different self-bias voltages. The self-bias voltage of ultrasonic plasma is about 1000V, that of RF plasma processor is about 250V, and that of microwave plasma is very low, only dozens of volts. Moreover, the three kinds of plasma have different mechanisms of action. The reaction of ultrasonic plasma is physical reaction, the reaction of radio frequency plasma processor plasma is physical and chemical reaction, the reaction of microwave plasma is chemical reaction. Because of the great influence of ultrasonic plasma on the surface to be cleaned, RF plasma cleaning and microwave plasma cleaning are mostly used in the actual production of semiconductor cleaning activation bonding.

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Application of low-temperature plasma technology in environmental governance

Application of low-temperature plasma technology in environmental governance

With the development of economy, the problem of environmental pollution is becoming more and more prominent. Various forms of environmental pollution emerge one after another, seriously endangering human health and survival. To deal with environmental problems is the urgent need of human being's own security. In recent years, there have been many new and high technologies to deal with environmental problems worldwide, such as ultrasonic wave, photocatalytic oxidation, plasma, reverse osmosis, etc., among which, low-temperature plasma technology, as a new environmental protection technology with high efficiency, low consumption, high processing capacity and easy operation, has become a research hotspot at home and abroad in recent years. In the ultrafine powder production, the waste gas processing, metallurgical refining, corrosion and material surface treatment, ozone production and other fields, the low temperature plasma technology has been widely used in industrial applications, with low temperature plasma processing environment governance applied to the study of organic pollutants in waste gas and waste water, but this aspect of the current techniques are not mature industrialized scale. 1. Definition and characteristics of low-temperature plasma. Plasma is a kind of ionized gas with ionization degree greater than 0.1% and equal positive and negative charges. It is composed of electrons, ions, neutral atoms, excited state atoms, photons and free radicals. The number of charges of electrons and positive ions is equal. Generally, it is electrically neutral, which is different from the three states of matter (solid, liquid and gas), and it is the fourth form of material existence. Its main features are: (1) There is no net Coulomb force between charged particles; (2) is an excellent conductive fluid, using this characteristic can produce magnetic fluid power generation; (3) Charged particles without net magnetic force; (4) Ionized gas has a certain influence on temperature. It is generally believed that low temperature plasma equipment can be divided into high temperature plasma and low temperature plasma according to the energy state, temperature and ion density of the system. The ionization degree of the former type is close to 1, the temperature of each particle is basically the same, the system is in a thermodynamic unbalanced state, the temperature is generally more than 5×104K, and it is mainly used to study the controlled thermonuclear reaction. The latter kind of particles have different temperatures, the temperature of electrons is much higher than that of ions, the system is in a thermodynamic unbalanced state, and the macroscopic temperature is low. Generally, the plasma generated by gas discharge belongs to this kind, which is closely related to modern industrial production. 2. Low-temperature plasma pollution reduction mechanism, the energy transfer of plasma surface processor in the process of plasma chemical reaction, the energy transfer of plasma chemical reaction is roughly as follows: (1) Combination of electric field + electron → high-energy electron; (2) high energy electron + molecule (or atom)→ active group (excited atom, excited group, free group); (3) active group + molecule (atom)→ product + heat; (4) active group + active group → product + heat. From the above process, it can be seen that electrons obtain energy from the electric field, and the molecules or atoms that obtain energy are excited, and the energy is transferred to the molecules or atoms through excitation or ionization. At the same time, some molecules are ionized to form active groups. These active groups then collide with molecules or atoms, active groups and active groups to produce a stable product and heat. In addition, the electrons of halogen and oxygen can also be compatible with high-energy electrons.

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Plasma processor manufacturers for you to introduce the factors affecting the bond strength of adhesives

Plasma processor manufacturers for you to introduce the factors affecting the bond strength of adhesives

As we all know, if you want a more simple and quick way to obtain bonding strength, you can use plasma processor to treat the surface of the material to increase the bonding ability. What are the influencing factors of adhesive bonding strength in the actual production process? CRF plasma processor manufacturers will give you a look together. After the adhesive and curing agent are determined to form BD series composite coating, the cold welding bonding strength is mainly related to the amount of powder, curing agent and toughening agent in the composition. In addition, the construction technology, matrix material, surface roughness and cleanliness also have a great influence on the cold welding bonding strength. 1. Influence of powder addition amount: The proper addition of powdery filler can reduce shrinkage and eliminate internal defects, thus improving the bonding strength of the coating. However, the increase of the amount of powder added will reduce the adhesion of the adhesive material, thus reducing the bonding strength. 2. is the influence of the amount of curing agent added: Insufficient amount of addition, incomplete curing; The coating brittleness increases with the addition of too large amount, and the residual curing agent reduces the coating performance. Therefore, in the development of cold welding composite materials, it is necessary to accurately calculate the number of adding curing agent, BD series composite coating sales, has been prepared according to the proportion of curing agent, the user can according to the product specification of the proportion of calculation and weighing to add, without doing tedious calculation. 3.affect other factors: The addition of coupling agent can improve the bond strength, but the addition of defoaming agent, anti-aging agent and accelerator can only reduce the bond strength, so it must be strictly controlled. In addition, a certain roughness of the workpiece surface and the necessary cleanliness can improve the bond strength, on the contrary, the surface with oil or rust will make the bond strength seriously decreased, and even lead to failure. In order to improve the bonding strength, the following points should be noted: (1) The actual bonding area of the coarse surface is large, which is conducive to improving the bonding strength and machining the large tooth surface; BBD series adhesive curing agent adding proportion must be accurate, that is, must be strictly weighed in accordance with the proportion specified in the product manual, adding too much or too little will affect the adhesive strength. (2) BD series adhesive A, B two components must be mixed very evenly, the color should be consistent. (3) The surface of the matrix metal should be as clean as possible, and there should be no oil stains or rust by all means. (4) The environmental temperature of the construction is above 10℃, and the environmental temperature below 5℃ is not suitable for construction. In the process of construction, the bottom layer must be repeatedly scraped and coated to make the adhesive fully infiltrate the bottom surface. BD series of industrial adhesives at room temperature curing reaction is slow, can improve the curing temperature, when the conditions can be used 60~80 curing, coating generally 4~6h can be completely cured. The bonding strength between coating and substrate increases gradually after curing and continues to increase after putting into use.

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